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    • 1. 发明授权
    • Test socket
    • 测试插座
    • US06204680B1
    • 2001-03-20
    • US09139543
    • 1998-08-25
    • Mark A. SwartCharles J. JohnstonGordon A. VintherSteve B. SargeantRoy W. Green
    • Mark A. SwartCharles J. JohnstonGordon A. VintherSteve B. SargeantRoy W. Green
    • G01R3102
    • G01R1/06722G01R1/0483
    • A test socket for an integrated circuit package having an upper housing and a lower housing secured to the top and bottom surfaces, respectively, of a load board. The upper housing having a cavity for receipt of the integrated circuit package and including a hole in the base of the upper housing to allow a plurality of solid socket plungers to contact test sites on the integrated circuit package. The socket plungers are positioned within a plurality of channels formed in the lower housing and extend through a plurality of holes in the load board to contact the test sites. A plurality of springs are positioned in the channels of the lower housing below the socket plungers to provide a spring force to bias the socket plungers upwardly toward the integrated circuit package. A nonconductive pushrod is positioned between the spring and a beveled edge of the plunger and a nonconductive cap is positioned above the load board for high frequency test signals. For closely spaced test sites a thinner daughter board is electrically connected to the load board through a hole in the load board. The test socket is then positioned on the daughter board.
    • 一种用于集成电路封装的测试插座,其具有分别固定到负载板的顶表面和底表面的上壳体和下壳体。 上壳体具有用于接收集成电路封装的空腔,并且在上壳体的基部中包括孔,以允许多个实心插座柱塞接触集成电路封装上的测试位置。 插座柱塞定位在形成在下壳体中的多个通道内并且延伸穿过负载板中的多个孔以接触测试位置。 多个弹簧定位在下壳体的通道内,位于插座柱塞下方,以提供弹簧力,以将插座柱塞向上朝向集成电路封装偏置。 非导电推杆位于弹簧和柱塞的斜边之间,并且非导电帽位于负载板上方以用于高频测试信号。 对于紧密间隔的测试位置,较薄的子板通过负载板上的孔与负载板电连接。 然后将测试插座定位在子板上。
    • 2. 发明授权
    • Test socket
    • 测试插座
    • US6084421A
    • 2000-07-04
    • US44874
    • 1998-03-20
    • Mark A. SwartCharles J. JohnstonGordon A. VintherSteve B. Sargeant
    • Mark A. SwartCharles J. JohnstonGordon A. VintherSteve B. Sargeant
    • G01R31/26G01R1/04G01R1/073G01R31/02H01L21/66H01L21/822H01L23/32H01L27/04H01R12/16H01R33/76
    • G01R1/0483
    • A test socket for an integrated circuit package having an upper housing and a lower housing secured to the top and bottom surfaces, respectively, of a load board. The upper housing having a cavity for receipt of the integrated circuit package and including a hole in the base of the upper housing to allow a plurality of solid socket plungers to contact test sites on the integrated circuit package. The socket plungers are positioned within a plurality of channels formed in the lower housing and extend through a plurality of holes in the load board to contact the test sites. A plurality of springs are positioned in the channels of the lower housing below the socket plungers to provide a spring force to bias the socket plungers upwardly toward the integrated circuit package. A ball is positioned between the spring and a beveled edge of the plunger to aid in biasing the plunger. Electrically conductive cylindrical eyelets or plated through holes are positioned within the holes in the load board to guide the travel of the socket plungers and to transfer the test signals from the socket plungers to the load board.
    • 一种用于集成电路封装的测试插座,其具有分别固定到负载板的顶表面和底表面的上壳体和下壳体。 上壳体具有用于接收集成电路封装的空腔,并且在上壳体的基部中包括孔,以允许多个实心插座柱塞接触集成电路封装上的测试位置。 插座柱塞定位在形成在下壳体中的多个通道内并且延伸穿过负载板中的多个孔以接触测试位置。 多个弹簧定位在下壳体的通道内,位于插座柱塞下方,以提供弹簧力,以将插座柱塞向上朝向集成电路封装偏置。 一个球定位在弹簧与柱塞的斜边之间,有助于偏压柱塞。 导电圆柱形孔眼或电镀通孔位于负载板的孔内,以引导插座柱塞的行进,并将测试信号从插座柱塞传输到负载板。
    • 8. 发明授权
    • Self-retained spring probe
    • 自保持弹簧探头
    • US06462567B1
    • 2002-10-08
    • US09614422
    • 2000-07-12
    • Gordon A. VintherCharles J. JohnstonScott D. ChabineauBrian L. Crisp
    • Gordon A. VintherCharles J. JohnstonScott D. ChabineauBrian L. Crisp
    • G01R3102
    • G01R1/06722G01R1/06733
    • An external spring probe is provided having a first section and a second section which extend and compress relative to each other. The first section consists of a tip at one end and a first contact component opposite the tip. A flange extends radially outward between the tip and the first contact component. The second section consists of a tip at one end and a second contact component opposite the tip. The second contact component is in contact with the first contact component. A flange extends radially outward between the second section tip and the second contact component. A spring is sandwiched between the two flanges surrounding the two contact components. The first and second contact components remain in contact with each other during compression and extension of the two sections.
    • 提供外部弹簧探针,其具有相对于彼此延伸和压缩的第一部分和第二部分。 第一部分由一端的尖端和与尖端相对的第一接触部件组成。 凸缘在尖端和第一接触部件之间径向向外延伸。 第二部分包括在一端的尖端和与尖端相对的第二接触部件。 第二接触部件与第一接触部件接触。 凸缘在第二部分尖端和第二接触部件之间径向向外延伸。 弹簧被夹在围绕两个接触部件的两个凸缘之间。 第一和第二接触部件在压缩和延伸两部分期间保持彼此接触。
    • 9. 发明授权
    • Self-closing spring probe
    • 自闭式弹簧探头
    • US06396293B1
    • 2002-05-28
    • US09253320
    • 1999-02-18
    • Gordon A. VintherScott D. ChabineauCharles J. Johnston
    • Gordon A. VintherScott D. ChabineauCharles J. Johnston
    • G01R3102
    • G01R1/06722
    • An external spring probe is provided having a first section and a second section which extend and compress relative to each other. The first section consists of a tip at one end and a first contact component opposite the tip. A flange extends radially outward between the tip and the first contact component. The second section consists of a tip at one end and a second contact component opposite the tip. The second contact tip is in contact with the first contact tip. A flange extends radially outward between the second section tip and the second contact component. A spring is sandwiched between the two flanges surrounding the two contact components. The first and second contact components remain in contact with each other during compression and extension of the two sections.
    • 提供外部弹簧探针,其具有相对于彼此延伸和压缩的第一部分和第二部分。 第一部分由一端的尖端和与尖端相对的第一接触部件组成。 凸缘在尖端和第一接触部件之间径向向外延伸。 第二部分包括在一端的尖端和与尖端相对的第二接触部件。 第二接触尖端与第一接触尖端接触。 凸缘在第二部分尖端和第二接触部件之间径向向外延伸。 弹簧被夹在围绕两个接触部件的两个凸缘之间。 第一和第二接触部件在压缩和延伸两部分期间保持彼此接触。
    • 10. 发明授权
    • Integrated circuit carrier having built-in circuit verification
    • 集成电路载体内置电路验证
    • US5180976A
    • 1993-01-19
    • US757006
    • 1991-09-09
    • David R. Van LoanCharles J. JohnstonMark A. Swart
    • David R. Van LoanCharles J. JohnstonMark A. Swart
    • G01R1/04G01R31/316
    • G01R1/0425G01R31/316
    • Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
    • 安装在加载印刷电路板(PCB)上的集成电路(IC)封装由转换器模块测试,首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点,用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体,或者其可以包括具有包括柔性弹簧状金属化塑料指状物的单独触头的复合柔性电路材料。 测试模块上的触点可以直接可释放地接合IC封装上的引线,或者它们可以接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间,弹簧探头接触测试模块上的测试焊盘,并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 在另一个实施例中,翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。 在另一实施例中,集成电路封装包含内置的测试验证器系统,使得可以使用标准测试探针来测试封装而不使用单独的转换器模块。