专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06836022B2 High voltage flip-chip component package and method for forming the same 有权
标题翻译：高压倒装芯片封装及其形成方法
公开(公告)号：US06836022B2
公开(公告)日：2004-12-28
申请号：US10365765
申请日：2003-02-13
申请人： Mark R. Boone , Andreas A. Fenner , Juan G. Milla , Lary R. Larson
发明人： Mark R. Boone , Andreas A. Fenner , Juan G. Milla , Lary R. Larson
IPC分类号： H01L2348
CPC分类号： H01L23/552 , H01L21/563 , H01L23/585 , H01L29/0619 , H01L2224/16 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13091 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： A flip-chip package comprises a substrate having at least one layer and a component flip-chip mounted to the substrate, the component having a field termination ring. The flip-chip package further comprises a shield plane interposed between the at least one layer of substrate and the field termination ring.
摘要翻译：倒装芯片封装包括具有至少一个层的衬底和安装到衬底的部件倒装芯片，该部件具有场终端环。倒装芯片封装还包括插入在至少一层衬底和场终端环之间的屏蔽平面。

2. 发明授权

US07142921B2 Single axis accelerometer and method therefore 有权
标题翻译：单轴加速度计和方法因此
公开(公告)号：US07142921B2
公开(公告)日：2006-11-28
申请号：US10732990
申请日：2003-12-11
申请人： Michael F. Mattes , Ralph B. Danzl , Andreas A. Fenner , Lary R. Larson
发明人： Michael F. Mattes , Ralph B. Danzl , Andreas A. Fenner , Lary R. Larson
IPC分类号： A61N1/362
CPC分类号： G01P15/125 , A61N1/36542 , G01P15/0802 , G01P2015/0828
摘要： Methods and apparatus are provided for an accelerometer. The apparatus includes first, second, and third substrates. The first substrate includes the first plate of a first capacitor. The second substrate includes a moveable mass that is coupled to the second substrate by at least one spring. The moveable mass is the second plate of the first capacitor and the first plate of a second capacitor. The third substrate includes the second plate of the second capacitor. The moveable mass is prevented from moving in any direction where the at least one spring is inelastically flexed. The first substrate couples to the second substrate. The third substrate couples to the second substrate. The method includes forming a moveable mass in a substrate. The moveable mass is formed having a plurality of springs coupling the moveable mass to the substrate. The moveable mass is released using a dry etch.
摘要翻译：为加速度计提供了方法和装置。该装置包括第一，第二和第三基板。第一基板包括第一电容器的第一板。第二基板包括通过至少一个弹簧联接到第二基板的可移动质量块。可移动质量是第一电容器的第二板和第二电容器的第一板。第三基板包括第二电容器的第二板。防止可移动质量块在至少一个弹簧非弹性弯曲的任何方向上移动。第一衬底耦合到第二衬底。第三衬底耦合到第二衬底。该方法包括在基板中形成可移动质量块。可移动质量体形成有多个弹簧，将弹性体联接到基底上。使用干蚀刻释放可移动质量。

3. 发明授权

US06627917B1 Method and apparatus for wafer-level burn-in 失效
标题翻译：晶圆级老化的方法和装置
公开(公告)号：US06627917B1
公开(公告)日：2003-09-30
申请号：US09557508
申请日：2000-04-25
申请人： Andreas A. Fenner , Lary R. Larson , Paul F. Gerrish , Daniel E. Fulton , James W. Bell , James Thomas May
发明人： Andreas A. Fenner , Lary R. Larson , Paul F. Gerrish , Daniel E. Fulton , James W. Bell , James Thomas May
IPC分类号： H01L2358
CPC分类号： G01R31/2831 , G01R31/316
摘要： Methods and apparatus for burn-in of integrated circuit (IC) dies at the wafer level. In one embodiment, a wafer is fabricated having an array of dies formed thereon wherein the dies are separated by scribe areas. Surrounding each die is one or more ring conductors which are electrically coupled to various circuits on the die via die bond pads. The wafer further includes a series of conductive pads located in an inactive region of the wafer. Electrically connecting the conductive pads to the ring conductors is a series of redundant scribe conductors. During burn-in, a burn-in indicating apparatus located on each die monitors burn-in parameters such as elapsed burn-in time. The indicating apparatus further records the elapsed burn-in time (or other parameter). The indicating apparatus may be subsequently interrogated to verify the burn-in time.
摘要翻译：集成电路（IC）老化的方法和设备在晶圆级处死。在一个实施例中，制造具有在其上形成的模具阵列的晶片，其中模具由划线区域分开。每个管芯周围是一个或多个环形导体，其通过管芯接合焊盘电耦合到管芯上的各种电路。晶片还包括位于晶片的无效区域中的一系列导电焊盘。将导电焊盘电连接到环形导体是一系列冗余划线导体。在老化期间，位于每个管芯上的老化指示装置会监视老化参数，例如经过的老化时间。指示装置还记录经过的老化时间（或其他参数）。随后询问指示装置以验证老化时间。

4. 发明授权

US6052623A Feedthrough assembly for implantable medical devices and methods for providing same 有权
标题翻译：用于可植入医疗器械的馈通组件及其提供方法
公开(公告)号：US6052623A
公开(公告)日：2000-04-18
申请号：US201059
申请日：1998-11-30
申请人： Andreas A. Fenner , Lary R. Larson , Daniel R. Greeninger , David L. Thompson
发明人： Andreas A. Fenner , Lary R. Larson , Daniel R. Greeninger , David L. Thompson
IPC分类号： A61N1/375
CPC分类号： A61N1/3754
摘要： A feedthrough assembly for an implantable medical device includes one or more electrically conductive pins extending through apertures in a case of the medical device with the electrically conductive pins being insulated from the case. The feedthrough assembly further includes a printed circuit board having a diode protection circuit mounted thereon. The printed circuit board forms at least a part of electrically conductive paths for connection of the electrically conductive pins to a medical device circuit assembly mounted within the case. The printed circuit board further provides for electrical connection of the diode protection circuit mounted thereon between the electrically conductive pins and the case.
摘要翻译：用于可植入医疗装置的馈通组件包括在医疗装置的壳体中延伸穿过孔的一个或多个导电销，其中导电销与壳体绝缘。馈通组件还包括其上安装有二极管保护电路的印刷电路板。印刷电路板形成用于将导电针连接到安装在壳体内的医疗装置电路组件的导电路径的至少一部分。印刷电路板还提供安装在其上的二极管保护电路在导电引脚和外壳之间的电连接。

5. 发明授权

US4230127A Cardiac monitoring apparatus 失效
标题翻译：心脏监护仪
公开(公告)号：US4230127A
公开(公告)日：1980-10-28
申请号：US909230
申请日：1978-05-24
申请人： Lary R. Larson
发明人： Lary R. Larson
IPC分类号： A61B5/0404 , A61B5/04
CPC分类号： A61B5/0404
摘要： There is disclosed herein a wristwatch size cardiac monitoring apparatus which is worn on the wrist of one arm. A conductive material housing acts as one electrode when held firmly in contact with the wrist of the arm on which it is worn. A finger of the other limb is placed on a receiving electrode of the casing which acts as the second electrode. Together, these two electrodes provide a Lead I electrocardiac signal to electronics within the housing. The second electrode consists of a metal layer on which is placed a dielectric material and when the finger is placed on top of the dielectric material, a capacitor is formed and the electric signal on the finger is transferred to the metal layer. Additionally, there is described circuitry which is used to operate the rate monitor. This circuitry includes means for detecting a QRS complex and for causing a count in beats per minute to be displayed, manifesting the heartbeat rate. The circuitry includes means for updating the heartbeat rate displayed every two seconds and for automatically turning the system off when no heartbeats are detected for a six second interval.
摘要翻译：这里公开了一种手表尺寸的心脏监测装置，其佩戴在一只手腕上。导电材料壳体在与其佩戴的手臂的手腕牢固地接触时用作一个电极。另一肢的手指放置在作为第二电极的壳体的接收电极上。一起，这两个电极为外壳内的电子设备提供了一个Lead I心电信号。第二电极由金属层组成，其上放置有介电材料，并且当手指放置在电介质材料的顶部时，形成电容器，并且将手指上的电信号转移到金属层。另外，描述了用于操作速率监视器的电路。该电路包括用于检测QRS波段的装置，并显示出每分钟节拍数，显示出心跳速率。电路包括用于更新每两秒显示的心跳速率的装置，以及当在六秒间隔内没有检测到心跳时自动地关闭系统。

6. 发明授权

US07886608B2 Pressure sensor configurations for implantable medical electrical leads 有权
标题翻译：用于植入式医疗电线的压力传感器配置
公开(公告)号：US07886608B2
公开(公告)日：2011-02-15
申请号：US12544342
申请日：2009-08-20
申请人： Kamal Deep Mothilal , Michael A. Schugt , David A. Ruben , Jonathan P. Roberts , Clark B. Norgaard , Lary R. Larson
发明人： Kamal Deep Mothilal , Michael A. Schugt , David A. Ruben , Jonathan P. Roberts , Clark B. Norgaard , Lary R. Larson
IPC分类号： G01L9/12
CPC分类号： A61N1/056 , A61B5/0215 , A61B2562/0247 , A61B2562/028 , A61B2562/182 , A61N1/0573
摘要： An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.
摘要翻译：可植入的压力传感器，其可并入可植入医疗电引线内，包括绝缘侧壁，其包含间隙电容器和集成电路。压力传感器的绝缘侧壁包括压敏膜部分，并且间隙电容器包括附接到侧壁的隔膜部分的内表面的第一电极板和与侧壁隔膜部分隔开的第二电极板第一电极板并且耦合到集成电路，其通过侧壁耦合到电源触点和接地触点。导电层在侧壁的隔膜部分的内表面和隔膜部分的外表面之一上延伸; 并且所述导电层耦合到所述接地触头以屏蔽或接地所述第一电极板。

7. 发明授权

US09616223B2 Media-exposed interconnects for transducers 有权
公开(公告)号：US09616223B2
公开(公告)日：2017-04-11
申请号：US11323896
申请日：2005-12-30
申请人： Michael A. Schugt , Kamal D. Mothilal , David A. Ruben , Lary R. Larson , Michael F. Mattes
发明人： Michael A. Schugt , Kamal D. Mothilal , David A. Ruben , Lary R. Larson , Michael F. Mattes
IPC分类号： H05K1/16 , A61N1/05 , A61B5/0215 , H05K1/02 , B81B3/00 , H01L21/48 , H05K3/40
CPC分类号： A61N1/056 , A61B5/0215 , B81B3/0072 , B81C2201/0167 , H01L21/4857 , H05K1/0271 , H05K3/4061 , H05K3/4092
摘要： Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.

8. 发明申请

US20100315110A1 HERMETICITY TESTING 有权
标题翻译：感染测试
公开(公告)号：US20100315110A1
公开(公告)日：2010-12-16
申请号：US12569474
申请日：2009-09-29
申请人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
发明人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
IPC分类号： G01R31/02 , G01R1/04
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.
摘要翻译：包括用于测试电路装置的气密性的气密性测试结构的电路装置和方法。

9. 发明申请

US20090308169A1 PRESSURE SENSOR CONFIGURATIONS FOR IMPLANTABLE MEDICAL ELECTRICAL LEADS 有权
标题翻译：用于可植入式医疗电源的压力传感器配置
公开(公告)号：US20090308169A1
公开(公告)日：2009-12-17
申请号：US12544342
申请日：2009-08-20
申请人： Kamal Deep Mothilal , Michael A. Schugt , David A. Ruben , Jonathan P. Roberts , Clark B. Norgaard , Lary R. Larson
发明人： Kamal Deep Mothilal , Michael A. Schugt , David A. Ruben , Jonathan P. Roberts , Clark B. Norgaard , Lary R. Larson
IPC分类号： G01L9/12
CPC分类号： A61N1/056 , A61B5/0215 , A61B2562/0247 , A61B2562/028 , A61B2562/182 , A61N1/0573
摘要： An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.
摘要翻译：可植入的压力传感器，其可并入可植入医疗电引线内，包括绝缘侧壁，其包含间隙电容器和集成电路。压力传感器的绝缘侧壁包括压敏膜部分，并且间隙电容器包括附接到侧壁的隔膜部分的内表面的第一电极板和与侧壁隔膜部分隔开的第二电极板第一电极板并且耦合到集成电路，其通过侧壁耦合到电源触点和接地触点。导电层在侧壁的隔膜部分的内表面和隔膜部分的外表面之一上延伸; 并且所述导电层耦合到所述接地触头以屏蔽或接地所述第一电极板。

10. 发明授权

US07902851B2 Hermeticity testing 有权
标题翻译：密码测试
公开(公告)号：US07902851B2
公开(公告)日：2011-03-08
申请号：US12569474
申请日：2009-09-29
申请人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
发明人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.
摘要翻译：包括用于测试电路装置的气密性的气密性测试结构的电路装置和方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式