会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明申请
    • CROSSLINKABLE POLYMERS
    • 可交联聚合物
    • US20160046748A1
    • 2016-02-18
    • US14457477
    • 2014-08-12
    • Thomas B. BrustGrace Ann BennettMark Edward Irving
    • Thomas B. BrustGrace Ann BennettMark Edward Irving
    • C08F220/68
    • C08F220/68C08F20/38C08F28/02C08F120/38C08F122/24C08F128/02C08F220/38C08F2220/382C08F2220/385C08F2220/387
    • Crosslinkable polymers comprise recurring units represented by: wherein R, R′, and R″ are independently hydrogen or an alkyl, cyano, or halo group; R1 is hydrogen or a halo, substituted or unsubstituted alkyl, substituted or unsubstituted cycloalkyl, cyano, hydroxy, alkoxy, carboxy, or ester group; L is an organic linking group; EWG represents an electron withdrawing group having a Hammett-sigma value greater than or equal to 0.35 such that the oxygen-carbon bond in O—C(EWG)(R1) is cleavable in the presence of a cleaving acid having a pKa of 2 or less as measured in water; Ar is a substituted or unsubstituted arylene group; X is NR2 or oxygen; R2 is hydrogen or an alkyl group; t-alkyl represents a tertiary alkyl group having 4 to 6 carbon atoms, and m represents at least 1 mol % and up to and including 100 mol %, based on the total recurring units in the polymer.
    • 可交联聚合物包含由下式表示的重复单元:其中R,R'和R“独立地为氢或烷基,氰基或卤代基; R 1是氢或卤素,取代或未取代的烷基,取代或未取代的环烷基,氰基,羟基,烷氧基,羧基或酯基; L是有机连接基团; EWG表示具有大于或等于0.35的哈米特 - 西格玛值的吸电子基团,使得O-C(EWG)(R1)中的氧 - 碳键可在pKa为2的裂解酸存在下裂解,或 较少在水中测量; Ar是取代或未取代的亚芳基; X为NR2或氧; R2是氢或烷基; 基于聚合物中的总重复单元,t-烷基表示具有4-6个碳原子的叔烷基,m表示至少1mol%且至多且包括100mol%。
    • 5. 发明授权
    • Electroless plating method
    • 无电镀法
    • US09081281B2
    • 2015-07-14
    • US14084732
    • 2013-11-20
    • Mark Edward Irving
    • Mark Edward Irving
    • G03F7/26G03F7/16G03F7/20
    • G03F7/0045G03F7/038G03F7/26G03F7/265
    • A conductive metal pattern is formed in a polymeric layer that has a polymer that comprises (1) pendant groups that are capable of providing pendant sulfonic acid groups upon exposure of the reactive polymer to radiation, and (2) pendant groups that are capable of reacting in the presence of the sulfonic acid groups to provide crosslinking. The polymeric layer is patternwise exposed to form non-exposed regions and exposed regions, which are contacted with a reducing agent to incorporate reducing agent therein. These exposed regions are then contacted with electroless seed metal ions to oxidize the reducing agent to form corresponding electroless seed metal nuclei that can be then electrolessly plated with a conductive metal.
    • 在具有聚合物的聚合物层中形成导电金属图案,所述聚合物包含(1)当将反应性聚合物暴露于辐射时能够提供侧链磺酸基的侧基,和(2)能够反应的侧基 在磺酸基存在下提供交联。 聚合物层被图案化地暴露以形成非暴露区域和暴露区域,其与还原剂接触以在其中引入还原剂。 然后将这些暴露的区域与无电子种子金属离子接触以氧化还原剂,以形成相应的无电子种子金属核,然后可以用导电金属进行无电镀。
    • 6. 发明申请
    • ELECTROLESS PLATING METHOD USING HALIDE
    • 使用半导体的电镀方法
    • US20150140495A1
    • 2015-05-21
    • US14084969
    • 2013-11-20
    • Mark Edward Irving
    • Mark Edward Irving
    • G03F7/16G03F7/11G03F7/20
    • G03F7/16G03F7/0045G03F7/038G03F7/11G03F7/20G03F7/26G03F7/265Y10T428/24802
    • A conductive metal pattern is formed using a reactive polymer that can provide pendant sulfonic acid groups upon exposure to radiation, and (2) pendant groups that are capable of providing crosslinking. The polymeric layer is patternwise exposed to radiation to provide first exposed regions that are then contacted with electroless seed metal ions to form a pattern of electroless seed metal ions, followed by contact with a halide. At least some of the electroless seed metal halide can be exposed to form second exposed regions. The polymeric layer can be contacted with a reducing agent either: (i) to develop the electroless seed metal image in the second exposed regions, or (ii) to develop all of the electroless seed metal halide in the first exposed regions, and optionally contacted with a fixing agent. The electroless seed metal nuclei in the first exposed regions can be electrolessly plated with a conductive metal.
    • 使用可以在暴露于辐射时提供侧链磺酸基团的反应性聚合物形成导电金属图案,和(2)能够提供交联的侧基。 将聚合物层图案地暴露于辐射以提供第一暴露区域,然后与无电晶种金属离子接触以形成无电子种子金属离子的图案,然后与卤化物接触。 至少一些无电子种子金属卤化物可以暴露以形成第二暴露区域。 聚合物层可以与还原剂接触,即:(i)在第二暴露区域中显影无电子种子金属图像,或(ii)在第一曝光区域中显影所有无电子种子金属卤化物,并任选地接触 用固定剂。 第一暴露区域中的无电晶种金属核可以用导电金属无电镀。
    • 10. 发明授权
    • Forming conductive metal patterns using water-soluble polymers
    • 使用水溶性聚合物形成导电金属图案
    • US09389512B2
    • 2016-07-12
    • US14501206
    • 2014-09-30
    • Thomas B. BrustGrace Ann BennettMark Edward Irving
    • Thomas B. BrustGrace Ann BennettMark Edward Irving
    • G03C5/58G03F7/16G03F7/20
    • G03F7/031G03F7/0388G03F7/32G03F7/38G03F7/40
    • A conductive pattern can be formed using a polymeric layer that contains a reactive composition having a reactive polymer. This reactive polymer comprises pendant photosensitive 1,2-diarylethylene groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced, followed by electrolessly plating with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
    • 可以使用含有具有反应性聚合物的反应性组合物的聚合物层形成导电图案。 该反应性聚合物包括侧光敏1,2-二亚乙基。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被除去,但聚合物层的暴露区域与无电子种子金属离子接触,然后将其还原,然后用合适的金属进行无电镀 以形成所需的导电图案。 在该过程中可以制备各种物品,并且产品可以并入各种电子设备中。