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1. 发明授权

US07858146B2 Method of electrolessly depositing metal on the walls of through-holes 失效
标题翻译：将金属无电沉积在通孔壁上的方法
公开(公告)号：US07858146B2
公开(公告)日：2010-12-28
申请号：US11824222
申请日：2007-06-29
申请人： Mark A. Poole , Andrew J. Cobley , Amrik Singh , Kevin Bass
发明人： Mark A. Poole , Andrew J. Cobley , Amrik Singh , Kevin Bass
IPC分类号： B05B7/22
CPC分类号： H05K3/422 , C23C18/2086 , C23C18/31 , C23C18/405 , H05K3/0055 , H05K2203/0793 , H05K2203/122
摘要： Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.
摘要翻译：公开了无电金属化的方法。这些方法包括处理印刷电路板的通孔以增加通孔壁上的催化剂吸附。增加的催化剂吸附改善通孔壁的无电镀金属化。

2. 发明申请

US20090004382A1 Electroless methods 失效
标题翻译：化学方法
公开(公告)号：US20090004382A1
公开(公告)日：2009-01-01
申请号：US11824222
申请日：2007-06-29
申请人： Mark A. Poole , Andrew J. Cobley , Amrik Singh , Kevin Bass
发明人： Mark A. Poole , Andrew J. Cobley , Amrik Singh , Kevin Bass
IPC分类号： B05D7/22
CPC分类号： H05K3/422 , C23C18/2086 , C23C18/31 , C23C18/405 , H05K3/0055 , H05K2203/0793 , H05K2203/122
摘要： Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.
摘要翻译：公开了无电金属化的方法。这些方法包括处理印刷电路板的通孔以增加通孔壁上的催化剂吸附。增加的催化剂吸附改善通孔壁的无电镀金属化。

3. 发明授权

US5528000A Electroplating process and composition 失效
公开(公告)号：US5528000A
公开(公告)日：1996-06-18
申请号：US395685
申请日：1995-02-28
申请人： George R. Allardyce , Kevin Bass , John E. Graves , James G. Shelnut
发明人： George R. Allardyce , Kevin Bass , John E. Graves , James G. Shelnut
IPC分类号： C25D5/54 , H05K3/42 , H05K1/09
CPC分类号： H05K3/424 , C25D5/54
摘要： A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.

4. 发明申请

US20080035489A1 Plating process 审中-公开
标题翻译：电镀工艺
公开(公告)号：US20080035489A1
公开(公告)日：2008-02-14
申请号：US11588520
申请日：2006-10-27
申请人： George R. Allardyce , Kevin Bass , Joachim Rasch
发明人： George R. Allardyce , Kevin Bass , Joachim Rasch
IPC分类号： C25D5/02 , C25D3/00
CPC分类号： H01L31/022425 , C23C18/1605 , C23C18/1608 , C23C18/1614 , C23C18/1642 , C23C18/165 , C23C18/1667 , C23C18/38 , C23C18/42 , C25D3/46 , C25D5/006 , C25D7/126 , Y02E10/50
摘要： Methods of plating electrical contacts on a photosensitive device are provided. Also provided are methods of plating electrical contacts on solar cells.
摘要翻译：提供了在感光装置上电镀电触点的方法。还提供了在太阳能电池上电镀电触点的方法。

5. 发明授权

US5415762A Electroplating process and composition 失效
标题翻译：电镀工艺及组成
公开(公告)号：US5415762A
公开(公告)日：1995-05-16
申请号：US108976
申请日：1993-08-18
申请人： George R. Allardyce , Kevin Bass , John E. Graves , James G. Shelnut
发明人： George R. Allardyce , Kevin Bass , John E. Graves , James G. Shelnut
IPC分类号： C25D5/54 , H05K3/42
CPC分类号： H05K3/424 , C25D5/54
摘要： A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.
摘要翻译：一种用于电镀非导电衬底的方法，包括在非导电衬底的表面上形成导电聚合物膜并在其上电解金属沉积。导电膜通过从所述聚合物的水性悬浮液沉积到所述表面上而形成。

6. 发明授权

US5275328A Methods of joining components 失效
标题翻译：连接组件的方法
公开(公告)号：US5275328A
公开(公告)日：1994-01-04
申请号：US964193
申请日：1992-10-21
申请人： Lodge, Kevin J. , Kevin Bass , Elizabeth A. Logan
发明人： Lodge, Kevin J. , Kevin Bass , Elizabeth A. Logan
IPC分类号： B23K1/005 , B23K1/20 , H01L23/02
CPC分类号： B23K1/0056
摘要： This method enables two components (1, 3) to be joined by soldering using heat generated by a laser beam, without the use of flux. A layer (5) of a material which has a lower melting point than the material of one of the components (3) is formed on that component and forms a bond therewith on resolidifying after melting. Solder (7) is interposed between the layer (5) and the other component (1) to form, on resolidification after melting, bonds with the material of the layer (5) and the other component (1). A coating (11) of a further material between the layer (5) and the solder (7) is dispersed when the adjacent layer material becomes molten and is not wetted by the solder (7) when molten. On applying heat to a region (15) of the layer using a laser beam, the layer is melted in this region (15) as is the adjacent solder (7) to form, on resolidification of the solder (7) and molten layer material (15 ), bonds between the solder (7) and the two components (1, 3).
摘要翻译：该方法使得能够通过使用由激光束产生的热量进行焊接来连接两个部件（1,3），而不使用焊剂。在该组分上形成具有比组分（3）之一的材料低的熔点的材料层（5），并在熔融后重新凝固形成粘结。焊料（7）插入在层（5）和另一组分（1）之间，以在熔融之后再凝固以与层（5）和另一组分（1）的材料结合形成。当相邻层材料熔融时熔融时不会被焊料（7）润湿，所以在层（5）和焊料（7）之间的另外的材料的涂层（11）被分散。在使用激光束向层的区域（15）施加热量时，如同相邻的焊料（7）一样，在该区域（15）中熔化该层，以在焊料（7）和熔融层材料（15），焊料（7）和两个部件（1,3）之间的接合。

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