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1. 发明申请

US20130284590A1 SYSTEMS AND METHODS FOR FORMING A LAYER OF SPUTTERED MATERIAL 审中-公开
标题翻译：用于形成溅射材料层的系统和方法
公开(公告)号：US20130284590A1
公开(公告)日：2013-10-31
申请号：US13876826
申请日：2011-07-22
申请人： Marcus Bender , Markus Hanika , Evelyn Scheer , Fabio Pieralisi , Guido Mahnke , Ralph Lindenberg , Andreas Lopp , Konrad Schwanitz , Jian Liu
发明人： Marcus Bender , Markus Hanika , Evelyn Scheer , Fabio Pieralisi , Guido Mahnke , Ralph Lindenberg , Andreas Lopp , Konrad Schwanitz , Jian Liu
IPC分类号： C23C14/35
CPC分类号： C23C14/352 , C23C14/35 , H01J37/34 , H01J37/3473
摘要： The present disclosure describes a method of coating a substrate, the method including forming a layer of sputtered material on the substrate. Forming the layer of sputtered material may include: sputtering material from at least one rotatable target over the substrate; varying the relative position between the at least one target and the substrate. In addition, the present disclosure describes varying the distance between a target and a substrate during the sputter process. The present disclosure further describes a system for coating a substrate.
摘要翻译：本公开描述了一种涂覆基底的方法，该方法包括在基底上形成溅射材料层。形成溅射材料层可以包括：从衬底上的至少一个可旋转靶溅射材料; 改变至少一个靶和衬底之间的相对位置。另外，本公开内容描述了在溅射过程期间改变靶和衬底之间的距离。本公开进一步描述了用于涂覆基底的系统。

2. 发明申请

US20140332369A1 MULTIDIRECTIONAL RACETRACK ROTARY CATHODE FOR PVD ARRAY APPLICATIONS 审中-公开
标题翻译： PVD阵列应用的多媒体旋转阴极
公开(公告)号：US20140332369A1
公开(公告)日：2014-11-13
申请号：US14353473
申请日：2011-10-11
申请人： Evelyn Scheer , Markus Hanika , Ralph Lindenberg , Marcus Bender , Andreas Lopp , Konrad Schwanitz , Fabio Pieralisi , Jian Liu
发明人： Evelyn Scheer , Markus Hanika , Ralph Lindenberg , Marcus Bender , Andreas Lopp , Konrad Schwanitz , Fabio Pieralisi , Jian Liu
IPC分类号： H01J37/32 , C23C14/35
CPC分类号： H01J37/32532 , C23C14/3407 , C23C14/35 , H01J37/3405 , H01J37/345 , H01J37/3452 , H01J37/3455
摘要： A cathode assembly for a sputter deposition apparatus and a method for coating a substrate is provided. The cathode assembly has a coating side for coating on a substrate. Further, the cathode assembly includes a rotary target assembly adapted for rotating a target material around a rotary axis; at least a first magnet having an inner magnet pole and at least one outer magnet poles and being adapted for generating one or more plasma regions. The cathode assembly has a first angular coordinate for a magnet pole, the magnet pole being provided for the coating side, and a second angular coordinate for a further magnet pole, the magnet pole being provided for the coating side; wherein the first angular coordinate and the second angular coordinate define an angle a larger than about 20 degrees and smaller than about 160 degrees.
摘要翻译：提供了一种用于溅射沉积设备的阴极组件和一种用于涂覆基底的方法。阴极组件具有用于在基板上涂覆的涂层侧。此外，阴极组件包括适于围绕旋转轴线旋转目标材料的旋转靶组件; 至少第一磁体，其具有内磁极和至少一个外磁极，并适于产生一个或多个等离子体区域。阴极组件具有用于磁极的第一角度坐标，为涂层侧提供磁极，并且为另一个磁极设置第二角坐标，为涂层侧提供磁极; 其中所述第一角坐标和所述第二角坐标限定大于约20度且小于约160度的角度。

3. 发明申请

US20120273343A1 METHOD FOR COATING A SUBSTRATE AND COATER 审中-公开
标题翻译：涂层和涂层的方法
公开(公告)号：US20120273343A1
公开(公告)日：2012-11-01
申请号：US13499651
申请日：2010-09-30
申请人： Marcus Bender , Markus Hanika , Evelyn Scheer , Fabio Pieralisi , Guido Mahnke
发明人： Marcus Bender , Markus Hanika , Evelyn Scheer , Fabio Pieralisi , Guido Mahnke
IPC分类号： C23C14/35
CPC分类号： H01J37/3405 , H01J37/3452 , H01J37/3455
摘要： A method is provided for coating a substrate (100) with a cathode assembly (10) having a rotatable target (20). The rotatable target has at least one magnet assembly (25) positioned there within. The method includes positioning the magnet assembly at a first position so that it is asymmetrically aligned with respect to a plane (22) perpendicularly extending from the substrate (100) to the axis (21) of the rotatable target for a predetermined first time interval; positioning the magnet assembly at a second position that is asymmetrically aligned with respect to said plane (22) for a predetermined second time interval; and providing a voltage to the rotatable target that is varied over time during coating. Further, a coater is provided that includes a cathode assembly with a rotatable curved target; and two magnet assemblies positioned within the rotatable curved target wherein the distance between the two magnet assemblies can be varied.
摘要翻译：提供了一种用具有可旋转靶（20）的阴极组件（10）涂覆基底（100）的方法。可旋转靶具有定位在其内的至少一个磁体组件（25）。该方法包括将磁体组件定位在第一位置，使得其相对于从基板（100）垂直延伸到可旋转靶的轴线（21）的平面（22）以预定的第一时间间隔对准地对准; 将磁体组件定位在相对于所述平面（22）不对称对准预定的第二时间间隔的第二位置处; 以及向涂覆期间随时间变化的可旋转靶提供电压。此外，提供一种包括具有可旋转弯曲目标的阴极组件的涂布机; 以及位于可旋转弯曲目标内的两个磁体组件，其中两个磁体组件之间的距离可以改变。

4. 发明授权

US08946059B2 Method and installation for producing a semiconductor device, and semiconductor device 有权
标题翻译：用于制造半导体器件的方法和装置以及半导体器件
公开(公告)号：US08946059B2
公开(公告)日：2015-02-03
申请号：US12603352
申请日：2009-10-21
申请人： Evelyn Scheer , Fabio Pieralisi , Marcus Bender
发明人： Evelyn Scheer , Fabio Pieralisi , Marcus Bender
IPC分类号： H01L21/20 , H01L29/45 , H01L21/677 , H01L29/49 , H01L29/66
CPC分类号： H01L29/458 , H01L21/6776 , H01L29/4908 , H01L29/66765
摘要： A method of producing a semiconductor device is provided, the semiconductor device including a substrate, a semiconductor layer and at least one metallization layer adjacent to at least one element chosen from the substrate and the semiconductor layer, the method including forming at least one metallization layer which, adjacent to at least one element chosen from the substrate and the semiconductor layer, includes oxygen.
摘要翻译：提供了一种制造半导体器件的方法，所述半导体器件包括衬底，半导体层和与从衬底和半导体层中选择的至少一种元素相邻的至少一个金属化层，所述方法包括形成至少一个金属化层其与从衬底和半导体层中选择的至少一种元素相邻，包括氧。

5. 发明申请

US20090114528A1 SPUTTER COATING DEVICE AND COATING METHOD 审中-公开
标题翻译：溅射涂层装置和涂层方法
公开(公告)号：US20090114528A1
公开(公告)日：2009-05-07
申请号：US11936586
申请日：2007-11-07
申请人： Ralph Lindenberg , Marcus Bender , Tobias Stolley , Andreas Kloeppel , Andreas Lopp , Christoph Moelle
发明人： Ralph Lindenberg , Marcus Bender , Tobias Stolley , Andreas Kloeppel , Andreas Lopp , Christoph Moelle
IPC分类号： C23C14/35
CPC分类号： C23C14/3407 , C23C14/35 , H01J37/3408 , H01J37/3452 , H01J37/3455
摘要： A magnet/target assembly 1 comprises a target 2 consisting of a plurality of (virtual) segments 2.1, 2.2, 2.3, 2.4, 2.5, 2.6 arranged side by side, each of them extending along the longitudinal axis x of the target 2. Each of the plurality of target segments 2.1, 2.2, 2.3, 2.4, 2.5, 2.6 has a magnet system 3.1, 3.2, 3.3, 3.4, 3.5, 3.6 attributed to the respective target segment. In an embodiment of the target/magnet assembly 1 according to the present invention the magnet systems 3.1, 3.2, 3.3, 3.4, 3.5, 3.6 are arranged mutually offset relative to their respective adjacent magnet systems 3.1, 3.2, 3.3, 3.4, 3.5 and 3.6, respectively, while scanning the target segments 2.1, 2.2, 2.3, 2.4, 2.5 and 2.6, respectively. Particularly, the first magnet system 3.1, the third magnet system 3.3 and the fifth magnet system 3.5 are a first group of magnet systems moving parallel and synchronously with each other, and the second magnet system 3.2, the forth magnet systems 3.4 and the sixth magnet system 3.6 are a second group of magnet systems moving parallel and synchronously with each other. The first, third and fifth magnet systems 3.1, 3.3, 3.5 are alternately arranged with the second, forth and sixth magnet systems 3.2, 3.4 and 3.6, respectively, in the lateral direction y of the target 2. The paths of movement of the magnet systems are arranged parallel. The first and second groups of magnet systems 3.1, 3.2, 3.3, 3.4, 3.5, 3.6 are arranged offset in a longitudinal direction x of the target 2, i.e. arranged with a distance d between the groups in the longitudinal direction x of the target 2.
摘要翻译：磁体/目标组件1包括由多个（虚拟）段2.1,2.2,2.3,2.4,2.5,2.6组成的目标2，每个段2.1,2.2,2.3,2.4,2.5,2.6每个都沿目标2的纵向轴线x延伸。每个多个目标段2.1,2.2,2.3,2.4,2.5,2.6具有归因于相应目标段的磁体系统3.1,3.2,3.3,3.4,3.5,3.6。在根据本发明的靶/磁体组件1的实施例中，磁体系统3.1,3.2,3.3,3.4,3.5,3.6相对于它们各自相邻的磁体系统3.1,3.2,3.3,3.4,3.5相互偏置地布置，并且 3.6，分别扫描目标段2.1,2.2,2.3,2.4,2.5和2.6。特别地，第一磁体系统3.1，第三磁体系统3.3和第五磁体系统3.5是彼此平行和同步移动的第一组磁体系统，第二磁体系统3.2，第四磁体系统3.4和第六磁体系统3.6是彼此平行和同步移动的第二组磁体系统。第一，第三和第五磁体系统3.1,3.3,3.5分别与目标2的横向y上的第二，第四和第六磁体系统3.2,3.4和3.6交替布置。磁体的运动路径系统并行排列。第一和第二组磁体系统3.1,3.2,3.3,3.4,3.5,3.6在目标2的纵向方向x上偏移布置，即，在目标2的纵向方向x上的组之间设置距离d 。

6. 发明申请

US20110100799A1 SPUTTER DEPOSITION SYSTEM AND METHOD 审中-公开
标题翻译：溅射沉积系统和方法
公开(公告)号：US20110100799A1
公开(公告)日：2011-05-05
申请号：US12612651
申请日：2009-11-04
申请人： Andreas Lopp , Marcus Bender
发明人： Andreas Lopp , Marcus Bender
IPC分类号： C23C14/35
CPC分类号： H01J37/3405 , C23C14/351 , H01J37/347
摘要： A sputter deposition system adapted for depositing a thin film onto a substrate surface is provided. The system includes a cathode assembly having at least two cathode targets opposing the substrate surface and adapted for providing cathode material for forming the thin film. A plasma source is adapted for generating a plasma for sputtering cathode material off the at least two cathode targets. A magnetic field generator is adapted for providing a magnetic field which is controllable independently of the plasma source such that such that a difference between high deposition rate portions and low deposition rate portions is compensated by the action of the magnetic field on charged particle movements.
摘要翻译：提供了一种适用于将薄膜沉积到衬底表面上的溅射沉积系统。该系统包括阴极组件，其具有与衬底表面相对的至少两个阴极靶，并适于提供用于形成薄膜的阴极材料。等离子体源适于产生用于将阴极材料溅射出至少两个阴极靶的等离子体。磁场发生器适于提供可独立于等离子体源控制的磁场，使得通过磁场对带电粒子运动的作用来补偿高沉积速率部分和低沉积速率部分之间的差异。

7. 发明申请

US20070022955A1 Vapor deposition device 审中-公开
标题翻译：气相沉积装置
公开(公告)号：US20070022955A1
公开(公告)日：2007-02-01
申请号：US11384016
申请日：2006-03-17
申请人： Marcus Bender , Uwe Hoffmann , Gunter Klemm , Dieter Haas , Ulrich Englert
发明人： Marcus Bender , Uwe Hoffmann , Gunter Klemm , Dieter Haas , Ulrich Englert
IPC分类号： C23C16/00
CPC分类号： C23C14/26 , C23C14/243
摘要： A vapor deposition device for the vapor deposition of a substrate, and specifically particular of a substrate comprising heat-sensitive substances, for example OLEDs. To keep heat away from these substances, the vapor deposition device includes an evaporator tube with a special nozzle bar. This nozzle bar, which comprises several linearly arranged openings, projects with respect to the evaporator tube in the direction toward the substrate to be coated.
摘要翻译：一种用于气相沉积基底的气相沉积装置，特别是包括热敏物质的基底，例如OLED。为了将热量远离这些物质，气相沉积装置包括具有特殊喷嘴杆的蒸发器管。该喷嘴杆包括几个线性排列的开口，相对于蒸发器管沿着待涂覆的基板的方向突出。

8. 发明申请

US20060130765A1 Arrangement for coating a substrate 有权
标题翻译：涂布基板的布置
公开(公告)号：US20060130765A1
公开(公告)日：2006-06-22
申请号：US11254425
申请日：2005-10-20
申请人： Uwe Hoffmann , Manfred Schreil , Jose Dieguez-Campo , Marcus Bender
发明人： Uwe Hoffmann , Manfred Schreil , Jose Dieguez-Campo , Marcus Bender
IPC分类号： C23C16/00
CPC分类号： C23C14/24 , F16K1/14
摘要： The invention relates to an arrangement for the coating of substrates, which comprises an evaporation source and a vapor barrier between the evaporation source and the substrate. The vapor barrier is maintained at a temperature which is at least equal to or above the vaporization temperature of the material to be vaporized. The vapor barrier is implemented as a quartz valve, which includes a spherical closure part connected with a movable rod. In a first position this spherical closure part closes a vapor conducting tube, which is connected with the evaporation source, and, in a second position, the spherical closure part abuts a spherical calotte which seals off a quartz tube.
摘要翻译：本发明涉及一种用于涂覆基底的布置，其包括蒸发源和蒸发源与基底之间的蒸汽屏障。蒸汽屏障保持在至少等于或高于要蒸发的材料的蒸发温度的温度。蒸汽屏障被实施为石英阀，其包括与可动杆连接的球形封闭部件。在第一位置，该球形封闭部分封闭与蒸发源连接的蒸气导管，并且在第二位置，球形封闭部分邻接密封石英管的球形电缆。

9. 发明授权

US10818475B2 AC power connector, sputtering apparatus and method therefor 有权
公开(公告)号：US10818475B2
公开(公告)日：2020-10-27
申请号：US15105894
申请日：2013-12-18
申请人： Frank Schnappenberger , Anke Hellmich , Stefan Keller , Marcus Bender
发明人： Frank Schnappenberger , Anke Hellmich , Stefan Keller , Marcus Bender
IPC分类号： H01J37/34 , H01J37/32 , H01G5/12 , C23C14/34 , H03H7/00 , H01G5/04
摘要： An AC power connector for connecting an AC power supply with a device is provided. The AC power connector includes at least one first element connectable with the AC power supply and at least one second element connectable with the device, the first element and the second elements being arranged at a first distance with respect to each other for defining a capacitance, wherein the at least one first element and the at least one second element are rotatable with respect to each other, wherein the first element and the second element are configured for a transfer of an AC power between the at least one first element and the at least one second element.

10. 发明申请

US20070298159A1 ORGANIC EVAPORATOR, COATING INSTALLATION, AND METHOD FOR USE THEREOF 审中-公开
标题翻译：有机蒸发器，涂装安装及其使用方法
公开(公告)号：US20070298159A1
公开(公告)日：2007-12-27
申请号：US11757061
申请日：2007-06-01
申请人： Marcus Bender , Guido Hattendorf
发明人： Marcus Bender , Guido Hattendorf
IPC分类号： C23C16/52
CPC分类号： C23C14/544 , C23C14/12 , C23C14/243
摘要： An organic evaporator for applying organic vapor to a substrate at a coating rate, the organic evaporator comprising a distribution pipe with at least one nozzle outlet; and a measurement device for acquiring measurement data about at least one characteristic property of the organic vapor.
摘要翻译：一种有机蒸发器，用于以涂覆速率将有机蒸气施加到基底上，所述有机蒸发器包括具有至少一个喷嘴出口的分配管; 以及用于获取关于有机蒸气的至少一种特性的测量数据的测量装置。

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