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1. 发明申请

US20050011612A1 Plasma etching apparatus and plasma etching method 审中-公开
标题翻译：等离子体蚀刻装置和等离子体蚀刻方法
公开(公告)号：US20050011612A1
公开(公告)日：2005-01-20
申请号：US10787461
申请日：2004-02-27
申请人： Mamoru Yakushiji , Yutaka Ohmoto , Ryooji Fukuyama , Katsuya Watanabe
发明人： Mamoru Yakushiji , Yutaka Ohmoto , Ryooji Fukuyama , Katsuya Watanabe
IPC分类号： H01L21/3065 , H01J37/32 , H01L21/00 , H01L21/311 , C23F1/00
CPC分类号： H01L21/67069 , H01J37/32431 , H01J2237/022 , H01L21/31138
摘要： An apparatus for etching an organic film that is capable of suppressing the amount of contaminants adhered to the etched substrate without deteriorating the etching properties or processing profile of the film, comprising disposing a ring formed of a semiconductor material on the outer circumference of a substrate to be processed, and applying a bias voltage to the ring.
摘要翻译：一种用于蚀刻有机膜的装置，其能够抑制粘附到蚀刻的基板上的污染物的量，而不会劣化该膜的蚀刻性能或处理轮廓，包括将由半导体材料形成的环设置在基板的外周上至并对环施加偏置电压。

2. 发明授权

US07026252B2 Etching aftertreatment method 失效
标题翻译：蚀刻后处理方法
公开(公告)号：US07026252B2
公开(公告)日：2006-04-11
申请号：US10372271
申请日：2003-02-25
申请人： Michinobu Mizumura , Ryouji Fukuyama , Mamoru Yakushiji , Yutaka Ohmoto , Katsuya Watanabe
发明人： Michinobu Mizumura , Ryouji Fukuyama , Mamoru Yakushiji , Yutaka Ohmoto , Katsuya Watanabe
IPC分类号： H01L21/302
CPC分类号： H01L21/31116 , H01L21/31138 , H01L21/76802
摘要： After etching a Si-containing low permittivity insulating film with chlorine based gas, the etched wafer is subjected to an etching aftertreatment process comprising introducing oxygen gas to a vacuum processing chamber with a pressure as low as 0.2 Pa to 1 Pa and a flow rate as low as 5 cc to 20 cc/min, generating plasma within the chamber, heating the wafer 2 being subjected to aftertreatment between 50° C. and 200° C., applying a wafer bias power within the range of 50 W to 200 W, and exposing the wafer to the generated plasma, thereby simultaneously removing the photoresist components, the antireflection film components and the halogen components.
摘要翻译：在用含氯气体蚀刻含Si低介电常数绝缘膜之后，对经蚀刻的晶片进行蚀刻后处理，其中包括将氧气引入至低至0.2Pa至1Pa的压力的真空处理室中，流速为低至5cc至20cc / min，在室内产生等离子体，加热晶片2在50℃和200℃之间进行后处理，将晶片偏置功率施加在50W至200W的范围内，并将晶片暴露于产生的等离子体，从而同时去除光致抗蚀剂组分，抗反射膜组分和卤素组分。

3. 发明申请

US20110297082A1 PLASMA PROCESSING APPARATUS AND SAMPLE STAGE 有权
标题翻译：等离子体加工设备和样品台
公开(公告)号：US20110297082A1
公开(公告)日：2011-12-08
申请号：US12854242
申请日：2010-08-11
申请人： Tomoyuki Watanabe , Mamoru Yakushiji , Yutaka Ohmoto
发明人： Tomoyuki Watanabe , Mamoru Yakushiji , Yutaka Ohmoto
IPC分类号： C23C4/00
CPC分类号： C23C28/00 , C23C4/02
摘要： A plasma processing apparatus includes a metallic basic material arranged in a sample stage, a dielectric film of dielectric material disposed on an upper surface of the basic material, the dielectric film being formed through a plasma spray process; a film-shaped heater disposed in the dielectric film, the heater being formed through a plasma spray process; an adhesive layer arranged on the dielectric film; a sintered ceramic plate having a thickness ranging from about 0.2 mm to about 0.4 mm, the sintered ceramic plate being adhered onto the dielectric film by the adhesive layer; a sensor disposed in the basic material for sensing a temperature; and a controller for receiving an output from the sensor and adjusting quantity of heat generated by the heater.
摘要翻译：等离子体处理装置包括布置在样品台中的金属基材，设置在基材的上表面上的电介质材料的电介质膜，电介质膜通过等离子体喷涂法形成; 设置在电介质膜中的膜状加热器，加热器通过等离子体喷涂工艺形成; 布置在电介质膜上的粘合剂层; 烧结陶瓷板的厚度范围为约0.2mm至约0.4mm，烧结陶瓷板通过粘合剂层粘附到电介质膜上; 设置在基本材料中以感测温度的传感器; 以及控制器，用于接收来自传感器的输出并调节由加热器产生的热量。

4. 发明申请

US20080280451A1 Plasma processing method and plasma processing apparatus 失效
标题翻译：等离子体处理方法和等离子体处理装置
公开(公告)号：US20080280451A1
公开(公告)日：2008-11-13
申请号：US12073048
申请日：2008-02-28
申请人： Yutaka Ohmoto , Mamoru Yakushiji , Yutaka Kouzuma , Ken Yoshioka , Tsunehiko Tsubone
发明人： Yutaka Ohmoto , Mamoru Yakushiji , Yutaka Kouzuma , Ken Yoshioka , Tsunehiko Tsubone
IPC分类号： H01L21/3065
CPC分类号： H01L21/67109 , H01J2237/2001 , H01L21/67248
摘要： A plasma processing apparatus includes: a film which is made of an insulative material and constructs a surface of a sample stage on which a sample is put; a disk-shaped member whose upper surface is joined with the film in a lower portion of the film and which is made of a heat conductive member; heaters which are arranged in the film and arranged in a center portion and regions of its outer peripheral side of the film; coolant channels which are arranged in the disk-shaped member and in which a coolant for cooling the disk-shaped member flows; a plurality of power sources each of which adjusts an electric power to each of the heaters in the plurality of regions; and a controller which adjusts outputs from the plurality of power sources by using a result obtained by presuming a temperature of the upper surface of the disk-shaped member.
摘要翻译：一种等离子体处理装置，包括：由绝缘材料制成的薄膜，构成放置样品的样品台的表面; 其上表面与膜接合在膜的下部并由导热构件制成的盘状构件; 加热器布置在膜中并且布置在膜的中心部分和其外周侧的区域中; 布置在盘状构件中并且用于冷却盘形构件的冷却剂流过的冷却剂通道; 多个电源，其各自调整对所述多个区域中的每个所述加热器的电力; 以及控制器，其通过使用通过假设盘状构件的上表面的温度获得的结果来调整来自多个电源的输出。

5. 发明申请

US20090218316A1 MANUFACTURING METHOD IN PLASMA PROCESSING APPARATUS 有权
标题翻译：等离子体加工设备的制造方法
公开(公告)号：US20090218316A1
公开(公告)日：2009-09-03
申请号：US12038841
申请日：2008-02-28
申请人： Yutaka KOUZUMA , Yutaka Ohmoto , Mamoru Yakushiji , Ken Yoshioka , Tsunehiko Tsubone
发明人： Yutaka KOUZUMA , Yutaka Ohmoto , Mamoru Yakushiji , Ken Yoshioka , Tsunehiko Tsubone
IPC分类号： C23F1/00
CPC分类号： H01L21/67103 , H01J2237/2001 , H01L21/67248
摘要： A manufacturing method includes steps of: placing a film composed of dielectric, on the top surface of a sample stage, forming a film-like heater on the film made of the dielectric, supplying power to the heater to detect a temperature distribution, adjusting a resistance value of the heater on the basis of a result of detection of a temperature distribution so that the temperature distribution has a predetermined value, and then forming the film composed of the dielectric, on the heater.
摘要翻译：一种制造方法包括以下步骤：将由电介质组成的膜放置在样品台的顶表面上，在由电介质制成的膜上形成膜状加热器，向加热器供电以检测温度分布，调节基于温度分布的检测结果使加热器的电阻值，使得温度分布具有预定值，然后在加热器上形成由电介质组成的膜。

6. 发明授权

US08092637B2 Manufacturing method in plasma processing apparatus 有权
标题翻译：等离子体处理装置的制造方法
公开(公告)号：US08092637B2
公开(公告)日：2012-01-10
申请号：US12038841
申请日：2008-02-28
申请人： Yutaka Kouzuma , Yutaka Ohmoto , Mamoru Yakushiji , Ken Yoshioka , Tsunehiko Tsubone
发明人： Yutaka Kouzuma , Yutaka Ohmoto , Mamoru Yakushiji , Ken Yoshioka , Tsunehiko Tsubone
IPC分类号： C23F1/00 , H01L21/306
CPC分类号： H01L21/67103 , H01J2237/2001 , H01L21/67248
摘要： A manufacturing method includes steps of: placing a film composed of dielectric, on the top surface of a sample stage, forming a film-like heater on the film made of the dielectric, supplying power to the heater to detect a temperature distribution, adjusting a resistance value of the heater on the basis of a result of detection of a temperature distribution so that the temperature distribution has a predetermined value, and then forming the film composed of the dielectric, on the heater.
摘要翻译：一种制造方法包括以下步骤：将由电介质组成的膜放置在样品台的顶表面上，在由电介质制成的膜上形成膜状加热器，向加热器供电以检测温度分布，调节基于温度分布的检测结果使加热器的电阻值，使得温度分布具有预定值，然后在加热器上形成由电介质组成的膜。

7. 发明授权

US07009714B2 Method of dry etching a sample and dry etching system 失效
标题翻译：干法蚀刻样品和干蚀刻系统的方法
公开(公告)号：US07009714B2
公开(公告)日：2006-03-07
申请号：US10372838
申请日：2003-02-26
申请人： Yutaka Ohmoto , Ryouji Fukuyama , Mamoru Yakushiji
发明人： Yutaka Ohmoto , Ryouji Fukuyama , Mamoru Yakushiji
IPC分类号： G01B9/02
CPC分类号： H01L21/31138 , G01B11/0625 , G01B11/0683 , G01N21/4788 , G01N21/9501 , H01L21/67069
摘要： A process recipe is controlled by processing reflection interference light on the surface of a wafer with a signal and etching is carried out by suppressing an increase in the surface roughness of the wafer during etching. That is, a dry etching method for use in a dry etching system comprising means of treating a sample by generating plasma in a vacuum process chamber and monitor means of monitoring the reflection interference light of the sample to be treated, the method comprising the step of detecting the spectrum of reflection interference light on the surface of the sample to be treated, the step of obtaining a residual from curve fit between a theoretical value estimated from the film reflection model of the surface of the wafer and the spectrum of reflection interference light, and the step of judging whether the residual from the curve fit falls within a predetermined value.
摘要翻译：通过用信号处理晶片表面上的反射干涉光来控制工艺配方，并且通过抑制蚀刻期间晶片的表面粗糙度的增加来进行蚀刻。也就是说，干蚀刻系统中使用的干法蚀刻方法，包括在真空处理室中产生等离子体处理样品和监测待处理样品的反射干涉光的监测装置的方法，该方法包括以下步骤：检测待处理样品的表面上的反射干涉光的光谱，从由晶片表面的膜反射模型估计出的理论值与反射干涉光的光谱之间的曲线拟合的残差获得的步骤，以及判断曲线拟合的残差是否落在预定值内的步骤。

8. 发明授权

US07122479B2 Etching processing method 失效
标题翻译：蚀刻加工方法
公开(公告)号：US07122479B2
公开(公告)日：2006-10-17
申请号：US10228917
申请日：2002-08-28
申请人： Yutaka Ohmoto , Ryouji Fukuyama , Mamoru Yakushiji , Michinobu Mizumura
发明人： Yutaka Ohmoto , Ryouji Fukuyama , Mamoru Yakushiji , Michinobu Mizumura
IPC分类号： H01L21/302
CPC分类号： H01J37/32082 , H01J2237/3342 , H01L21/31116 , H01L21/31138
摘要： An etching processing method capable of etching a low dielectric constant layer at a reduced cost by using an etching processing apparatus comprising a vacuum vessel, a sample loading electrode disposed in the vacuum vessel, a gas introduction device for introducing a reaction gas into the vacuum vessel, an antenna for forming plasmas in the vacuum vessel, and a high frequency power supply for supplying a bias power to a sample loaded on the sample loading electrode, wherein the bias power to be supplied to the sample is 3 W/cm2 or less, and the gas introduction device introduces a gas containing chlorine atoms or bromine atoms to apply etching processing to an inorganic insulation material of low dielectric constant loaded on the loading electrode.
摘要翻译：一种蚀刻处理方法，其能够通过使用包括真空容器，设置在真空容器中的样品加载电极的蚀刻处理装置，以较低的成本蚀刻低介电常数层，将反应气体引入真空容器中的气体引入装置，用于在真空容器中形成等离子体的天线和用于向装载在样本加载电极上的样品提供偏置功率的高频电源，其中待提供给样品的偏置功率为3W / 2以下，气体引入装置引入含有氯原子或溴原子的气体，对负载在负载电极上的低介电常数的无机绝缘材料进行蚀刻处理。

9. 发明授权

US09150967B2 Plasma processing apparatus and sample stage 有权
标题翻译：等离子体处理装置和样品台
公开(公告)号：US09150967B2
公开(公告)日：2015-10-06
申请号：US12854242
申请日：2010-08-11
申请人： Tomoyuki Watanabe , Mamoru Yakushiji , Yutaka Ohmoto
发明人： Tomoyuki Watanabe , Mamoru Yakushiji , Yutaka Ohmoto
IPC分类号： C23C4/00 , C23C28/00 , C23C4/02
CPC分类号： C23C28/00 , C23C4/02
摘要： A plasma processing apparatus includes a metallic basic material arranged in a sample stage, a dielectric film of dielectric material disposed on an upper surface of the basic material, the dielectric film being formed through a plasma spray process; a film-shaped heater disposed in the dielectric film, the heater being formed through a plasma spray process; an adhesive layer arranged on the dielectric film; a sintered ceramic plate having a thickness ranging from about 0.2 mm to about 0.4 mm, the sintered ceramic plate being adhered onto the dielectric film by the adhesive layer; a sensor disposed in the basic material for sensing a temperature; and a controller for receiving an output from the sensor and adjusting quantity of heat generated by the heater.
摘要翻译：等离子体处理装置包括布置在样品台中的金属基材，设置在基材的上表面上的电介质材料的电介质膜，电介质膜通过等离子体喷涂法形成; 设置在电介质膜中的膜状加热器，加热器通过等离子体喷涂工艺形成; 布置在电介质膜上的粘合剂层; 烧结陶瓷板的厚度范围为约0.2mm至约0.4mm，烧结陶瓷板通过粘合剂层粘附到电介质膜上; 设置在基本材料中以感测温度的传感器; 以及控制器，用于接收来自传感器的输出并调节由加热器产生的热量。

10. 发明授权

US08282848B2 Plasma processing method and plasma processing apparatus 失效
标题翻译：等离子体处理方法和等离子体处理装置
公开(公告)号：US08282848B2
公开(公告)日：2012-10-09
申请号：US12073048
申请日：2008-02-28
申请人： Yutaka Ohmoto , Mamoru Yakushiji , Yutaka Kouzuma , Ken Yoshioka , Tsunehiko Tsubone
发明人： Yutaka Ohmoto , Mamoru Yakushiji , Yutaka Kouzuma , Ken Yoshioka , Tsunehiko Tsubone
IPC分类号： G01L21/30 , G01R31/00 , C23F1/00 , H01L21/306
CPC分类号： H01L21/67109 , H01J2237/2001 , H01L21/67248
摘要： A plasma processing apparatus includes: a film which is made of an insulative material and constructs a surface of a sample stage on which a sample is put; a disk-shaped member whose upper surface is joined with the film in a lower portion of the film and which is made of a heat conductive member; heaters which are arranged in the film and arranged in a center portion and regions of its outer peripheral side of the film; coolant channels which are arranged in the disk-shaped member and in which a coolant for cooling the disk-shaped member flows; a plurality of power sources each of which adjusts an electric power to each of the heaters in the plurality of regions; and a controller which adjusts outputs from the plurality of power sources by using a result obtained by presuming a temperature of the upper surface of the disk-shaped member.
摘要翻译：一种等离子体处理装置，包括：由绝缘材料制成的薄膜，构成放置样品的样品台的表面; 其上表面与膜接合在膜的下部并由导热构件制成的盘状构件; 加热器布置在膜中并且布置在膜的中心部分和其外周侧的区域中; 布置在盘状构件中并且用于冷却盘形构件的冷却剂流过的冷却剂通道; 多个电源，其各自调整对所述多个区域中的每个所述加热器的电力; 以及控制器，其通过使用通过假设盘状构件的上表面的温度获得的结果来调整来自多个电源的输出。

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