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1. 发明申请

US20140326645A1 LIQUID PURIFICATION SYSTEM 有权
标题翻译：液体净化系统
公开(公告)号：US20140326645A1
公开(公告)日：2014-11-06
申请号：US13887338
申请日：2013-05-05
申请人： Marc Kenneth Chason , Daniel Roman Gamota , Rick Latella
发明人： Marc Kenneth Chason , Daniel Roman Gamota , Rick Latella
IPC分类号： C02F1/00
CPC分类号： C02F1/505 , C02F2201/009 , C02F2209/008 , C02F2209/36 , C02F2303/04 , C02F2307/02 , C02F2307/04 , Y02A20/212
摘要： A liquid purification system is provided. Although not limited to water, the purification system is especially suitable for water. The purification system utilizes a vessel having antimicrobial inner wall load bearing surfaces and/or antimicrobial (antibacterial, anti-fungal, anti-mold, etc.) interior non-load bearing surfaces. When the liquid moves within the vessel and contacts the antimicrobial surfaces, the liquid becomes purified or sanitized. The inner wall load bearing surfaces and non-load bearing interior surfaces of the vessel may be manufactured from a host polymer that has antimicrobial organo-metallic additives which form a solid-solution with the host polymer and are distributed homogeneously throughout the host polymer. The host polymer matrix may be an organic material, an inorganic material or an organic-inorganic material blend. The antimicrobial agent polymer matrix may be located in localized zones within the vessel.
摘要翻译：提供液体净化系统。净化系统虽然不限于水，但特别适用于水。净化系统利用具有抗微生物内壁承载表面和/或抗微生物（抗菌，抗真菌，防霉等）内部非承载表面的容器。当液体在容器内移动并接触抗微生物表面时，液体被净化或消毒。容器的内壁承载表面和非承载内表面可以由具有抗微生物有机金属添加剂的主体聚合物制造，所述主体聚合物与主体聚合物形成固溶体并且均匀分布在整个主体聚合物中。主体聚合物基质可以是有机材料，无机材料或有机 - 无机材料混合物。抗微生物剂聚合物基质可以位于容器内的局部区域中。

2. 发明申请

US20140099252A1 System and method for supplying hydrogen and deuterium to lenr and e-cat based energy generating systems 审中-公开
标题翻译：用于向lenr和e-cat为基础的能量产生系统供应氢和氘的系统和方法
公开(公告)号：US20140099252A1
公开(公告)日：2014-04-10
申请号：US13573857
申请日：2012-10-09
申请人： Marc Kenneth Chason , Daniel Roman Gamota , Rick Latella
发明人： Marc Kenneth Chason , Daniel Roman Gamota , Rick Latella
IPC分类号： C01B4/00 , C01B3/32 , C01B3/26
CPC分类号： C01B4/00 , C01B3/042 , C01B3/24 , C01B3/26 , C01B3/32 , C01B2203/0266 , C01B2203/0805 , C25B1/04 , Y02E60/364 , Y02E60/366
摘要： An approach for supplying hydrogen and/or deuterium to LENR and E-Cat based energy generating systems includes receiving a source material that is rich in hydrogen and/or deuterium. A gaseous form of at least one of those elements is extracted from the source material via electrochemical dissociation, hydrocarbon recovery, or a suitable mechanical process. The gaseous form of the element is preferably filtered to remove water vapor and other impurities before being pressurized and supplied to the energy generating system. Advantages of the approach include enhanced safety and system portability due to elimination of a need for pressurized gas storage tanks.
摘要翻译：向LENR和基于E-Cat的能量产生系统供应氢和/或氘的方法包括接收富含氢和/或氘的源材料。通过电化学解离，烃回收或合适的机械方法，从源材料中提取至少一种元素的气态形式。元件的气体形式优选地被过滤以在加压之前除去水蒸汽和其它杂质，并将其供应到能量产生系统。该方法的优点包括增强安全性和系统可移植性，因为不需要加压气体储存罐。

3. 发明申请

US20140199358A1 ANTIMICROBIAL POLYMER SYSTEMS USING MULTIFUNCTIONAL ORGANOMETALLIC ADDITIVES FOR THERMOSET HOSTS 审中-公开
标题翻译：使用多功能有机元素添加剂进行温室效应的抗微生物聚合物体系
公开(公告)号：US20140199358A1
公开(公告)日：2014-07-17
申请号：US13833581
申请日：2013-03-15
申请人： MARC CHASON , Daniel Roman Gamota , Rick Latella
发明人： MARC CHASON , Daniel Roman Gamota , Rick Latella
IPC分类号： A01N55/02
CPC分类号： A01N55/02 , A01N37/02 , A01N59/16 , A01N59/20 , A01N25/10
摘要： Described are antimicrobial polymer products made from mixtures of antimicrobial organometallic additives dispersed throughout a polymer host matrix.
摘要翻译：描述的是由分散在聚合物主体基质中的抗微生物有机金属添加剂的混合物制成的抗微生物聚合物产品。

4. 发明授权

US09138000B2 Antimicrobial polymer systems using multifunctional organometallic additives for wax hosts 有权
标题翻译：用于蜡主体的多功能有机金属添加剂的抗微生物聚合物体系
公开(公告)号：US09138000B2
公开(公告)日：2015-09-22
申请号：US13833689
申请日：2013-03-15
申请人： Marc Chason , Daniel Roman Gamota , Rick Latella
发明人： Marc Chason , Daniel Roman Gamota , Rick Latella
IPC分类号： A01N55/02 , A01N37/02 , A01N59/16 , A01N59/20
CPC分类号： A01N55/02 , A01N37/02 , A01N59/16 , A01N59/20 , A01N25/10
摘要： Described are antimicrobial polymer products made from mixtures of antimicrobial organometallic additives dispersed throughout a polymer host matrix.
摘要翻译：描述了由分散在聚合物主体基质中的抗微生物有机金属添加剂的混合物制成的抗微生物聚合物产品。

5. 发明授权

US6156408A Device for reworkable direct chip attachment 失效
标题翻译：可再加工的直接芯片连接装置
公开(公告)号：US6156408A
公开(公告)日：2000-12-05
申请号：US920441
申请日：1997-08-29
申请人： Wen Xu Zhou , Daniel Roman Gamota , Sean Xin Wu , Chao-pin Yeh , Karl W. Wyatt , Chowdary Ramesh Koripella
发明人： Wen Xu Zhou , Daniel Roman Gamota , Sean Xin Wu , Chao-pin Yeh , Karl W. Wyatt , Chowdary Ramesh Koripella
IPC分类号： H01L21/60 , H01L23/16 , H05K1/02 , H05K3/34 , B32B3/10
CPC分类号： H01L24/81 , H01L23/16 , H05K1/0271 , H01L2224/05571 , H01L2224/05573 , H01L2224/10165 , H01L2224/81136 , H01L2224/8114 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K2201/10674 , H05K2201/2009 , H05K2201/2018 , H05K2203/176 , H05K3/3436 , H05K3/3452 , Y10S428/901 , Y10T428/24273
摘要： The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.
摘要翻译：用于可再加工的直接芯片附接的方法（400,500）和装置（200）包括热机械和机械稳定的焊接接头，用于在电路板的顶表面上布置连接焊盘以便于电子元件的连接，并且固定加强件具有孔以将焊接接头容纳到电路板的顶表面以便于将连接焊盘焊接到电子元件上，其中，所述加强件限制电路板的变形以提供可靠的焊点，并且便于将电子元件从电路板。

6. 发明授权

US5704116A Method of holding a component using an anhydride fluxing agent 失效
标题翻译：使用酸酐助熔剂保持组分的方法
公开(公告)号：US5704116A
公开(公告)日：1998-01-06
申请号：US642708
申请日：1996-05-03
申请人： Daniel Roman Gamota , Steven Lewis Wille , Steven Michael Scheifers , Michael Hertsberg
发明人： Daniel Roman Gamota , Steven Lewis Wille , Steven Michael Scheifers , Michael Hertsberg
IPC分类号： B23K35/36 , H01L21/56 , H05K3/34 , H05K3/30
CPC分类号： H05K3/3489 , B23K35/3612 , H01L21/563 , H01L24/29 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/14 , H05K3/3431 , Y10T29/49144 , Y10T29/49146
摘要： A solution (20) is dispensed onto bond pads (18) on a substrate (14). An integrated circuit component (12) that includes solder bumps (16) formed on component bond pads (30) is superposed onto the substrate (14) such that the solder bumps (16) rest against the bond pads (18). The solution (20) includes an anhydride compound that acts as a fluxing agent. The subassembly (11) is heated to a temperature sufficient to bond the solder bumps (16) to the bond pads (18) to form solder bump interconnections (26). During the bonding process, the fluxing agent substantially vaporizes and leaves virtually no residue on the substrate (14) to allow the component (12) to be effectively underfilled with a polymeric encapsulant (24).
摘要翻译：将溶液（20）分配到衬底（14）上的接合焊盘（18）上。包括形成在部件接合焊盘（30）上的焊料凸块（16）的集成电路部件（12）被叠加在基板（14）上，使得焊料凸块（16）靠在接合焊盘（18）上。溶液（20）包括用作助熔剂的酸酐化合物。子组件（11）被加热到足以将焊料凸块（16）接合到焊盘（18）的温度，以形成焊料凸点互连（26）。在粘合过程中，助熔剂基本上蒸发并且在基材（14）上几乎不留下残余物，以允许组分（12）用聚合物密封剂（24）有效地未充满。

7. 发明授权

US6034333A Frame embedded in a polymeric encapsulant 失效
标题翻译：框架嵌入聚合物密封剂
公开(公告)号：US6034333A
公开(公告)日：2000-03-07
申请号：US975720
申请日：1997-11-21
申请人： Andrew F. Skipor , Daniel Roman Gamota , Chao-Pin Yeh , Karl W. Wyatt , Wen Xu Zhou
发明人： Andrew F. Skipor , Daniel Roman Gamota , Chao-Pin Yeh , Karl W. Wyatt , Wen Xu Zhou
IPC分类号： H01L21/56 , H01L23/00 , H05K1/16
CPC分类号： H01L23/562 , H01L21/563 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2224/73203 , H01L2924/01322 , Y10T29/49144
摘要： A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34), not in direct contact with the board (14), and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).
摘要翻译：微电子组件（10）包括安装到印刷电路板（14）的集成电路管芯（12）。集成电路管芯（12）覆盖印刷电路板（14），并且包括面向印刷电路板（14）的有效面（26），并通过间隙（30）与其间隔开。多个焊料凸点互连（32）跨过间隙（30）延伸并且将多个板接合焊盘（22）与多个管芯接合焊盘（28）连接。聚合物前体（13）围绕集成电路管芯（12）分配到印刷电路板（14）上并且可固化以形成聚合密封剂（16）。聚合物前体（13）被拉入间隙（30）并形成覆盖印刷电路板（14）的圆角（34）。框架（18）嵌入在圆角（34）中，不与板（14）直接接触，并且聚合物前体（13）被加热以固化聚合物前体（13）以形成聚合物密封剂（16）。框架（18）固定在聚合物密封剂（16）内的印刷电路板（14）上，以为微电子组件（10）提供增加的机械强度。

8. 发明授权

US5682066A Microelectronic assembly including a transparent encapsulant 失效
标题翻译：微电子组件包括透明密封剂
公开(公告)号：US5682066A
公开(公告)日：1997-10-28
申请号：US689585
申请日：1996-08-12
申请人： Daniel Roman Gamota , Alan G. Chen , Michael Hertsberg
发明人： Daniel Roman Gamota , Alan G. Chen , Michael Hertsberg
IPC分类号： H01L21/56 , H01L21/60 , H01L33/54 , H01L33/62 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L33/54 , H01L21/563 , H01L24/81 , H01L2224/16 , H01L2224/73203 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L33/62
摘要： A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) and spaced apart by a gap (30). Solder bump interconnections (32) extend across the gap (30) and physically attach and electrically connect an electrical circuit on the substrate (14) to an electrical circuit on the integrated circuit die (12). The gap (30) is filled with a transparent encapsulant (16) to protect the solder bump interconnections (32). The transparent encapsulant (16) is composed of a polymeric matrix and filler particles dispersed in the matrix. The polymeric matrix and the filler particles have substantially similar indices of refraction, thereby making the encapsulant (16) transparent. The integrated circuit die (12) includes light emitting diodes (18) that transmit light toward the transparent substrate (14) to form a display. The substrate (12) is preferably formed of transparent glass, and the filler particles are preferably formed of a composition similar to the transparent glass substrate (14) to allow light generated by the light emitting diodes (18) to pass through the encapsulant (16) and the substrate (14).
摘要翻译：微电子组件（10）包括安装在衬底（14）上并由间隙（30）隔开的集成电路管芯（12）。焊接凸块互连（32）跨越间隙（30）延伸并物理地将基板（14）上的电路电连接到集成电路管芯（12）上的电路。间隙（30）填充有透明密封剂（16）以保护焊料凸点互连（32）。透明密封剂（16）由聚合物基质和分散在基质中的填料颗粒组成。聚合物基质和填料颗粒具有基本相似的折射率，从而使密封剂（16）透明。集成电路管芯（12）包括向所述透明衬底（14）透射光以形成显示器的发光二极管（18）。基板（12）优选由透明玻璃形成，并且填料颗粒优选由类似于透明玻璃基板（14）的组合物形成，以允许由发光二极管（18）产生的光通过密封剂（16））和基板（14）。

9. 发明授权

US5930598A Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same 失效
标题翻译：包括可分解密封剂的微电子组件及其形成和重新加工的方法
公开(公告)号：US5930598A
公开(公告)日：1999-07-27
申请号：US120164
申请日：1998-07-21
申请人： Steven Lewis Wille , Daniel Roman Gamota , Colleen Mary Walsh
发明人： Steven Lewis Wille , Daniel Roman Gamota , Colleen Mary Walsh
IPC分类号： H01L21/56 , H05K3/28 , H01L23/28
CPC分类号： H01L21/563 , H01L24/28 , H05K3/284 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/14
摘要： A microelectronic assembly (10) includes an integrated circuit component (14) spaced apart from a substrate (12) by a gap filled with a polymeric encapsulant (18). The polymeric encapsulant (18) contains a thermally decomposable azide group. In the event that it is necessary to remove the component (14), such as if the component (14) is found to be defective, the microelectronic assembly (10) is heated to a temperature above the decomposition temperature of the azide group. Decomposition of the azide group disintegrates the encapsulant (18) and preferably detaches the component from the substrate (12), thereby permitting replacement of the component (14).
摘要翻译：微电子组件（10）包括通过填充有聚合物密封剂（18）的间隙与基底（12）间隔开的集成电路部件（14）。聚合物密封剂（18）含有可热分解的叠氮化物基团。在需要去除部件（14）的情况下，例如如果发现部件（14）有缺陷，则将微电子组件（10）加热到高于叠氮化物组分解温度的温度。叠氮化物基团的分解使密封剂（18）分解，并且优选将组分从基材（12）分离，从而允许组分（14）的更换。

10. 发明授权

US5804881A Method and assembly for providing improved underchip encapsulation 失效
公开(公告)号：US5804881A
公开(公告)日：1998-09-08
申请号：US562861
申请日：1995-11-27
申请人： Steven Lewis Wille , Daniel Roman Gamota
发明人： Steven Lewis Wille , Daniel Roman Gamota
IPC分类号： H01L21/56 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/563 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83102 , H01L2224/92125 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/14
摘要： A microelectronic assembly (10) includes a printed circuit board (12) that includes a substrate (14) having a die attach region (22) and a plurality of first bond pads (24) disposed and spaced apart at the die attach region (22). A channel (26) effective in improving fluid flow extends across the die attach region (22) apart from the first bond pads (24). An integrated circuit die (16) is mounted onto the printed circuit board (12) and includes a major face (28) facing the substrate (14) and spaced apart therefrom by a gap (30) and second bond pads (25) disposed on the major face (28) in a pattern such that each of the second bond pads (25) registers with a first bond pad (24). Solder bump interconnections (18) connect the first bond pads (24) to the second bond pads (25). Encapsulant (20) is disposed within the gap (30) and flows over the substrate (14) and the channel (26) to encapsulate the solder bump interconnections (18). Channel 26 enhances the flow of the precursor (19) in the gap (30) prior to curing the precursor (19) to form the encapsulant (20).

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