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1. 发明授权

US06627917B1 Method and apparatus for wafer-level burn-in 失效
标题翻译：晶圆级老化的方法和装置
公开(公告)号：US06627917B1
公开(公告)日：2003-09-30
申请号：US09557508
申请日：2000-04-25
申请人： Andreas A. Fenner , Lary R. Larson , Paul F. Gerrish , Daniel E. Fulton , James W. Bell , James Thomas May
发明人： Andreas A. Fenner , Lary R. Larson , Paul F. Gerrish , Daniel E. Fulton , James W. Bell , James Thomas May
IPC分类号： H01L2358
CPC分类号： G01R31/2831 , G01R31/316
摘要： Methods and apparatus for burn-in of integrated circuit (IC) dies at the wafer level. In one embodiment, a wafer is fabricated having an array of dies formed thereon wherein the dies are separated by scribe areas. Surrounding each die is one or more ring conductors which are electrically coupled to various circuits on the die via die bond pads. The wafer further includes a series of conductive pads located in an inactive region of the wafer. Electrically connecting the conductive pads to the ring conductors is a series of redundant scribe conductors. During burn-in, a burn-in indicating apparatus located on each die monitors burn-in parameters such as elapsed burn-in time. The indicating apparatus further records the elapsed burn-in time (or other parameter). The indicating apparatus may be subsequently interrogated to verify the burn-in time.
摘要翻译：集成电路（IC）老化的方法和设备在晶圆级处死。在一个实施例中，制造具有在其上形成的模具阵列的晶片，其中模具由划线区域分开。每个管芯周围是一个或多个环形导体，其通过管芯接合焊盘电耦合到管芯上的各种电路。晶片还包括位于晶片的无效区域中的一系列导电焊盘。将导电焊盘电连接到环形导体是一系列冗余划线导体。在老化期间，位于每个管芯上的老化指示装置会监视老化参数，例如经过的老化时间。指示装置还记录经过的老化时间（或其他参数）。随后询问指示装置以验证老化时间。

2. 发明申请

US20100314149A1 HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS 审中-公开
标题翻译：密封电气电路设备
公开(公告)号：US20100314149A1
公开(公告)日：2010-12-16
申请号：US12569431
申请日：2009-09-29
申请人： Paul F. Gerrish , Geoffrey Batchelder , Andreas Armin Fenner , Lary R. Larson , Anna J. Malin , Michael F. Mattes , Tyler Mueller , David A. Ruben , Larry E. Tyler
发明人： Paul F. Gerrish , Geoffrey Batchelder , Andreas Armin Fenner , Lary R. Larson , Anna J. Malin , Michael F. Mattes , Tyler Mueller , David A. Ruben , Larry E. Tyler
IPC分类号： H05K5/06
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/80895 , H01L2224/80896 , H01L2224/80986 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions.
摘要翻译：气密密封电路装置和使用一个或多个密封部分构造这种装置的方法。

3. 发明授权

US07902851B2 Hermeticity testing 有权
标题翻译：密码测试
公开(公告)号：US07902851B2
公开(公告)日：2011-03-08
申请号：US12569474
申请日：2009-09-29
申请人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
发明人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.
摘要翻译：包括用于测试电路装置的气密性的气密性测试结构的电路装置和方法。

4. 发明申请

US20100315110A1 HERMETICITY TESTING 有权
标题翻译：感染测试
公开(公告)号：US20100315110A1
公开(公告)日：2010-12-16
申请号：US12569474
申请日：2009-09-29
申请人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
发明人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
IPC分类号： G01R31/02 , G01R1/04
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.
摘要翻译：包括用于测试电路装置的气密性的气密性测试结构的电路装置和方法。

5. 发明申请

US20090270953A1 Optical Device 有权
标题翻译：光学设备
公开(公告)号：US20090270953A1
公开(公告)日：2009-10-29
申请号：US12107921
申请日：2008-04-23
申请人： Robert M. Ecker , Jonathan L. Kuhn , James D. Reinke , Can Cinbis , Timothy J. Davis , Paul F. Gerrish , Jonathan P. Roberts
发明人： Robert M. Ecker , Jonathan L. Kuhn , James D. Reinke , Can Cinbis , Timothy J. Davis , Paul F. Gerrish , Jonathan P. Roberts
IPC分类号： A61N5/06 , H01L31/12
CPC分类号： A61B5/0086 , A61B2562/028 , A61N1/3621 , A61N1/36557 , A61N1/375 , A61N1/3956
摘要： A reflectance-type optical sensor includes one or more photodiodes formed in a semiconductor substrate. A well having sidewalls and a bottom is formed in the top surface of the substrate, and a reflective layer is formed on the sidewalls and bottom. A light-emitting diode (LED) is mounted in the well, so that light emitted laterally and rearwardly from the LED strikes the sidewalls or bottom and is redirected in a direction generally perpendicular to the top surface of the substrate. The optical sensor can be fabricated using microelectromechanical systems (MEMS) fabrication techniques.
摘要翻译：反射型光学传感器包括在半导体衬底中形成的一个或多个光电二极管。在衬底的顶表面中形成具有侧壁和底部的阱，并且在侧壁和底部上形成反射层。发光二极管（LED）安装在井中，使得从LED侧向和向后发射的光撞击侧壁或底部，并且在大体上垂直于衬底的顶表面的方向上重定向。光学传感器可以使用微机电系统（MEMS）制造技术来制造。

6. 发明授权

US08263436B2 Apparatus for restricting moisture ingress 有权
标题翻译：用于限制水分进入的装置
公开(公告)号：US08263436B2
公开(公告)日：2012-09-11
申请号：US13302725
申请日：2011-11-22
申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
IPC分类号： H01L21/00
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.
摘要翻译：保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。

7. 发明授权

US08452402B2 Optical sensing device for use in a medical device 有权
标题翻译：用于医疗设备的光学感测装置
公开(公告)号：US08452402B2
公开(公告)日：2013-05-28
申请号：US12107921
申请日：2008-04-23
申请人： Robert M. Ecker , Jonathan L. Kuhn , James D. Reinke , Can Cinbis , Timothy J. Davis , Paul F. Gerrish , Jonathan P. Roberts
发明人： Robert M. Ecker , Jonathan L. Kuhn , James D. Reinke , Can Cinbis , Timothy J. Davis , Paul F. Gerrish , Jonathan P. Roberts
IPC分类号： A61B5/1455
CPC分类号： A61B5/0086 , A61B2562/028 , A61N1/3621 , A61N1/36557 , A61N1/375 , A61N1/3956
摘要： A reflectance-type optical sensor includes one or more photodiodes formed in a semiconductor substrate. A well having sidewalls and a bottom is formed in the top surface of the substrate, and a reflective layer is formed on the sidewalls and bottom. A light-emitting diode (LED) is mounted in the well, so that light emitted laterally and rearwardly from the LED strikes the sidewalls or bottom and is redirected in a direction generally perpendicular to the top surface of the substrate. The optical sensor can be fabricated using microelectromechanical systems (MEMS) fabrication techniques.
摘要翻译：反射型光学传感器包括在半导体衬底中形成的一个或多个光电二极管。在衬底的顶表面中形成具有侧壁和底部的阱，并且在侧壁和底部上形成反射层。发光二极管（LED）安装在井中，使得从LED侧向和向后发射的光撞击侧壁或底部，并且在大体上垂直于衬底的顶表面的方向上重定向。光学传感器可以使用微机电系统（MEMS）制造技术来制造。

8. 发明授权

US08172760B2 Medical device encapsulated within bonded dies 有权
标题翻译：封装在粘合模具内的医疗器械
公开(公告)号：US08172760B2
公开(公告)日：2012-05-08
申请号：US12487369
申请日：2009-06-18
申请人： Michael F. Mattes , Paul F. Gerrish , Anna J. Malin , Tyler J. Mueller , Geoffrey DeWitt Batchelder , Clark B. Norgaard , Michael A. Schugt , Ralph Danzl , Richard J. O'Brien
发明人： Michael F. Mattes , Paul F. Gerrish , Anna J. Malin , Tyler J. Mueller , Geoffrey DeWitt Batchelder , Clark B. Norgaard , Michael A. Schugt , Ralph Danzl , Richard J. O'Brien
IPC分类号： A61N1/00
CPC分类号： A61N1/375 , A61N1/3758
摘要： An implantable medical system includes a first die substrate with a first outer surface. The system also includes a second die substrate with a second outer surface. Furthermore, the system includes a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate. The first and second die substrates are fixed to each other and substantially hermetically sealed to each other. Also, the medical device is substantially encapsulated between the first and second die substrates. The first portion is electrically connected to the second portion. Moreover, the first and second outer surfaces of the first and second die substrates are directly exposed to a biological material.
摘要翻译：可植入医疗系统包括具有第一外表面的第一模具衬底。该系统还包括具有第二外表面的第二管芯衬底。此外，该系统包括具有安装到第一管芯衬底的第一部分和安装到第二管芯衬底的第二部分的医疗器件。第一和第二管芯基板彼此固定并基本上彼此密封。此外，医疗装置基本上封装在第一和第二管芯基板之间。第一部分电连接到第二部分。此外，第一和第二管芯基板的第一和第二外表面直接暴露于生物材料。

9. 发明申请

US20120064670A1 APPARATUS FOR RESTRICTING MOISTURE INGRESS 有权
标题翻译：限制水分摄入的设备
公开(公告)号：US20120064670A1
公开(公告)日：2012-03-15
申请号：US13302725
申请日：2011-11-22
申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
IPC分类号： H01L21/52
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.
摘要翻译：保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。

10. 发明授权

US08125058B2 Faraday cage for circuitry using substrates 有权
标题翻译：法拉第笼用于使用基板的电路
公开(公告)号：US08125058B2
公开(公告)日：2012-02-28
申请号：US12569525
申请日：2009-09-29
申请人： Tyler Mueller , Larry E. Tyler , Geoffrey Batchelder , Paul F. Gerrish , Michael F. Mattes , Anna J. Malin
发明人： Tyler Mueller , Larry E. Tyler , Geoffrey Batchelder , Paul F. Gerrish , Michael F. Mattes , Anna J. Malin
IPC分类号： H01L23/552
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： An apparatus and method uses a first Faraday cage portion and a second Faraday cage portion to provide a Faraday cage enclosure surrounding at least one circuit device. For example, the first Faraday cage portion may include a first conductive portion of a Faraday cage enclosure surrounding the at least one circuit device, and a second Faraday cage portion may include a second conductive portion of the Faraday cage enclosure surrounding the at least one circuit device. Further, for example, the first Faraday cage portion may include a connection surface having one or more conductive contact portions terminating the first conductive portion of the Faraday cage enclosure the second Faraday cage portion may include a connection surface having one or more conductive contact portions terminating the second conductive portion of the Faraday cage enclosure. An electrical connection may be provided between the conductive contact portions of the first and second Faraday cage portions.
摘要翻译：一种装置和方法使用第一法拉第笼部分和第二法拉第笼部分来提供围绕至少一个电路装置的法拉第笼壳。例如，第一法拉第笼部分可以包括围绕至少一个电路装置的法拉第笼壳体的第一导电部分，并且第二法拉第笼部分可以包括围绕至少一个电路的法拉第笼壳体的第二导电部分设备。此外，例如，第一法拉第笼部分可以包括具有端接法拉第笼壳体的第一导电部分的一个或多个导电接触部分的连接表面，第二法拉第笼部分可以包括具有一个或多个导电接触部分终止的连接表面法拉第笼壳的第二个导电部分。可以在第一和第二法拉第笼部分的导电接触部分之间提供电连接。

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