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1. 发明申请

US20130284590A1 SYSTEMS AND METHODS FOR FORMING A LAYER OF SPUTTERED MATERIAL 审中-公开
标题翻译：用于形成溅射材料层的系统和方法
公开(公告)号：US20130284590A1
公开(公告)日：2013-10-31
申请号：US13876826
申请日：2011-07-22
申请人： Marcus Bender , Markus Hanika , Evelyn Scheer , Fabio Pieralisi , Guido Mahnke , Ralph Lindenberg , Andreas Lopp , Konrad Schwanitz , Jian Liu
发明人： Marcus Bender , Markus Hanika , Evelyn Scheer , Fabio Pieralisi , Guido Mahnke , Ralph Lindenberg , Andreas Lopp , Konrad Schwanitz , Jian Liu
IPC分类号： C23C14/35
CPC分类号： C23C14/352 , C23C14/35 , H01J37/34 , H01J37/3473
摘要： The present disclosure describes a method of coating a substrate, the method including forming a layer of sputtered material on the substrate. Forming the layer of sputtered material may include: sputtering material from at least one rotatable target over the substrate; varying the relative position between the at least one target and the substrate. In addition, the present disclosure describes varying the distance between a target and a substrate during the sputter process. The present disclosure further describes a system for coating a substrate.
摘要翻译：本公开描述了一种涂覆基底的方法，该方法包括在基底上形成溅射材料层。形成溅射材料层可以包括：从衬底上的至少一个可旋转靶溅射材料; 改变至少一个靶和衬底之间的相对位置。另外，本公开内容描述了在溅射过程期间改变靶和衬底之间的距离。本公开进一步描述了用于涂覆基底的系统。

2. 发明申请

US20140332369A1 MULTIDIRECTIONAL RACETRACK ROTARY CATHODE FOR PVD ARRAY APPLICATIONS 审中-公开
标题翻译： PVD阵列应用的多媒体旋转阴极
公开(公告)号：US20140332369A1
公开(公告)日：2014-11-13
申请号：US14353473
申请日：2011-10-11
申请人： Evelyn Scheer , Markus Hanika , Ralph Lindenberg , Marcus Bender , Andreas Lopp , Konrad Schwanitz , Fabio Pieralisi , Jian Liu
发明人： Evelyn Scheer , Markus Hanika , Ralph Lindenberg , Marcus Bender , Andreas Lopp , Konrad Schwanitz , Fabio Pieralisi , Jian Liu
IPC分类号： H01J37/32 , C23C14/35
CPC分类号： H01J37/32532 , C23C14/3407 , C23C14/35 , H01J37/3405 , H01J37/345 , H01J37/3452 , H01J37/3455
摘要： A cathode assembly for a sputter deposition apparatus and a method for coating a substrate is provided. The cathode assembly has a coating side for coating on a substrate. Further, the cathode assembly includes a rotary target assembly adapted for rotating a target material around a rotary axis; at least a first magnet having an inner magnet pole and at least one outer magnet poles and being adapted for generating one or more plasma regions. The cathode assembly has a first angular coordinate for a magnet pole, the magnet pole being provided for the coating side, and a second angular coordinate for a further magnet pole, the magnet pole being provided for the coating side; wherein the first angular coordinate and the second angular coordinate define an angle a larger than about 20 degrees and smaller than about 160 degrees.
摘要翻译：提供了一种用于溅射沉积设备的阴极组件和一种用于涂覆基底的方法。阴极组件具有用于在基板上涂覆的涂层侧。此外，阴极组件包括适于围绕旋转轴线旋转目标材料的旋转靶组件; 至少第一磁体，其具有内磁极和至少一个外磁极，并适于产生一个或多个等离子体区域。阴极组件具有用于磁极的第一角度坐标，为涂层侧提供磁极，并且为另一个磁极设置第二角坐标，为涂层侧提供磁极; 其中所述第一角坐标和所述第二角坐标限定大于约20度且小于约160度的角度。

3. 发明申请

US20150214018A1 METHOD FOR COATING A SUBSTRATE AND COATER 审中-公开
标题翻译：涂层和涂层的方法
公开(公告)号：US20150214018A1
公开(公告)日：2015-07-30
申请号：US14402078
申请日：2012-05-29
申请人： Evelyn Scheer , Markus Hanika , Konrad Schwanitz , Fabio Pieralisi , Andreas Klöppel , Jian Liu , Andreas Lopp
发明人： Evelyn Scheer , Markus Hanika , Konrad Schwanitz , Fabio Pieralisi , Andreas Klöppel , Jian Liu , Andreas Lopp
IPC分类号： H01J37/34 , C23C14/35 , H01J37/32
CPC分类号： H01J37/3473 , C23C14/35 , C23C14/352 , H01J37/32568 , H01J37/3405 , H01J37/3417 , H01J2237/3323
摘要： A method for coating a substrate by means of a cathode arrangement including at least two rotatable cathodes is disclosed. The method includes rotating at least one of the at least two rotatable cathodes in a first direction, and, at the same time, rotating at least one of the at least two rotatable cathodes in a second direction. The first direction is opposite to the second direction. Furthermore, a controller for controlling a coating process is disclosed. Furthermore, a coater for coating a substrate is disclosed. The coater includes a cathode arrangement with at least two rotatable cathodes and a controller as disclosed herein.
摘要翻译：公开了一种通过包括至少两个可旋转阴极的阴极装置涂覆基板的方法。该方法包括在第一方向上旋转至少两个可旋转阴极中的至少一个，并且同时在第二方向旋转至少两个可旋转阴极中的至少一个。第一方向与第二方向相反。此外，公开了一种用于控制涂布工艺的控制器。此外，公开了一种用于涂覆基材的涂布机。涂布机包括具有至少两个可旋转阴极的阴极装置和如本文所公开的控制器。

4. 发明申请

US20090114528A1 SPUTTER COATING DEVICE AND COATING METHOD 审中-公开
标题翻译：溅射涂层装置和涂层方法
公开(公告)号：US20090114528A1
公开(公告)日：2009-05-07
申请号：US11936586
申请日：2007-11-07
申请人： Ralph Lindenberg , Marcus Bender , Tobias Stolley , Andreas Kloeppel , Andreas Lopp , Christoph Moelle
发明人： Ralph Lindenberg , Marcus Bender , Tobias Stolley , Andreas Kloeppel , Andreas Lopp , Christoph Moelle
IPC分类号： C23C14/35
CPC分类号： C23C14/3407 , C23C14/35 , H01J37/3408 , H01J37/3452 , H01J37/3455
摘要： A magnet/target assembly 1 comprises a target 2 consisting of a plurality of (virtual) segments 2.1, 2.2, 2.3, 2.4, 2.5, 2.6 arranged side by side, each of them extending along the longitudinal axis x of the target 2. Each of the plurality of target segments 2.1, 2.2, 2.3, 2.4, 2.5, 2.6 has a magnet system 3.1, 3.2, 3.3, 3.4, 3.5, 3.6 attributed to the respective target segment. In an embodiment of the target/magnet assembly 1 according to the present invention the magnet systems 3.1, 3.2, 3.3, 3.4, 3.5, 3.6 are arranged mutually offset relative to their respective adjacent magnet systems 3.1, 3.2, 3.3, 3.4, 3.5 and 3.6, respectively, while scanning the target segments 2.1, 2.2, 2.3, 2.4, 2.5 and 2.6, respectively. Particularly, the first magnet system 3.1, the third magnet system 3.3 and the fifth magnet system 3.5 are a first group of magnet systems moving parallel and synchronously with each other, and the second magnet system 3.2, the forth magnet systems 3.4 and the sixth magnet system 3.6 are a second group of magnet systems moving parallel and synchronously with each other. The first, third and fifth magnet systems 3.1, 3.3, 3.5 are alternately arranged with the second, forth and sixth magnet systems 3.2, 3.4 and 3.6, respectively, in the lateral direction y of the target 2. The paths of movement of the magnet systems are arranged parallel. The first and second groups of magnet systems 3.1, 3.2, 3.3, 3.4, 3.5, 3.6 are arranged offset in a longitudinal direction x of the target 2, i.e. arranged with a distance d between the groups in the longitudinal direction x of the target 2.
摘要翻译：磁体/目标组件1包括由多个（虚拟）段2.1,2.2,2.3,2.4,2.5,2.6组成的目标2，每个段2.1,2.2,2.3,2.4,2.5,2.6每个都沿目标2的纵向轴线x延伸。每个多个目标段2.1,2.2,2.3,2.4,2.5,2.6具有归因于相应目标段的磁体系统3.1,3.2,3.3,3.4,3.5,3.6。在根据本发明的靶/磁体组件1的实施例中，磁体系统3.1,3.2,3.3,3.4,3.5,3.6相对于它们各自相邻的磁体系统3.1,3.2,3.3,3.4,3.5相互偏置地布置，并且 3.6，分别扫描目标段2.1,2.2,2.3,2.4,2.5和2.6。特别地，第一磁体系统3.1，第三磁体系统3.3和第五磁体系统3.5是彼此平行和同步移动的第一组磁体系统，第二磁体系统3.2，第四磁体系统3.4和第六磁体系统3.6是彼此平行和同步移动的第二组磁体系统。第一，第三和第五磁体系统3.1,3.3,3.5分别与目标2的横向y上的第二，第四和第六磁体系统3.2,3.4和3.6交替布置。磁体的运动路径系统并行排列。第一和第二组磁体系统3.1,3.2,3.3,3.4,3.5,3.6在目标2的纵向方向x上偏移布置，即，在目标2的纵向方向x上的组之间设置距离d 。

5. 发明授权

US07575662B2 Method for operating a sputter cathode with a target 有权
标题翻译：用靶操作溅射阴极的方法
公开(公告)号：US07575662B2
公开(公告)日：2009-08-18
申请号：US11170640
申请日：2005-06-29
申请人： Stefan Bangert , Wolfgang Buschbeck , Markus Hanika , Karl-Albert Keim , Michael Konig , Jorg Krempel-Hesse , Andreas Lopp , Harald Rost , Jurgen Schroeder , Tobias Stolley
发明人： Stefan Bangert , Wolfgang Buschbeck , Markus Hanika , Karl-Albert Keim , Michael Konig , Jorg Krempel-Hesse , Andreas Lopp , Harald Rost , Jurgen Schroeder , Tobias Stolley
IPC分类号： C23C14/35
CPC分类号： H01J37/3405 , C23C14/352 , H01J37/3455
摘要： The invention relates to a method for operating a magnetron sputter cathode, in particular a tube cathode or several tube cathodes forming an array. In such cathodes a target passes through a magnetic field, whereby induction currents flow in the target which distort the magnetic field. This results in the nonuniform coating of a substrate. By having the relative movement between magnetic field and target alternately reverse its direction, the effect of the magnetic field distortion can be compensated. This yields greater uniformity of the coating on a substrate to be coated.
摘要翻译：本发明涉及一种用于操作磁控溅射阴极的方法，特别是管阴极或形成阵列的多个管阴极。在这样的阴极中，目标通过磁场，由此感应电流流过靶，使磁场发生变形。这导致衬底的不均匀涂覆。通过使磁场和目标之间的相对运动交替地反转其方向，可以补偿磁场失真的影响。这样可以使待涂覆的基底上的涂层更均匀。

6. 发明申请

US20060254905A1 Method for operating a sputter cathode with a target 有权
公开(公告)号：US20060254905A1
公开(公告)日：2006-11-16
申请号：US11170640
申请日：2005-06-29
申请人： Stefan Bangert , Wolfgang Buschbeck , Markus Hanika , Karl-Albert Keim , Michael Konig , Jorg Krempel-Hesse , Andreas Lopp , Harald Rost , Jurgen Schroeder , Tobias Stolley
发明人： Stefan Bangert , Wolfgang Buschbeck , Markus Hanika , Karl-Albert Keim , Michael Konig , Jorg Krempel-Hesse , Andreas Lopp , Harald Rost , Jurgen Schroeder , Tobias Stolley
IPC分类号： C23C14/00
CPC分类号： H01J37/3405 , C23C14/352 , H01J37/3455
摘要： The invention relates to a method for operating a magnetron sputter cathode, in particular a tube cathode or several tube cathodes forming an array. In such cathodes a target passes through a magnetic field, whereby induction currents flow in the target which distort the magnetic field. This results in the nonuniform coating of a substrate. By having the relative movement between magnetic field and target alternately reverse its direction, the effect of the magnetic field distortion can be compensated. This yields greater uniformity of the coating on a substrate to be coated.

7. 发明授权

US08137510B2 Coater with a large-area assembly of rotatable magnetrons 有权
标题翻译：涂层机具有可旋转磁控管的大面积组件
公开(公告)号：US08137510B2
公开(公告)日：2012-03-20
申请号：US11121563
申请日：2005-05-04
申请人： Stefan Bangert , Frank Fuchs , Ralph Lindenberg , Andreas Lopp , Uwe Schüssler , Tobias Stolley
发明人： Stefan Bangert , Frank Fuchs , Ralph Lindenberg , Andreas Lopp , Uwe Schüssler , Tobias Stolley
IPC分类号： C23C14/00
CPC分类号： H01J37/3455 , C23C14/352 , C23C14/56 , H01J37/3405 , H01J2237/3325
摘要： This invention relates to a coater for the coating, in particular, of large-area substrates by means of cathode sputtering, the coater having a coating chamber and, provided therein, a cathode assembly (2) where the material to be sputtered is located on a target (4) with a curved surface, the material to be sputtered being located, in particular, on the lateral surface of a cylinder, there being in a single coating chamber for a coherent coating zone at least three, preferably more, cathode assemblies (2) with rotatable, curved targets (4) positioned one beside the other.
摘要翻译：本发明涉及一种用于通过阴极溅射涂覆，特别是大面积基板的涂布机，涂布机具有涂覆室，并且在其中设置阴极组件（2），其中待溅射的材料位于具有弯曲表面的靶（4），待溅射的材料特别地位于圆柱体的侧表面上，在单个涂覆室中用于粘附涂层区域，至少三个，优选更多的阴极组件（2）具有位于另一个旁边的可旋转的弯曲目标（4）。

8. 发明申请

US20050252768A1 Coater with a large-area assembly of rotatable magnetrons 有权
标题翻译：涂层机具有可旋转磁控管的大面积组件
公开(公告)号：US20050252768A1
公开(公告)日：2005-11-17
申请号：US11121563
申请日：2005-05-04
申请人： Stefan Bangert , Frank Fuchs , Ralph Lindenberg , Andreas Lopp , Uwe Schussler , Tobias Stolley
发明人： Stefan Bangert , Frank Fuchs , Ralph Lindenberg , Andreas Lopp , Uwe Schussler , Tobias Stolley
IPC分类号： C23C14/34 , C23C14/35 , C23C14/56 , H01J37/34 , C23C14/32
CPC分类号： H01J37/3455 , C23C14/352 , C23C14/56 , H01J37/3405 , H01J2237/3325
摘要： This invention relates to a coater for the coating, in particular, of large-area substrates by means of cathode sputtering, the coater having a coating chamber and, provided therein, a cathode assembly (2) where the material to be sputtered is located on a target (4) with a curved surface, the material to be sputtered being located, in particular, on the lateral surface of a cylinder, there being in a single coating chamber for a coherent coating zone at least three, preferably more, cathode assemblies (2) with rotatable, curved targets (4) positioned one beside the other.
摘要翻译：本发明涉及一种用于通过阴极溅射涂覆，特别是大面积基板的涂布机，涂布机具有涂覆室，并且在其中设置阴极组件（2），其中待溅射的材料位于具有弯曲表面的靶（4），待溅射的材料特别地位于圆柱体的侧表面上，在单个涂覆室中用于粘附涂层区域，至少三个，优选更多的阴极组件（2）具有位于另一个旁边的可旋转的弯曲目标（4）。

9. 发明申请

US20090178919A1 SPUTTER COATING DEVICE 审中-公开
标题翻译：飞溅涂料装置
公开(公告)号：US20090178919A1
公开(公告)日：2009-07-16
申请号：US12015329
申请日：2008-01-16
申请人： Andreas Lopp , Ralph Lindenberg
发明人： Andreas Lopp , Ralph Lindenberg
IPC分类号： C23C14/35
CPC分类号： C23C14/352 , C23C14/562 , H01J37/3405 , H01J37/3414 , H01J37/3423 , H01J37/3455
摘要： A sputter coating installation 1 comprises a vacuum chamber having an interior space 3′. The interior space 3′ of the vacuum chamber is defined by chamber walls 3. According to the present invention, an array of target units 9 is arranged in line inside the vacuum coating chamber. Particularly, the target units 9 are arranged tiltable relative to the vacuum chamber and relative to a transport path t of a substrate 2. The target units 9 are cathode units or magnetron units and comprise a target and a housing. The housing is attached to the target and defines an interior space of the target unit. Within the interior space of the target units a number of components are arranged, e.g. a combination of a magnet yoke and a magnet system, a magnet yoke drive, a cooling system (arranged near the target), an electric current supply for supplying energy for the sputter process, etc. The combination of the magnet yoke and the magnet system is movable on a linear path to perform a reciprocating movement relative to the target during the operation of the target unit. Outside the housing a vacuum pressure pv is generated vacuum pumps 5 arranged in a chamber wall 3c of the vacuum chamber behind the target units 9 for enabling the sputter coating process. In the interior space of the housing another pressure p may prevail, particularly a considerably higher pressure p. For example, the pressure p in the interior space of the housing may be an atmospheric pressure. Therefore, the housing provides a vacuum sealing of the interior space of the housing relative to the outside of the housing.
摘要翻译：溅射涂覆装置1包括具有内部空间3'的真空室。真空室的内部空间3'由室壁3限定。根据本发明，目标单元9的阵列在真空涂覆室内排成一列。特别地，目标单元9相对于真空室和相对于基板2的输送路径t倾斜布置。目标单元9是阴极单元或磁控管单元，并且包括目标和壳体。壳体附接到目标并且限定目标单元的内部空间。在目标单元的内部空间内，布置了多个部件，例如，磁轭和磁体系的组合，磁轭驱动器，冷却系统（配置在目标附近），用于为溅射处理提供能量的电流源等。磁轭和磁体系统的组合可在线性路径上移动，以在目标单元的操作期间相对于目标进行往复运动。在壳体的外部，产生真空压力pv，真空泵5布置在目标单元9后面的真空室的室壁3c中，以实现溅射涂覆过程。在外壳的内部空间中，另一个压力p可能占优势，特别是相当高的压力p。例如，壳体的内部空间中的压力p可以是大气压。因此，壳体相对于壳体的外部提供壳体的内部空间的真空密封。

10. 发明申请

US20110100799A1 SPUTTER DEPOSITION SYSTEM AND METHOD 审中-公开
标题翻译：溅射沉积系统和方法
公开(公告)号：US20110100799A1
公开(公告)日：2011-05-05
申请号：US12612651
申请日：2009-11-04
申请人： Andreas Lopp , Marcus Bender
发明人： Andreas Lopp , Marcus Bender
IPC分类号： C23C14/35
CPC分类号： H01J37/3405 , C23C14/351 , H01J37/347
摘要： A sputter deposition system adapted for depositing a thin film onto a substrate surface is provided. The system includes a cathode assembly having at least two cathode targets opposing the substrate surface and adapted for providing cathode material for forming the thin film. A plasma source is adapted for generating a plasma for sputtering cathode material off the at least two cathode targets. A magnetic field generator is adapted for providing a magnetic field which is controllable independently of the plasma source such that such that a difference between high deposition rate portions and low deposition rate portions is compensated by the action of the magnetic field on charged particle movements.
摘要翻译：提供了一种适用于将薄膜沉积到衬底表面上的溅射沉积系统。该系统包括阴极组件，其具有与衬底表面相对的至少两个阴极靶，并适于提供用于形成薄膜的阴极材料。等离子体源适于产生用于将阴极材料溅射出至少两个阴极靶的等离子体。磁场发生器适于提供可独立于等离子体源控制的磁场，使得通过磁场对带电粒子运动的作用来补偿高沉积速率部分和低沉积速率部分之间的差异。

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