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    • 6. 发明申请
    • LIQUID PURIFICATION SYSTEM
    • 液体净化系统
    • US20140326645A1
    • 2014-11-06
    • US13887338
    • 2013-05-05
    • Marc Kenneth ChasonDaniel Roman GamotaRick Latella
    • Marc Kenneth ChasonDaniel Roman GamotaRick Latella
    • C02F1/00
    • C02F1/505C02F2201/009C02F2209/008C02F2209/36C02F2303/04C02F2307/02C02F2307/04Y02A20/212
    • A liquid purification system is provided. Although not limited to water, the purification system is especially suitable for water. The purification system utilizes a vessel having antimicrobial inner wall load bearing surfaces and/or antimicrobial (antibacterial, anti-fungal, anti-mold, etc.) interior non-load bearing surfaces. When the liquid moves within the vessel and contacts the antimicrobial surfaces, the liquid becomes purified or sanitized. The inner wall load bearing surfaces and non-load bearing interior surfaces of the vessel may be manufactured from a host polymer that has antimicrobial organo-metallic additives which form a solid-solution with the host polymer and are distributed homogeneously throughout the host polymer. The host polymer matrix may be an organic material, an inorganic material or an organic-inorganic material blend. The antimicrobial agent polymer matrix may be located in localized zones within the vessel.
    • 提供液体净化系统。 净化系统虽然不限于水,但特别适用于水。 净化系统利用具有抗微生物内壁承载表面和/或抗微生物(抗菌,抗真菌,防霉等)内部非承载表面的容器。 当液体在容器内移动并接触抗微生物表面时,液体被净化或消毒。 容器的内壁承载表面和非承载内表面可以由具有抗微生物有机金属添加剂的主体聚合物制造,所述主体聚合物与主体聚合物形成固溶体并且均匀分布在整个主体聚合物中。 主体聚合物基质可以是有机材料,无机材料或有机 - 无机材料混合物。 抗微生物剂聚合物基质可以位于容器内的局部区域中。
    • 7. 发明授权
    • Frame embedded in a polymeric encapsulant
    • 框架嵌入聚合物密封剂
    • US6034333A
    • 2000-03-07
    • US975720
    • 1997-11-21
    • Andrew F. SkiporDaniel Roman GamotaChao-Pin YehKarl W. WyattWen Xu Zhou
    • Andrew F. SkiporDaniel Roman GamotaChao-Pin YehKarl W. WyattWen Xu Zhou
    • H01L21/56H01L23/00H05K1/16
    • H01L23/562H01L21/563H01L2224/05568H01L2224/05573H01L2224/056H01L2224/16H01L2224/73203H01L2924/01322Y10T29/49144
    • A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34), not in direct contact with the board (14), and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).
    • 微电子组件(10)包括安装到印刷电路板(14)的集成电路管芯(12)。 集成电路管芯(12)覆盖印刷电路板(14),并且包括面向印刷电路板(14)的有效面(26),并通过间隙(30)与其间隔开。 多个焊料凸点互连(32)跨过间隙(30)延伸并且将多个板接合焊盘(22)与多个管芯接合焊盘(28)连接。 聚合物前体(13)围绕集成电路管芯(12)分配到印刷电路板(14)上并且可固化以形成聚合密封剂(16)。 聚合物前体(13)被拉入间隙(30)并形成覆盖印刷电路板(14)的圆角(34)。 框架(18)嵌入在圆角(34)中,不与板(14)直接接触,并且聚合物前体(13)被加热以固化聚合物前体(13)以形成聚合物密封剂(16) 。 框架(18)固定在聚合物密封剂(16)内的印刷电路板(14)上,以为微电子组件(10)提供增加的机械强度。
    • 10. 发明授权
    • Assembly having a frame embedded in a polymeric encapsulant and method
for forming same
    • 具有嵌入聚合物密封剂中的框架的组件及其形成方法
    • US5720100A
    • 1998-02-24
    • US581695
    • 1995-12-29
    • Andrew F. SkiporDaniel Roman GamotaChao-Pin YehKarl W. WyattWen Xu Zhou
    • Andrew F. SkiporDaniel Roman GamotaChao-Pin YehKarl W. WyattWen Xu Zhou
    • H01L21/56H01L23/00H05K3/34
    • H01L23/562H01L21/563H01L2224/05568H01L2224/05573H01L2224/056H01L2224/16H01L2224/73203H01L2924/01322Y10T29/49144
    • A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34) and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).
    • 微电子组件(10)包括安装到印刷电路板(14)的集成电路管芯(12)。 集成电路管芯(12)覆盖印刷电路板(14),并且包括面向印刷电路板(14)的有效面(26),并通过间隙(30)与其间隔开。 多个焊料凸点互连(32)跨过间隙(30)延伸并且将多个板接合焊盘(22)与多个管芯接合焊盘(28)连接。 聚合物前体(13)围绕集成电路管芯(12)分配到印刷电路板(14)上并且可固化以形成聚合密封剂(16)。 聚合物前体(13)被拉入间隙(30)并形成覆盖印刷电路板(14)的圆角(34)。 将框架(18)嵌入在圆角(34)中,并且加热聚合物前体(13)以固化聚合物前体(13)以形成聚合物密封剂(16)。 框架(18)固定在聚合物密封剂(16)内的印刷电路板(14)上,以为微电子组件(10)提供增加的机械强度。