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    • 2. 发明授权
    • Solid-state memory device and method for arrangement of solid-state memory cells
    • 固态存储器件和固态存储器单元的布置方法
    • US07362607B2
    • 2008-04-22
    • US11108699
    • 2005-04-19
    • Makoto Motoyoshi
    • Makoto Motoyoshi
    • G11C11/00
    • H01L27/228B82Y10/00G11C5/025G11C11/15G11C11/16
    • A high-capacity magnetic memory device in which the magnetic field for writing is nearly uniform for all memory elements. It is realized by reducing the deformation of resist pattern which occurs in photolithography when mask patterns are close to each other. The magnetic memory device is an MRAM composed of a large number of memory cells, each including one TMR element, one transistor for reading (selection), and reading plugs that connect the TMR element to the transistor for reading (selection). These memory cells are arranged such that the TMR elements are in a pattern of translational symmetry. For writing, memory cells are connected by the bit lines and the writing word lines which intersect orthogonally. The long axis of the TMR element is oriented aslant 45° with respect to these lines, so that the TMR elements are capable of toggle-mode writing.
    • 一种大容量磁存储器件,其中用于写入的磁场对于所有存储元件几乎是均匀的。 通过减小当掩模图案彼此接近时在光刻中发生的抗蚀剂图案的变形来实现。 磁存储器件是由大量存储器单元构成的MRAM,每个存储单元包括一个TMR元件,一个用于读取(选择)的晶体管,以及读取将TMR元件连接到晶体管用于读取(选择)的插头。 这些存储单元被布置成使得TMR元件处于平移对称的图案。 对于写入,存储单元通过位线和与正交相交的写入字线连接。 TMR元件的长轴相对于这些线取向倾斜45°,使得TMR元件能够进行触发模式写入。
    • 3. 发明授权
    • Magnetic storage device and method of fabricating the same
    • 磁存储装置及其制造方法
    • US07005715B2
    • 2006-02-28
    • US11112372
    • 2005-04-22
    • Ikuo YoshiharaMakoto Motoyoshi
    • Ikuo YoshiharaMakoto Motoyoshi
    • H01L29/76
    • H01L27/228B82Y10/00
    • Problems in reliability and cross-talk of MRAM, which are intrinsically ascribable to the structure thereof, are solved at the same time. In a magnetic storage device (1) having write word lines (11) and bit lines (12) formed so as to cross while keeping a predetermined space therebetween, and provided with a TMR element (13) configured so as to sandwich a tunnel insulating layer (303) with a magnetization fixed layer (302) and a storage layer (304) comprising a ferromagnetic layer, in each of thus-formed intersectional region, and there is provided a semiconductor region (22) in which two read transistors (24, 24), which serve as read transistors, are formed, and which comprises a first region (22a) obliquely crosses a projected region of the write word line (11); a second region (22b) formed in parallel with the bit line (12) so as to be continued from one end of the first region; and a third region (22c) formed in parallel with the bit line (12) and so as to be continued from the other end of the first region (22a).
    • 同时解决本质上归因于其结构的MRAM的可靠性和串扰问题。 在具有写入字线(11)和位线(12)的磁存储装置(1)中,形成为跨越其间保持预定间隔而交叉的位线,并且设置有TMR元件(13),其构造成夹着隧道绝缘 具有磁化固定层(302)的层(303)和在这样形成的交叉区域的每一个中包含铁磁层的存储层(304),并且设置有半导体区域(22),其中两个读取晶体管 ,24),其用作读取晶体管,并且其包括与写入字线(11)的投影区域倾斜交叉的第一区域(22a); 与所述位线(12)平行地形成为从所述第一区域的一端延续的第二区域(22b); 以及与所述位线(12)平行形成并且从所述第一区域(22a)的另一端延续的第三区域(22c)。
    • 4. 发明申请
    • Magnetic storage device and method of fabricating the same
    • 磁存储装置及其制造方法
    • US20050185435A1
    • 2005-08-25
    • US11112372
    • 2005-04-22
    • Ikuo YoshiharaMakoto Motoyoshi
    • Ikuo YoshiharaMakoto Motoyoshi
    • G11C11/14G11C11/02G11C11/15G11C19/08H01L21/00H01L21/8234H01L21/8246H01L27/105H01L27/22H01L29/00H01L29/76H01L31/113H01L43/08
    • H01L27/228B82Y10/00
    • Problems in reliability and cross-talk of MRAM, which are intrinsically ascribable to the structure thereof, are solved at the same time. In a magnetic storage device (1) having write word lines (11) and bit lines (12) formed so as to cross while keeping a predetermined space therebetween, and provided with a TMR element (13) configured so as to sandwich a tunnel insulating layer (303) with a magnetization fixed layer (302) and a storage layer (304) comprising a ferromagnetic layer, in each of thus-formed intersectional region, and there is provided a semiconductor region (22) in which two read transistors (24, 24), which serve as read transistors, are formed, and which comprises a first region (22a) obliquely crosses a projected region of the write word line (11); a second region (22b) formed in parallel with the bit line (12) so as to be continued from one end of the first region; and a third region (22c) formed in parallel with the bit line (12) and so as to be continued from the other end of the first region (22a).
    • 同时解决本质上归因于其结构的MRAM的可靠性和串扰问题。 在具有写入字线(11)和位线(12)的磁存储装置(1)中,形成为跨越其间保持预定间隔而交叉的位线,并且设置有TMR元件(13),其构造成夹着隧道绝缘 具有磁化固定层(302)的层(303)和在这样形成的交叉区域的每一个中包含铁磁层的存储层(304),并且设置有半导体区域(22),其中两个读取晶体管 ,24),其用作读取晶体管,并且其包括与写入字线(11)的投影区域倾斜交叉的第一区域(22a); 与所述位线(12)平行地形成为从所述第一区域的一端延续的第二区域(22b); 以及与所述位线(12)平行形成并且从所述第一区域(22a)的另一端延续的第三区域(22c)。
    • 8. 发明申请
    • Semiconductor-integrated circuit utilizing magnetoresistive effect elements
    • 采用磁阻效应元件的半导体集成电路
    • US20070103191A1
    • 2007-05-10
    • US11600096
    • 2006-11-16
    • Minoru SugawaraMakoto Motoyoshi
    • Minoru SugawaraMakoto Motoyoshi
    • H03K19/173
    • H01L27/228H01L27/0207H01L27/105H01L27/10897H01L27/14601H01L27/24H01L2924/0002H01L2924/00
    • A semiconductor integrated circuit device able to configure a desired circuit in accordance with a circuit configuration instruction signal given from the outside and able to operate the configured circuit is provided. The semiconductor integrated circuit device has a plurality of circuit elements, a plurality of connection elements each of which becomes a conductive state or a nonconductive state, interconnects for supplying control signals for placing the connection elements in the conductive state or the nonconductive state, and a plurality of circuit selection switching elements, wherein said circuit selection switching elements are driven in response to the circuit configuration instruction signal, control signals are output from the circuit selection switching elements, and the desired circuit is configured by combining the circuit elements via said connection elements which become the conductive state or the nonconductive state in accordance with the control signals. As the connection elements, preferably use is made of magnetoresistance effect elements or resistance control elements which become the conductive state or the nonconductive state in accordance with application of a magnetic field. As the circuit elements, use can be made of magnetoresistance effect elements or resistance control elements.
    • 提供一种能够根据从外部给出的并能够操作配置的电路的电路配置指令信号来配置期望电路的半导体集成电路器件。 半导体集成电路器件具有多个电路元件,多个连接元件各自变为导通状态或非导通状态,用于提供用于将连接元件置于导通状态或非导通状态的控制信号的互连,以及 多个电路选择开关元件,其中响应于电路配置指令信号驱动所述电路选择开关元件,从电路选择开关元件输出控制信号,并且期望的电路通过经由所述连接元件组合电路元件 其根据控制信号变为导通状态或非导通状态。 作为连接元件,优选使用根据磁场的施加而成为​​导通状态或非导通状态的磁阻效应元件或电阻控制元件。 作为电路元件,可以使用磁阻效应元件或电阻控制元件。
    • 10. 发明授权
    • Semiconductor integrated circuit device
    • 半导体集成电路器件
    • US5700705A
    • 1997-12-23
    • US470452
    • 1995-06-06
    • Satoshi MeguroKiyofumi UchiboriNorio SuzukiMakoto MotoyoshiAtsuyoshi KoikeToshiaki YamanakaYoshio SakaiToru KagaNaotaka HashimotoTakashi HashimotoShigeru HonjouOsamu Minato
    • Satoshi MeguroKiyofumi UchiboriNorio SuzukiMakoto MotoyoshiAtsuyoshi KoikeToshiaki YamanakaYoshio SakaiToru KagaNaotaka HashimotoTakashi HashimotoShigeru HonjouOsamu Minato
    • H01L21/8244H01L27/11
    • H01L27/1104H01L27/11H01L27/1108Y10S257/903Y10S257/904
    • The manufacture of a memory cell of the type employing a pair of cross-coupled CMOS inverters of a SRAM is disclosed in which the load MISFETs are stacked above the semiconductor substrate and over the drive MISFETs. The manufacture of each load MISFET consists of forming source, drain and channel regions within the same polycrystalline silicon film, and a gate electrode consisting of a different layer conductive film, such as a polycrystalline film, than that of the drive MISFETs. The manufacture of the memory cell having such a stacked arrangement, facilitates the patterning of the source (drain) region and gate electrode of each load MISFET thereof to have an overlapping relationship with each other so as to increase the effective capacitance associated with each of the memory cell storage nodes. The gate electrodes of both the drive and load MISFETs are formed of n-type or of n-type and p-type polycrystalline silicon films, respectively, and electrical connections are formed between the drain regions of the first and second p-channel load MISFETs with that of the drain regions of the first and second n-channel drive MISFETs through separate polycrystalline silicon films, respectively. Also, there are formed electrical connections between the polycrystalline silicon gate electrodes of the first and second load MISFETs with that of drain regions of the second and first drive MISFETs, through the poly-Si gate electrodes of the first and second drive MISFETs, in each memory cell of the SRAM, respectively, furthermore.
    • 公开了采用SRAM的一对交叉耦合CMOS反相器的类型的存储单元的制造,其中负载MISFET堆叠在半导体衬底上方和驱动MISFET上方。 每个负载MISFET的制造包括在同一多晶硅膜内形成源极,漏极和沟道区域,以及由不同层导电膜(例如多晶膜)组成的栅电极,而不是驱动MISFET。 具有这种堆叠布置的存储单元的制造有助于其每个负载MISFET的源极(漏极)区域和栅极电极的图案化,以使得彼此之间具有重叠关系,从而增加与每个负载MISFET相关联的有效电容 存储单元存储节点。 驱动和负载MISFET的栅电极分别由n型或n型和p型多晶硅膜形成,并且在第一和第二p沟道负载MISFET的漏极区之间形成电连接 与第一和第二n沟道驱动MISFET的漏极区分别通过分离的多晶硅膜。 此外,通过第一和第二驱动MISFET的多晶硅栅电极,在第一和第二负载MISFET的多晶硅栅电极与第二和第一驱动MISFET的漏极区域之间形成电连接 此外,SRAM的存储单元分别。