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    • 3. 发明申请
    • METHOD OF FABRICATING A MRAM DEVICE
    • 制造MRAM器件的方法
    • US20050214953A1
    • 2005-09-29
    • US10811553
    • 2004-03-29
    • Heon LeeThomas AnthonyManish Sharma
    • Heon LeeThomas AnthonyManish Sharma
    • H01L21/8246H01L27/22H01L43/12H01L21/336
    • H01L27/222H01L43/12
    • A method of fabricating a magnetic random access memory (MRAM) device is disclosed. The method reduces the number of mask steps and processing steps required to fabricate the MRAM device. A first conductive layer and a sense layer are patterned in a first mask step. A subsequent etching step forms a bottom electrode and a sense layer that are continuous with each other in a first direction. A second conductive layer and a plurality of layers of material required to form a magnetic tunnel junction stack are patterned in a second mask step. A subsequent etching step forms a top electrode and a plurality of layers of material that are continuous with each other in a second direction, and a plurality of discrete sense layers. The discrete sense layers and the plurality of layers of material define a plurality of magnetic tunnel junction devices.
    • 公开了制造磁随机存取存储器(MRAM)装置的方法。 该方法减少了制造MRAM设备所需的掩模步骤和处理步骤的数量。 第一导电层和感测层在第一掩模步骤中被图案化。 随后的蚀刻步骤形成在第一方向上彼此连续的底部电极和感测层。 在第二掩模步骤中图案化形成磁性隧道结叠层所需的第二导电层和多层材料。 随后的蚀刻步骤形成在第二方向上彼此连续的顶部电极和多个材料层,以及多个离散感测层。 离散感测层和多层材料限定了多个磁性隧道结装置。