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    • 5. 发明申请
    • HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
    • 高速,高密度电气连接器
    • US20050048817A1
    • 2005-03-03
    • US10675647
    • 2003-09-03
    • Thomas CohenMarc CartierJohn DunhamJason Payne
    • Thomas CohenMarc CartierJohn DunhamJason Payne
    • H01R12/16H01R13/648
    • H01R13/6585H01R12/585
    • In one embodiment of the invention, there is disclosed an electrical connector connectable to a printed circuit board, the electrical connector having an insulative housing including side walls and a base. The electrical connector also includes signal conductors and ground conductors. Each of the signal conductors and ground conductors has a first contact end connectable to the printed circuit board, a second contact end, and an intermediate portion therebetween that is disposed in the base of the insulative housing. The signal conductors and the ground conductors are arranged in a plurality of rows, with each row having signal conductors and ground conductors. For each of the plurality of rows, there is a corresponding ground strip positioned adjacent thereto disposed in the base of the insulative housing. And the ground strip is electrically connected to the ground conductors of the row.
    • 在本发明的一个实施例中,公开了可连接到印刷电路板的电连接器,该电连接器具有包括侧壁和底座的绝缘外壳。 电连接器还包括信号导体和接地导体。 信号导体和接地导体中的每一个具有可连接到印刷电路板的第一接触端,第二接触端及其间的中间部分,其设置在绝缘壳体的基部中。 信号导体和接地导体配置成多行,每行具有信号导体和接地导体。 对于多行中的每一行,存在相邻设置在绝缘壳体的基部中的对应的接地条。 并且接地条电连接到该行的接地导体。
    • 6. 发明申请
    • High speed, high density electrical connector
    • 高速,高密度电连接器
    • US20070218765A1
    • 2007-09-20
    • US11635090
    • 2006-12-07
    • Thomas CohenBrian KirkMarc Cartier
    • Thomas CohenBrian KirkMarc Cartier
    • H01R13/648
    • H01R12/727H01R12/585H01R12/724H01R13/514H01R13/516H01R13/6461H01R13/6587H01R13/6599H01R43/16H01R43/24Y10T29/4922
    • An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
    • 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片,其中导电颗粒被布置在其中,从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性,同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性,从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中,并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接(例如,模制)到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙,从而进一步降低电噪声或其他损耗(例如串扰),而不会牺牲显着的信号强度。
    • 7. 发明申请
    • HIGH SPEED HIGH DENSITY ELECTRICAL CONNECTOR
    • 高速高密度电气连接器
    • US20070004282A1
    • 2007-01-04
    • US11183564
    • 2005-07-18
    • Thomas CohenBrian KirkMarc Cartier
    • Thomas CohenBrian KirkMarc Cartier
    • H01R13/648
    • H01R12/727H01R12/585H01R12/724H01R13/514H01R13/516H01R13/6461H01R13/6587H01R13/6599H01R43/16H01R43/24Y10T29/4922
    • An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
    • 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片,其中导电颗粒被布置在其中,从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性,同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性,从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中,并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接(例如,模制)到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙,从而进一步降低电噪声或其他损耗(例如串扰),而不会牺牲显着的信号强度。
    • 8. 发明申请
    • HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR ASSEMBLY
    • 高速,高密度电气连接器总成
    • US20050070160A1
    • 2005-03-31
    • US10675087
    • 2003-09-30
    • Thomas CohenMarc CartierJohn DunhamJason Payne
    • Thomas CohenMarc CartierJohn DunhamJason Payne
    • H01R12/16H01R13/648
    • H01R12/724H01R13/6585Y10S439/947
    • There is disclosed an electrical connector assembly having a first electrical connector mateable to a second electrical connector. In one embodiment, the first electrical connector includes a plurality of wafers, with each wafer having an insulative housing, a plurality of signal conductors and a shield plate. A portion of the shield plate is exposed so that a conductive member can electrically connect the shield plates of the wafers at the exposed portion of the shield plate. In one embodiment, the second electrical connector includes an insulative housing, and a plurality of signal conductors and ground conductors in a plurality of rows. Each row corresponds to a wafer of the first electrical connector. Each signal conductor has a contact tail and each ground conductors has two contact tails. The signal conductors and the ground conductors are positioned adjacent to one another so that for each signal conductor contact tail, there are ground conductor contact tails adjacent either side of the signal conductor contact tail.
    • 公开了一种具有可与第二电连接器配合的第一电连接器的电连接器组件。 在一个实施例中,第一电连接器包括多个晶片,每个晶片具有绝缘壳体,多个信号导体和屏蔽板。 屏蔽板的一部分被暴露,使得导电构件可以在屏蔽板的暴露部分处电连接晶片的屏蔽板。 在一个实施例中,第二电连接器包括绝缘壳体,以及多个信号导体和多行中的接地导体。 每行对应于第一电连接器的晶片。 每个信号导体具有接触尾部,并且每个接地导体具有两个接触尾部。 信号导体和接地导体彼此相邻地定位,使得对于每个信号导体接触尾部,在信号导体接触尾部的任一侧具有接地导体接触尾部。