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1. 发明申请

US20070059961A1 Electrical connector for interconnection assembly 有权
标题翻译：电气连接器用于互连组件
公开(公告)号：US20070059961A1
公开(公告)日：2007-03-15
申请号：US11476831
申请日：2006-06-29
申请人： Marc Cartier , Brian Kirk
发明人： Marc Cartier , Brian Kirk
IPC分类号： H01R4/60
CPC分类号： H01R13/6474 , H01R12/585 , H01R13/6587
摘要： An electrical connector that includes a dielectric housing and at least one pair of signal conductors adapted to mate with a printed circuit board. The pair of signal conductors include first and second conductors. The first conductor includes a first mating portion, a first contact portion remote from the first mating portion, and a the intermediate portion therebetween. The second conductor includes a second mating portion, a second contact portion remote from the second mating portion, and a second intermediate portion therebetween. Each of the first and second mating portions define a mating portion axis and each of the first and second contact portions define a contact portion axis. The contact portion axes are offset from the mating portion axis.
摘要翻译：一种电连接器，包括绝缘壳体和适于与印刷电路板配合的至少一对信号导体。一对信号导体包括第一和第二导体。第一导体包括第一配合部分，远离第一配合部分的第一接触部分和它们之间的中间部分。第二导体包括第二配合部分，远离第二配合部分的第二接触部分和它们之间的第二中间部分。第一和第二配合部分中的每一个限定配合部分轴线，并且第一和第二接触部分中的每一个限定接触部分轴线。接触部分轴线从配合部分轴线偏移。

2. 发明申请

US20070218765A1 High speed, high density electrical connector 有权
标题翻译：高速，高密度电连接器
公开(公告)号：US20070218765A1
公开(公告)日：2007-09-20
申请号：US11635090
申请日：2006-12-07
申请人： Thomas Cohen , Brian Kirk , Marc Cartier
发明人： Thomas Cohen , Brian Kirk , Marc Cartier
IPC分类号： H01R13/648
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译：电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声在晶片中产生。晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。

3. 发明申请

US20070004282A1 HIGH SPEED HIGH DENSITY ELECTRICAL CONNECTOR 有权
标题翻译：高速高密度电气连接器
公开(公告)号：US20070004282A1
公开(公告)日：2007-01-04
申请号：US11183564
申请日：2005-07-18
申请人： Thomas Cohen , Brian Kirk , Marc Cartier
发明人： Thomas Cohen , Brian Kirk , Marc Cartier
IPC分类号： H01R13/648
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译：电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声在晶片中产生。晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。

4. 发明申请

US20070149057A1 Midplane especially applicable to an orthogonal architecture electronic system 有权
标题翻译：中平面特别适用于正交架构电子系统
公开(公告)号：US20070149057A1
公开(公告)日：2007-06-28
申请号：US11522530
申请日：2006-09-18
申请人： Thomas Cohen , Marc Cartier , Mark Gailus
发明人： Thomas Cohen , Marc Cartier , Mark Gailus
IPC分类号： H01R13/648
CPC分类号： H05K7/1445 , H01R13/514 , H01R13/6587 , H01R13/6591 , H05K1/0231 , H05K1/0237 , H05K1/116 , H05K1/14 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
摘要翻译：中平面具有连接第一差分连接器的接触端的第一侧和与第二差分连接器的接触端连接的第一侧相对的第二侧。中平面包括从第一侧延伸到第二侧的多个通孔，其中通孔在第一侧上提供第一信号发射，而第二信号在第二侧上发射。第一信号发射被设置成多行，每行具有沿着第一线的第一信号发射，并且第一信号沿着基本上平行于第一线的第二线发射。第二信号发射被提供在多列中，每列具有沿着第三线的第二信号发射，而第二信号沿着基本上平行于第三线的第四线发射。

5. 发明申请

US20060024984A1 Midplane especially applicable to an orthogonal architecture electronic system 有权
公开(公告)号：US20060024984A1
公开(公告)日：2006-02-02
申请号：US11173927
申请日：2005-07-01
申请人： Thomas Cohen , Marc Cartier , Mark Gallus
发明人： Thomas Cohen , Marc Cartier , Mark Gallus
IPC分类号： H01R12/00
CPC分类号： H05K7/1445 , H01R13/514 , H01R13/6587 , H01R13/6591 , H05K1/0231 , H05K1/0237 , H05K1/116 , H05K1/14 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

6. 发明授权

US06452379B1 Methods and apparatus for connecting to a signal launch 失效
标题翻译：用于连接信号发射的方法和装置
公开(公告)号：US06452379B1
公开(公告)日：2002-09-17
申请号：US09692916
申请日：2000-10-20
申请人： Marc Cartier
发明人： Marc Cartier
IPC分类号： G01R3102
CPC分类号： G01R1/06772
摘要： The invention is directed to techniques for connecting to a signal launch using a radio frequency (RF) probe having a flat-faced side with a ground post extending from a non-peripheral region (e.g., an intermediate region between a central region and a peripheral region of the flat-faced side). The use of such a probe alleviates the need to use many RF connectors permanently mounted to signal launches on a circuit board since the probe of the invention can be temporarily connected to the signal launches without such connectors. Furthermore, the ground post of the invention probe can be configured (e.g., positioned relative to a signal post) to avoid large inductance loops thus preserving signal integrity. One arrangement of the invention is directed to an RF probe for connecting to a signal launch. The RF probe includes a cabling portion for coupling to a cable, and a base portion attached to the cabling portion. The base portion has a flat-faced side that faces the signal launch when the RF probe connects to the signal launch. The flat-faced side has (i) a central region, (ii) an outer region that extends along a periphery of the flat-faced side, and (iii) an intermediate region disposed between the central region and the outer region. The RF probe further includes a signal post for connecting to a signal conductor of the signal launch and a ground post for connecting to a ground conductor of the signal launch, when the radio frequency probe connects to the signal launch. The signal post extends from the central region of the flat-faced side of the base portion. The ground post extends from the intermediate region of the flat-faced side of the base portion.
摘要翻译：本发明涉及用于使用射频（RF）探针连接到信号发射的技术，所述射频（RF）探针具有从非周边区域（例如，中心区域和外围区域之间的中间区域）延伸的接地端面平面侧的区域）。使用这样的探头减轻了使用永久安装的许多RF连接器来将信号发射在电路板上的需要，因为本发明的探头可以临时连接到没有这种连接器的信号发射。此外，本发明探针的接地柱可以被配置（例如，相对于信号柱定位），以避免大的电感环路，从而保持信号完整性。本发明的一种布置涉及用于连接到信号发射的RF探针。 RF探针包括用于耦合到电缆的布线部分和附接到布线部分的基部。当RF探头连接到信号发射时，基部具有面向信号发射的平面侧。平面侧具有（i）中心区域，（ii）沿着平面侧的周边延伸的外部区域，以及（iii）设置在中心区域和外部区域之间的中间区域。当射频探头连接到信号发射时，RF探头还包括用于连接到信号发射的信号导体的信号柱和用于连接到信号发射的接地导体的接地柱。信号柱从基部的平面侧的中心区域延伸。接地柱从基部的平面侧的中间区域延伸。

7. 发明申请

US20050048817A1 HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR 有权
标题翻译：高速，高密度电气连接器
公开(公告)号：US20050048817A1
公开(公告)日：2005-03-03
申请号：US10675647
申请日：2003-09-03
申请人： Thomas Cohen , Marc Cartier , John Dunham , Jason Payne
发明人： Thomas Cohen , Marc Cartier , John Dunham , Jason Payne
IPC分类号： H01R12/16 , H01R13/648
CPC分类号： H01R13/6585 , H01R12/585
摘要： In one embodiment of the invention, there is disclosed an electrical connector connectable to a printed circuit board, the electrical connector having an insulative housing including side walls and a base. The electrical connector also includes signal conductors and ground conductors. Each of the signal conductors and ground conductors has a first contact end connectable to the printed circuit board, a second contact end, and an intermediate portion therebetween that is disposed in the base of the insulative housing. The signal conductors and the ground conductors are arranged in a plurality of rows, with each row having signal conductors and ground conductors. For each of the plurality of rows, there is a corresponding ground strip positioned adjacent thereto disposed in the base of the insulative housing. And the ground strip is electrically connected to the ground conductors of the row.
摘要翻译：在本发明的一个实施例中，公开了可连接到印刷电路板的电连接器，该电连接器具有包括侧壁和底座的绝缘外壳。电连接器还包括信号导体和接地导体。信号导体和接地导体中的每一个具有可连接到印刷电路板的第一接触端，第二接触端及其间的中间部分，其设置在绝缘壳体的基部中。信号导体和接地导体配置成多行，每行具有信号导体和接地导体。对于多行中的每一行，存在相邻设置在绝缘壳体的基部中的对应的接地条。并且接地条电连接到该行的接地导体。

8. 发明授权

US06717398B2 Signal launch connecting techniques 失效
标题翻译：信号发射连接技术
公开(公告)号：US06717398B2
公开(公告)日：2004-04-06
申请号：US10200788
申请日：2002-07-22
申请人： Marc Cartier
发明人： Marc Cartier
IPC分类号： G01R3102
CPC分类号： G01R1/06772
摘要： A technique provides a radio frequency probe. The technique involves obtaining a surface mount connector having a flat-faced side that includes (i) a central region, (ii) a conductive outer region that extends along a periphery of the flat-faced side, and (iii) a conductive intermediate region disposed between the central region and the conductive outer region. The conductive outer region and the conductive intermediate region are electrically connected with each other. The technique further involves forming a cavity within the surface mount connector through the conductive intermediate region of the flat-faced side of the surface mount connector, and installing an end of a ground post within the cavity formed within the surface mount connector.
摘要翻译：一种技术提供射频探针。该技术涉及获得具有平面侧的表面安装连接器，其包括（i）中心区域，（ii）沿着平面侧的周边延伸的导电外部区域，以及（iii）导电中间区域设置在中心区域和导电外部区域之间。导电外部区域和导电中间区域彼此电连接。该技术还包括通过表面安装连接器的平面侧的导电中间区域在表面安装连接器内形成空腔，并将接地柱的端部安装在形成在表面安装连接器内的空腔内。

9. 发明申请

US20050070160A1 HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR ASSEMBLY 有权
标题翻译：高速，高密度电气连接器总成
公开(公告)号：US20050070160A1
公开(公告)日：2005-03-31
申请号：US10675087
申请日：2003-09-30
申请人： Thomas Cohen , Marc Cartier , John Dunham , Jason Payne
发明人： Thomas Cohen , Marc Cartier , John Dunham , Jason Payne
IPC分类号： H01R12/16 , H01R13/648
CPC分类号： H01R12/724 , H01R13/6585 , Y10S439/947
摘要： There is disclosed an electrical connector assembly having a first electrical connector mateable to a second electrical connector. In one embodiment, the first electrical connector includes a plurality of wafers, with each wafer having an insulative housing, a plurality of signal conductors and a shield plate. A portion of the shield plate is exposed so that a conductive member can electrically connect the shield plates of the wafers at the exposed portion of the shield plate. In one embodiment, the second electrical connector includes an insulative housing, and a plurality of signal conductors and ground conductors in a plurality of rows. Each row corresponds to a wafer of the first electrical connector. Each signal conductor has a contact tail and each ground conductors has two contact tails. The signal conductors and the ground conductors are positioned adjacent to one another so that for each signal conductor contact tail, there are ground conductor contact tails adjacent either side of the signal conductor contact tail.
摘要翻译：公开了一种具有可与第二电连接器配合的第一电连接器的电连接器组件。在一个实施例中，第一电连接器包括多个晶片，每个晶片具有绝缘壳体，多个信号导体和屏蔽板。屏蔽板的一部分被暴露，使得导电构件可以在屏蔽板的暴露部分处电连接晶片的屏蔽板。在一个实施例中，第二电连接器包括绝缘壳体，以及多个信号导体和多行中的接地导体。每行对应于第一电连接器的晶片。每个信号导体具有接触尾部，并且每个接地导体具有两个接触尾部。信号导体和接地导体彼此相邻地定位，使得对于每个信号导体接触尾部，在信号导体接触尾部的任一侧具有接地导体接触尾部。

10. 发明授权

US06639154B1 Apparatus for forming a connection between a circuit board and a connector, having a signal launch 失效
标题翻译：用于形成电路板和连接器之间的连接器的装置，具有信号发射
公开(公告)号：US06639154B1
公开(公告)日：2003-10-28
申请号：US09685306
申请日：2000-10-10
申请人： Marc Cartier , Mark Gailus
发明人： Marc Cartier , Mark Gailus
IPC分类号： H05K103
CPC分类号： H05K1/0222 , H01R12/718 , H01R24/50 , H01R2103/00 , H05K3/3447 , H05K2201/09618 , H05K2201/09809 , H05K2201/10189 , H05K2201/10303
摘要： A circuit board includes (i) a section of circuit board material having a signal conductor, a ground conductor, and dielectric material that separates the signal conductor and the ground conductor, and (ii) a signal launch. The signal launch includes a signal via that contacts the signal conductor and the dielectric material of the section of circuit board material, a first set of ground vias and a second set of ground vias. The ground vias contact the ground conductor and the dielectric material of the section of circuit board material. The first set of ground vias is disposed a first radial distance from the signal via. The second set of ground vias is disposed a second radial distance from the signal via. A coaxial connector mounts to the signal launch of the circuit board in order to provide electrical access to the signal and ground conductors.
摘要翻译：电路板包括（i）具有分离信号导体和接地导体的信号导体，接地导体和介电材料的电路板材料的一部分，以及（ii）信号发射。信号发射包括接触信号导体和电路板材料部分的介电材料的信号通路，第一组接地通孔和第二组接地通路。接地导体与接地导体和电路板材料部分的介电材料接触。第一组接地通孔设置在与信号通孔相距的第一径向距离处。第二组接地通孔设置在与信号通孔相距的第二径向距离处。同轴连接器安装到电路板的信号发射，以便提供对信号和接地导体的电接入。

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