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    • 1. 发明申请
    • High speed, high density electrical connector
    • 高速,高密度电连接器
    • US20070218765A1
    • 2007-09-20
    • US11635090
    • 2006-12-07
    • Thomas CohenBrian KirkMarc Cartier
    • Thomas CohenBrian KirkMarc Cartier
    • H01R13/648
    • H01R12/727H01R12/585H01R12/724H01R13/514H01R13/516H01R13/6461H01R13/6587H01R13/6599H01R43/16H01R43/24Y10T29/4922
    • An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
    • 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片,其中导电颗粒被布置在其中,从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性,同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性,从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中,并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接(例如,模制)到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙,从而进一步降低电噪声或其他损耗(例如串扰),而不会牺牲显着的信号强度。
    • 2. 发明申请
    • HIGH SPEED HIGH DENSITY ELECTRICAL CONNECTOR
    • 高速高密度电气连接器
    • US20070004282A1
    • 2007-01-04
    • US11183564
    • 2005-07-18
    • Thomas CohenBrian KirkMarc Cartier
    • Thomas CohenBrian KirkMarc Cartier
    • H01R13/648
    • H01R12/727H01R12/585H01R12/724H01R13/514H01R13/516H01R13/6461H01R13/6587H01R13/6599H01R43/16H01R43/24Y10T29/4922
    • An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
    • 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片,其中导电颗粒被布置在其中,从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性,同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性,从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中,并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接(例如,模制)到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙,从而进一步降低电噪声或其他损耗(例如串扰),而不会牺牲显着的信号强度。
    • 3. 发明申请
    • HIGH SPEED CONNECTOR ASSEMBLY
    • 高速连接器总成
    • US20050136739A1
    • 2005-06-23
    • US10744328
    • 2003-12-23
    • Donald MilbrandThomas Cohen
    • Donald MilbrandThomas Cohen
    • H01R12/16H01R13/502H01R13/648
    • H01R12/737H01R12/712H01R12/721H01R13/502H01R13/6585
    • There is disclosed a two-piece electrical connector assembly having a first electrical connector and a second electrical connector. The first electrical connector includes a plurality of first signal conductors disposed along first and second sides of a first insulative housing and first ground plates disposed along the first and second sides of the first insulative housing and positioned adjacent the plurality of first signal conductors. The first electrical connector defines a slot for receiving an edge of a first printed circuit board. The second electrical connector includes a plurality of second signal conductors disposed along first and second sides of a second insulative housing and second ground plates disposed along the first and second sides of the second insulative housing and positioned adjacent the plurality of second signal conductors. Each of the second ground plates has a surface with a first edge and a second edge, at least one of the first edge or the second edge being bent in the direction toward the corresponding second signal conductor. When the first electrical connector and the second electrical connector are mated, the first signal conductors and corresponding second signal conductors are substantially enclosed and shielded by the first and second ground plates.
    • 公开了一种具有第一电连接器和第二电连接器的两件式电连接器组件。 第一电连接器包括沿着第一绝缘壳体的第一和第二侧布置的多个第一信号导体和沿着第一绝缘壳体的第一和第二侧布置并且邻近多个第一信号导体定位的第一接地板。 第一电连接器限定用于接收第一印刷电路板的边缘的槽。 第二电连接器包括沿着第二绝缘壳体的第一和第二侧布置的多个第二信号导体和沿着第二绝缘壳体的第一和第二侧布置并且邻近多个第二信号导体定位的第二接地板。 每个第二接地板具有具有第一边缘和第二边缘的表面,第一边缘或第二边缘中的至少一个沿着朝向相应的第二信号导体的方向弯曲。 当第一电连接器和第二电连接器配合时,第一信号导体和对应的第二信号导体基本上被第一和第二接地板封闭和屏蔽。
    • 4. 发明申请
    • HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR ASSEMBLY
    • 高速,高密度电气连接器总成
    • US20050070160A1
    • 2005-03-31
    • US10675087
    • 2003-09-30
    • Thomas CohenMarc CartierJohn DunhamJason Payne
    • Thomas CohenMarc CartierJohn DunhamJason Payne
    • H01R12/16H01R13/648
    • H01R12/724H01R13/6585Y10S439/947
    • There is disclosed an electrical connector assembly having a first electrical connector mateable to a second electrical connector. In one embodiment, the first electrical connector includes a plurality of wafers, with each wafer having an insulative housing, a plurality of signal conductors and a shield plate. A portion of the shield plate is exposed so that a conductive member can electrically connect the shield plates of the wafers at the exposed portion of the shield plate. In one embodiment, the second electrical connector includes an insulative housing, and a plurality of signal conductors and ground conductors in a plurality of rows. Each row corresponds to a wafer of the first electrical connector. Each signal conductor has a contact tail and each ground conductors has two contact tails. The signal conductors and the ground conductors are positioned adjacent to one another so that for each signal conductor contact tail, there are ground conductor contact tails adjacent either side of the signal conductor contact tail.
    • 公开了一种具有可与第二电连接器配合的第一电连接器的电连接器组件。 在一个实施例中,第一电连接器包括多个晶片,每个晶片具有绝缘壳体,多个信号导体和屏蔽板。 屏蔽板的一部分被暴露,使得导电构件可以在屏蔽板的暴露部分处电连接晶片的屏蔽板。 在一个实施例中,第二电连接器包括绝缘壳体,以及多个信号导体和多行中的接地导体。 每行对应于第一电连接器的晶片。 每个信号导体具有接触尾部,并且每个接地导体具有两个接触尾部。 信号导体和接地导体彼此相邻地定位,使得对于每个信号导体接触尾部,在信号导体接触尾部的任一侧具有接地导体接触尾部。
    • 5. 发明授权
    • High speed, high density electrical connector
    • 高速,高密度电连接器
    • US5993259A
    • 1999-11-30
    • US797537
    • 1997-02-07
    • Philip T. StokoeThomas CohenSteven J. Allen
    • Philip T. StokoeThomas CohenSteven J. Allen
    • H01R12/50H01R13/514H01R43/16H01R13/648
    • H01R13/514H01R23/688H01R12/716H01R12/724H01R13/6587H01R43/16
    • A high speed, high density electrical connector for use with printed circuit boards. The connector is in two pieces with one piece having pins and shield plates and the other having socket type signal contacts and shield plates. The shields have a grounding arrangement which is adapted to control the electromagnetic fields, for various system architectures, simultaneous switching configurations and signal speeds, allowing all of the socket type signal contacts to be used for signal transmission. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer. This construction allows very close spacing between adjacent columns of signal contacts as well as tightly controlled spacing between the signal contacts and the shields. It also allows for easy and flexible manufacture, such as a connector that has wafers intermixed in a configuration to accommodate single ended, point to point and differential applications.
    • 用于印刷电路板的高速,高密度电连接器。 连接器为两片,一片具有销和屏蔽板,另一个具有插座型信号触点和屏蔽板。 屏蔽件具有适于控制电磁场的接地装置,用于各种系统架构,同时开关配置和信号速度,允许将所有插座型信号触点用于信号传输。 另外,至少一片连接器由晶片制成,每个接地平面和信号柱都注射成型,当被组合时形成晶片。 这种结构允许在相邻的信号触点列之间具有非常紧密的间隔,以及在信号触头和屏蔽之间的紧密控制的间隔。 它还允许简单和灵活的制造,例如具有在配置中混合以适应单端,点对点和差分应用的晶片的连接器。