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1. 发明授权

US10165639B2 Integrated LED device 有权
公开(公告)号：US10165639B2
公开(公告)日：2018-12-25
申请号：US15846704
申请日：2017-12-19
申请人： MELEXIS TECHNOLOGIES NV
发明人： Jian Chen , Thomas Freitag , Michael Bender
IPC分类号： F21V15/01 , H05B33/08 , F21V23/00 , H01L25/075 , H01L25/16
摘要： The present invention relates to an integrated-LED device having a housing, whereby the housing comprises a multi-LED device comprising a transparent substrate and a plurality of light emitting diodes, LEDs, arranged for emitting light and disposed on said transparent substrate, an integrated circuit in connection with said LEDs and arranged for controlling said LEDs, a base comprising one or more base extensions, on which at least said multi-LED device is mounted, with said one or more base extensions so arranged or so shaped that a first opening is created to let pass LED light emitted through said transparent substrate by said plurality of LEDs.

2. 发明申请

US20140333301A1 DEVICE FOR CURRENT MEASUREMENT 有权
标题翻译：电流测量装置
公开(公告)号：US20140333301A1
公开(公告)日：2014-11-13
申请号：US14264635
申请日：2014-04-29
申请人： Melexis Technologies NV
发明人： Robert Racz , Mathieu Ackermann , Jian Chen
IPC分类号： G01R19/00 , G01R33/07
CPC分类号： G01R19/0092 , G01R15/20 , G01R15/207 , G01R33/07
摘要： A device for current measurement comprises a substrate with a first current conductor and a current sensor with a second current conductor. The current sensor is mounted above the first current conductor on the substrate. The second current conductor is formed with integrally attached first and second terminal leads through which the current to be measured is supplied and discharged. The current sensor further comprises a semiconductor chip with a magnetic field sensor mounted on the second current conductor on the side of the second current conductor facing the substrate. The magnetic field sensor is sensitive to a component of the magnetic field extending parallel to the surface of the semiconductor chip and perpendicular to the second current conductor. The second current conductor extends above and parallel to the first current conductor.
摘要翻译：用于电流测量的装置包括具有第一电流导体的基板和具有第二电流导体的电流传感器。电流传感器安装在基板上的第一电流导体上方。第二电流导体形成有整体连接的第一和第二端子引线，待测量的电流通过该引线提供和放电。电流传感器还包括具有磁场传感器的半导体芯片，该磁场传感器安装在面对衬底的第二电流导体一侧上的第二电流导体上。磁场传感器对平行于半导体芯片的表面并垂直于第二电流导体的磁场分量敏感。第二电流导体延伸到第一电流导体上方并平行。

3. 发明授权

US11169039B2 Pressure sensor device and method of sensing pressure 有权
公开(公告)号：US11169039B2
公开(公告)日：2021-11-09
申请号：US16557213
申请日：2019-08-30
申请人： Melexis Technologies NV
发明人： Laurent Otte , Appolonius Jacobus Van Der Wiel , Jian Chen
IPC分类号： G01L9/00 , G01L19/06
摘要： A pressure sensor device comprises a device package (110) arranged to define a cavity (116) having an opening for fluid communication with an internal volume thereof. The cavity (116) comprises a side wall (114, 115). An elongate pressure sensor element (100) is provided and has a proximal end (120) and a distal end (122). The side wall (114, 115) is arranged to hold fixedly the proximal end (120) of the pressure sensor element (100) therein so that the pressure sensor element (100) is cantilever-suspended from the side wall (114, 115) within the cavity (116).

4. 发明授权

US09529013B2 Current sensor 有权
标题翻译：电流传感器
公开(公告)号：US09529013B2
公开(公告)日：2016-12-27
申请号：US14197372
申请日：2014-03-05
申请人： Melexis Technologies NV
发明人： Robert Racz , Jian Chen , Mathieu Ackermann
IPC分类号： G01R1/04 , G01R15/20
CPC分类号： G01R1/0416 , G01R15/20 , G01R15/202 , G01R15/207 , H01L2924/0002 , H01L2924/00
摘要： A current sensor comprises a housing of plastic, a current conductor with integrally shaped first and second electrical terminals, through which a current to be measured is supplied and discharged, third electrical terminals, and a semiconductor chip having at least one magnetic field sensor, which is sensitive to a component of the magnetic field generated by the current flowing through the current conductor running perpendicularly to the surface of the semiconductor chip. The first and second electrical terminals are arranged at a first side of the housing, the third electrical terminals are arranged at a side of the housing opposite to the first side. The semiconductor chip is mounted as flip chip. The semiconductor chip comprises first bumps, which make electrical connections to the third terminals, and second bumps located above the current conductor and electrically separated from the semiconductor chip by an isolation layer.
摘要翻译：电流传感器包括塑料壳体，具有整体成形的第一和第二电端子的电流导体，待测电流被提供和放电，第三电端子和具有至少一个磁场传感器的半导体芯片，对流过垂直于半导体芯片表面的电流导体的电流产生的磁场分量敏感。第一和第二电端子布置在壳体的第一侧，第三电端子布置在壳体的与第一侧相对的一侧。半导体芯片安装为倒装芯片。半导体芯片包括与第三端子形成电连接的第一凸块和位于电流导体上方的第二凸起，并通过隔离层与半导体芯片电隔离。

5. 发明申请

US20160218276A1 Method For Making Current Sensors 有权
标题翻译：制作电流传感器的方法
公开(公告)号：US20160218276A1
公开(公告)日：2016-07-28
申请号：US15003608
申请日：2016-01-21
申请人： Melexis Technologies NV
发明人： Jian Chen , Robert Racz
IPC分类号： H01L43/04 , H01L43/12 , H01L25/16 , H01L43/06
CPC分类号： H01L43/04 , B29C45/14 , B29C45/14655 , G01R33/0047 , G01R33/072 , H01L21/56 , H01L21/561 , H01L21/565 , H01L25/16 , H01L43/06 , H01L43/12 , H01L2224/05554 , H01L2224/48247 , H01L2224/49171 , H01L2924/0002 , H01L2924/19105 , H01L2924/00
摘要： The invention relates to a method for the production of current sensors which comprise a plastic housing made in an IC technology. The key steps are to mount on a leadframe and wire bond semiconductor chips having Hall sensors, to place the leadframe in an injection mold, to close the injection mold with a first mold insert and to inject plastic material, wherein each semiconductor chip is packed into an intermediate casing including a flat surface having alignment structures. Then the injection mold is opened and a current conductor section is placed on the flat surface of each intermediate casing, the current conductor section having counter structures matching the alignment structures so that it is automatically aligned and held. Then the injection mold is closed with a second mold insert and plastic material injected to form the final housing of the current sensors. It is also possible to use two different injection molds.
摘要翻译：本发明涉及一种用于生产电流传感器的方法，其包括由IC技术制成的塑料外壳。关键步骤是安装在具有霍尔传感器的引线框架和引线框架半导体芯片上，以将引线框架放置在注射模具中，用第一模具插入件封闭注射模具并注入塑料材料，其中每个半导体芯片被包装成包括具有对准结构的平坦表面的中间壳体。然后，注射模具打开，并且电流导体部分放置在每个中间壳体的平坦表面上，电流导体部分具有与对准结构匹配的对置结构，使得其自动对准和保持。然后注射模具用第二模具插入件封闭并注入塑料材料以形成电流传感器的最终壳体。也可以使用两种不同的注射模具。

6. 发明授权

US10006822B2 Semiconductor sensor assembly for harsh media application 有权
公开(公告)号：US10006822B2
公开(公告)日：2018-06-26
申请号：US15628758
申请日：2017-06-21
申请人： MELEXIS TECHNOLOGIES NV
发明人： Jian Chen , Laurent Otte
IPC分类号： H01L29/49 , G01L9/00 , G01L19/00 , G01L19/06 , G01L19/14 , H01L29/84
CPC分类号： G01L9/0055 , G01L9/0042 , G01L19/0069 , G01L19/0084 , G01L19/06 , G01L19/0627 , G01L19/143 , H01L29/84 , H01L2224/05554 , H01L2224/06 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor sensor assembly for use in a corrosive environment comprises a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment; a sensor device comprising at least one second bondpad consisting of and/or being covered by a first corrosion resistant material; at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the second bondpad of the sensor device. The processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, with the sensor device being present in the cavity. A redistribution layer is provided to enable signal connection between the processing device and the sensor device is physically made in the cavity while the second corrosion resistant material covers the first bondpad.

7. 发明授权

US09547024B2 Device for current measurement 有权
标题翻译：电流测量装置
公开(公告)号：US09547024B2
公开(公告)日：2017-01-17
申请号：US14264635
申请日：2014-04-29
申请人： Melexis Technologies NV
发明人： Robert Racz , Mathieu Ackermann , Jian Chen
IPC分类号： G01R33/07 , G01R19/00 , G01R15/20
CPC分类号： G01R19/0092 , G01R15/20 , G01R15/207 , G01R33/07
摘要： A device for current measurement comprises a substrate with a first current conductor and a current sensor with a second current conductor. The current sensor is mounted above the first current conductor on the substrate. The second current conductor is formed with integrally attached first and second terminal leads through which the current to be measured is supplied and discharged. The current sensor further comprises a semiconductor chip with a magnetic field sensor mounted on the second current conductor on the side of the second current conductor facing the substrate. The magnetic field sensor is sensitive to a component of the magnetic field extending parallel to the surface of the semiconductor chip and perpendicular to the second current conductor. The second current conductor extends above and parallel to the first current conductor.
摘要翻译：用于电流测量的装置包括具有第一电流导体的基板和具有第二电流导体的电流传感器。电流传感器安装在基板上的第一电流导体上方。第二电流导体形成有整体连接的第一和第二端子引线，待测量的电流通过该引线提供和放电。电流传感器还包括具有磁场传感器的半导体芯片，该磁场传感器安装在面对衬底的第二电流导体一侧上的第二电流导体上。磁场传感器对平行于半导体芯片的表面并垂直于第二电流导体的磁场分量敏感。第二电流导体延伸到第一电流导体上方并平行。

8. 发明授权

US11600559B2 Sensor device and method of manufacture 有权
公开(公告)号：US11600559B2
公开(公告)日：2023-03-07
申请号：US16557224
申请日：2019-08-30
申请人： Melexis Technologies NV
发明人： Jian Chen , Appolonius Jacobus Van Der Wiel , Laurent Otte
IPC分类号： H01L23/00 , H01L23/13 , G01L9/00 , G01L19/00 , H01L21/56 , H01L23/495
摘要： A method of manufacturing a sensor device (100) comprises providing (200) a package (102) having a first die-receiving subframe volume (104) separated from a second die-receiving subframe volume (106) by a partition wall (116). An elongate sensor element (120) is disposed (202) within the package (102) so as to bridge the first and second subframe volumes (104, 106) and to overlie the partition wall (116). The elongate sensor element (120) resides substantially in the first subframe volume (104) and partially in the second subframe volume (106). The elongate sensor element (120) is electrically connected within the second subframe volume (106).

9. 发明授权

US10308502B2 Semiconductor pressure sensor for harsh media application 有权
公开(公告)号：US10308502B2
公开(公告)日：2019-06-04
申请号：US15445096
申请日：2017-02-28
申请人： MELEXIS TECHNOLOGIES NV
发明人： Laurent Otte , Jian Chen , Appolonius Jacobus Van Der Wiel
IPC分类号： B81B7/00 , B81C1/00 , G01L9/00 , G01L19/06 , G01L19/14 , G01L23/24
摘要： A semiconductor pressure sensor assembly for measuring a pressure of an exhaust gas which contains corrosive components, comprising: a first cavity, a pressure sensor comprising first bondpads for electrical interconnection, a CMOS chip comprising second bondpads for electrical interconnection with the pressure sensor, an interconnection module having electrically conductive paths connected via bonding wires to the pressure sensor and to the CMOS chip; the interconnection module being a substrate with corrosion-resistant metal tracks, wherein the CMOS chip and part of the interconnection module are encapsulated by a plastic package.

10. 发明授权

US10217874B2 Semiconductor device having a transparent window for passing radiation 有权
公开(公告)号：US10217874B2
公开(公告)日：2019-02-26
申请号：US15463180
申请日：2017-03-20
申请人： MELEXIS TECHNOLOGIES NV
发明人： Carl Van Buggenhout , Jian Chen
IPC分类号： H01L21/00 , H01L31/0203 , H01L31/0216 , H01L27/146
摘要： Method of encapsulating a semiconductor structure comprising providing a semiconductor structure comprising an opto-electric element located in a cavity formed between a substrate and a cap layer, the cap layer being made of a material transparent to light, and having a flat upper surface; forming at least one protrusion on the cap layer; bringing the at least one protrusion of the cap layer in contact with a tool having a flat surface region, and applying a opaque material to the semiconductor structure where it is not in contact with the tool; and removing the tool thereby providing an encapsulated optical semiconductor device having a transparent window integrally formed with the cap layer.

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