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1. 发明授权

US06838317B2 Techniques for joining an opto-electronic module to a semiconductor package 有权
标题翻译：将光电模块连接到半导体封装的技术
公开(公告)号：US06838317B2
公开(公告)日：2005-01-04
申请号：US10652805
申请日：2003-08-29
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
IPC分类号： G02B6/38 , G02B6/42 , H01L23/02 , H01L23/498 , H01L25/10 , H05K1/02 , H05K1/18 , H05K3/40 , H01L21/44 , H01L21/00
CPC分类号： G02B6/4292 , G02B6/3825 , G02B6/3874 , G02B6/3897 , G02B6/4201 , G02B6/4239 , G02B2006/4297 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73207 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00015 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753
摘要： The present invention provides a technique for manufacturing a low cost device that provides a true die to external fiber optic connection. Specifically, the present invention relates to several techniques for joining an optical device package to a semiconductor device package. The first technique involves using wirebond studs and an adhesive material, the second technique involves the use of an anisotropic conductive film, and the third technique involves the use of solder material. Each of these techniques provides high levels of thermal, electrical and optical performance. The methods apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.
摘要翻译：本发明提供了一种用于制造向外部光纤连接提供真正的裸片的低成本器件的技术。具体地，本发明涉及将光学器件封装连接到半导体器件封装件的几种技术。第一种技术包括使用引线键和粘合剂材料，第二种技术涉及使用各向异性导电膜，第三种技术涉及使用焊料材料。这些技术中的每一种提供高水平的热，电和光学性能。该方法适用于收发器，发射机以及光电子封装的接收器中的光学子组件和芯片子组件接口。

2. 发明授权

US06595699B1 Optoelectronic package with controlled fiber standoff 有权
标题翻译：具有受控光纤支架的光电封装
公开(公告)号：US06595699B1
公开(公告)日：2003-07-22
申请号：US09922946
申请日：2001-08-03
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts
IPC分类号： G02B636
CPC分类号： G02B6/4202 , G02B6/4212 , G02B6/4231 , H01L2224/73207
摘要： An optoelectronic component is described that includes a photonic device carried by a substrate. A support structure having a relatively higher portion and a relatively lower portion is formed on or attached to the substrate. In a preferred embodiment, the support structure is a dam structure formed by dispensing a flowable material onto the substrate and hardening the dispensed material. The optoelectronic component further includes one or more optical fibers, with each optical fiber being in optical communication with an active facet on the photonic device. The relatively higher and lower portions of the support structure are arranged to position the optical fiber(s) at a desired standoff distance from the photonic device and to slightly incline the distal tip of each optical fiber relative to the top surface of the photonic device. The described packaging approach can be used in both single fiber and multi-channel devices. In some specific embodiments, the support structure is arranged to engage a fiber termination that holds the optical fiber(s). An optically clear cap may also be provided to cover the active facet of the photonic device. In embodiments where the support structure surrounds the photonic device, the support structure may be used as a containment for the cap. With this arrangement, a flowable clear topping material is dispensed over the photonic device without requiring a traditional molding operation.
摘要翻译：描述了包括由衬底承载的光子器件的光电子部件。具有相对较高部分和相对较低部分的支撑结构形成在基底上或附着于基底上。在优选实施例中，支撑结构是通过将可流动材料分配到基底上并硬化所分配的材料形成的坝结构。光电子部件还包括一个或多个光纤，每个光纤与光子器件上的有源刻面光学通信。支撑结构的相对较高和较低的部分被布置成将光纤定位在离光子器件所需的间隔距离处，并且相对于光子器件的顶表面稍微倾斜每个光纤的远端。所描述的封装方法可用于单光纤和多通道设备。在一些具体实施例中，支撑结构布置成接合保持光纤的光纤终端。还可以提供光学透明的盖以覆盖光子器件的活性面。在支撑结构围绕光子装置的实施例中，支撑结构可用作帽的容纳物。利用这种布置，可流动的透明顶部材料被分配在光子器件上，而不需要传统的模制操作。

3. 发明授权

US07199440B2 Techniques for joining an opto-electronic module to a semiconductor package 有权
标题翻译：将光电模块连接到半导体封装的技术
公开(公告)号：US07199440B2
公开(公告)日：2007-04-03
申请号：US11026749
申请日：2004-12-30
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
IPC分类号： H01L29/84 , H01L31/0232 , H01L23/02 , H01L29/40
CPC分类号： G02B6/4292 , G02B6/3825 , G02B6/3874 , G02B6/3897 , G02B6/4201 , G02B6/4239 , G02B2006/4297 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73207 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00015 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753
摘要： The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.
摘要翻译：本发明提供了一种具有对外部光纤连接的真实裸片的低成本装置。具体而言，本发明涉及与半导体器件封装相连接的光学器件封装。在一些情况下，使用引线键和粘合剂材料连接组合。在其他情况下，使用各向异性导电膜接合组合。然而，在其他情况下，使用焊料材料连接组合。这些连接机构中的每一个提供高水平的热，电和光学性能。连接机构可以应用于收发器，发射器以及光电子封装的接收器中的光学子组件和芯片子组件接口。

4. 发明授权

US07195955B2 Technique for protecting photonic devices in optoelectronic packages with clear overmolding 有权
标题翻译：用于保护光电子封装中光子器件的技术，具有清晰的二次成型
公开(公告)号：US07195955B2
公开(公告)日：2007-03-27
申请号：US11217518
申请日：2005-08-31
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts
IPC分类号： B29C45/14 , H01L21/56
CPC分类号： B29C70/72 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/32225 , H01L2224/4809 , H01L2224/48471 , H01L2224/48479 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/181 , H01L2924/1815 , Y10T29/49146 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/4554
摘要： This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.
摘要翻译：本公开描述了一种清晰的包覆成型帽，用于保护光电子封装中的光子器件免受在现场应用中的处理，模块组件，电路板组装和环境暴露的损害。具有透明模盖或类似材料的装置的包覆模制也为位于活动小面旁边的光纤提供支架。光子器件附接到基底，其可以是柔性的，其具有允许光子器件连接到诸如半导体器件的外部器件的电子迹线。还公开了使用与刚性载体组合的模具模具来制造包覆成形帽的技术。刚性载体用于在模塑过程中保持基材的形状。所提出的方法适用于可用作收发器，发射器或接收器的光电封装中使用的光子器件。

5. 发明授权

US06749345B1 Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards 有权
标题翻译：用于电光封装的装置和方法，其有助于将光缆耦合到印刷电路板
公开(公告)号：US06749345B1
公开(公告)日：2004-06-15
申请号：US10155743
申请日：2002-05-24
申请人： Stephen Andrew Gee , Luu Thanh Nguyen , Ken Pham , Jia Liu , William Paul Mazotti , Bruce Carlton Roberts , Peter Deane
发明人： Stephen Andrew Gee , Luu Thanh Nguyen , Ken Pham , Jia Liu , William Paul Mazotti , Bruce Carlton Roberts , Peter Deane
IPC分类号： G02B638
CPC分类号： G02B6/4277 , G02B6/421 , G02B6/424 , G02B6/425 , G02B6/4261 , G02B6/4269 , G02B6/428 , G02B6/4292
摘要： Electro-optical packages that embed the electronics of the packages directly to the optical cabling, provide short electrical connection paths for high performance, and that provide a robust interconnects. A first electro-optical package includes an integrated circuit and a connector sleeve configured to receive a plug-in optical assembly from the underside of the PC board. The plug-in optical assembly includes a backing piece and an opto-electric device mounted onto the backing piece. An electrical connection is provided between the opto-electric device and a contact location on the backing piece and a contact is provided between the contact location on the backing piece and the integrated circuit. With a second electro-optical package, an integrated circuit having an active surface facing in a first direction and an opto-electric device having contact points facing a second direction are provided. The integrated circuit and the opto-electric are positioned with respect to one another such that a direct electrical connection can be formed between the active surface of the integrated circuit and the contact points of the opto-electrical device.
摘要翻译：将封装的电子元件直接嵌入光缆的电光封装，为高性能提供短的电连接路径，并提供稳健的互连。第一电光学封装包括集成电路和连接器套管，其被配置为从PC板的下侧接收插入式光学组件。插入式光学组件包括背衬片和安装在背衬片上的光电装置。在光电装置和背衬片上的接触位置之间提供电连接，并且在背衬片上的接触位置和集成电路之间提供触点。通过第二电光封装，提供具有面向第一方向的有源表面的集成电路和具有面向第二方向的接触点的光电装置。集成电路和光电相对于彼此定位，使得可以在集成电路的有源表面和光电装置的接触点之间形成直接电连接。

6. 发明授权

US06655854B1 Optoelectronic package with dam structure to provide fiber standoff 有权
标题翻译：具有大坝结构的光电封装提供光纤隔离
公开(公告)号：US06655854B1
公开(公告)日：2003-12-02
申请号：US09922357
申请日：2001-08-03
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts
IPC分类号： G02B636
CPC分类号： G02B6/4231 , G02B6/4202 , H01L2224/48091 , H01L2224/48465 , H01L2224/48471 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic component is described that includes a photonic device carried by a base substrate. A dam structure is formed on the base substrate by dispensing and hardening a precise amount of a flowable material. The dam structure is sized to define a desired standoff between an optical fiber and an active facet on the photonic device. In embodiments where the photonic device is wire bonded to the base substrate, it may be desirable to provide a reverse wire bond in order to permit the optical fiber to be placed closer to the photonic device. In some embodiments, the base substrate takes the form of a flexible material having electrically conductive traces thereon that are electrically connected to the photonic device. An optical component support block may be provided to support the flex material. In some implementations, a semiconductor die may be directly soldered to the traces on the flexible material.
摘要翻译：描述了包括由基底衬底承载的光子器件的光电子部件。通过分配和硬化精确量的可流动材料，在基底基板上形成坝结构。大坝结构的尺寸设计成在光子器件上限定光纤和活性刻面之间的期望间隔。在其中光子器件被引线键合到基底衬底的实施例中，可能需要提供反向引线键合以允许光纤被放置得更靠近光子器件。在一些实施例中，基底衬底采用柔性材料的形式，其上具有与光子器件电连接的导电迹线。可以提供光学部件支撑块以支撑柔性材料。在一些实施方案中，半导体管芯可以直接焊接到柔性材料上的迹线上。

7. 发明授权

US07086788B2 Optical sub-assembly for opto-electronic modules 有权
标题翻译：光电子模块的光学子组件
公开(公告)号：US07086788B2
公开(公告)日：2006-08-08
申请号：US11095637
申请日：2005-03-30
申请人： William Paul Mazotti , Peter Deane , Luu Thanh Nguyen , Ken Pham , Bruce Carlton Roberts , Jia Liu , Yongseon Koh , John P. Briant , Roger William Clarke , Michael R. Nelson , Christopher J. Smith , Janet E. Townsend
发明人： William Paul Mazotti , Peter Deane , Luu Thanh Nguyen , Ken Pham , Bruce Carlton Roberts , Jia Liu , Yongseon Koh , John P. Briant , Roger William Clarke , Michael R. Nelson , Christopher J. Smith , Janet E. Townsend
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2924/00014 , H01L2924/00
摘要： Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. In some embodiments the base substrate is formed from a ceramic material having the electrical traces formed thereon. In other implementations the substrate includes a backing block having a flexible printed circuit substrate adhered thereto.
摘要翻译：描述了用于方便地布置用于将电压和电流域的信号传导到红外辐射域的装置的概念。具体地说，描述了光电子元件及其制造方法。在一个方面，光电子部件包括具有一对成角度（或基本上垂直）的表面的基底基板，其间延伸有电迹线。半导体芯片组件安装在基底基板的第一面上，并且光子器件安装在第二面上。半导体芯片组件和光子器件都与基底衬底上的迹线电连接。半导体芯片组件通常被布置成电连接到外部设备。光子器件通常布置成与一根或多根光纤光学通信。所描述的结构可以与各种各样的光子器件一起使用。在一些实施例中，基底由具有形成在其上的电迹线的陶瓷材料形成。在其它实施方式中，基板包括具有粘附到其上的柔性印刷电路基板的背衬块。

8. 发明授权

US06973225B2 Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package 有权
标题翻译：用于将旋转的光子器件附接到光电子封装中的光学子组件的技术
公开(公告)号：US06973225B2
公开(公告)日：2005-12-06
申请号：US10165548
申请日：2002-06-06
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Hau Thanh Nguyen , John P. Briant , Roger Clarke , Michael R. Nelson , Janet E. Townsend
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Hau Thanh Nguyen , John P. Briant , Roger Clarke , Michael R. Nelson , Janet E. Townsend
IPC分类号： H01L27/144 , H01L31/0203 , H01L31/18 , G02B6/12
CPC分类号： H01L27/144 , H01L31/0203 , H01L31/18 , H01L2224/48091 , H01L2224/48247 , H01L2224/73207 , H01L2924/01322 , H01L2924/07811 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： The techniques of the present invention are directed towards setting a photonic device into a groove of a substrate, which is then attached to the chip sub-assembly in a way that the resulting optoelectronic package has a low profile and the interconnects between the photonic device and the semiconductor chip are short. The technique involves partially etching a groove in a substrate to allow for positioning of a photonic device within the groove. The photonic device is connected to the chip sub-assembly through interconnects that extend through the thickness of the substrate. The photonic devices are placed on their sides so that the active facets are perpendicular to the main axis of the chip sub-assembly. In this configuration, the optical fibers can be positioned parallel to the CSA top surface, ensuring a low module profile in the process.
摘要翻译：本发明的技术旨在将光子器件设置到衬底的凹槽中，然后将其附接到芯片子组件，使得所得光电封装具有低轮廓，并且光子器件和半导体芯片很短。该技术涉及部分蚀刻衬底中的凹槽以允许将光子器件定位在凹槽内。光子器件通过延伸穿过衬底厚度的互连连接到芯片子组件。光子器件放置在它们的侧面上，使得有源刻面垂直于芯片子组件的主轴线。在这种配置中，光纤可以平行于CSA顶面定位，从而确保了该过程中的低模块轮廓。

9. 发明授权

US07247942B2 Techniques for joining an opto-electronic module to a semiconductor package 有权
公开(公告)号：US07247942B2
公开(公告)日：2007-07-24
申请号：US11015247
申请日：2004-12-15
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
IPC分类号： H01L23/12 , H01L23/48 , H01L23/52 , H01L23/495
CPC分类号： G02B6/4292 , G02B6/3825 , G02B6/3874 , G02B6/3897 , G02B6/4201 , G02B6/4239 , G02B2006/4297 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73207 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00015 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753
摘要： The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.

10. 发明授权

US07001083B1 Technique for protecting photonic devices in optoelectronic packages with clear overmolding 有权
标题翻译：用于保护光电子封装中光子器件的技术，具有清晰的二次成型
公开(公告)号：US07001083B1
公开(公告)日：2006-02-21
申请号：US09957936
申请日：2001-09-21
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts
IPC分类号： G02B6/42
CPC分类号： B29C70/72 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/32225 , H01L2224/4809 , H01L2224/48471 , H01L2224/48479 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/181 , H01L2924/1815 , Y10T29/49146 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/4554
摘要： This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.
摘要翻译：本公开描述了一种清晰的包覆成型帽，用于保护光电子封装中的光子器件免受在现场应用中的处理，模块组件，电路板组装和环境暴露的损害。具有透明模盖或类似材料的装置的包覆模制也为位于活动小面旁边的光纤提供支架。光子器件附接到基底，其可以是柔性的，其具有允许光子器件连接到诸如半导体器件的外部器件的电子迹线。还公开了使用与刚性载体组合的模具模具来制造包覆成形帽的技术。刚性载体用于在模塑过程中保持基材的形状。所提出的方法适用于可用作收发器，发射器或接收器的光电封装中使用的光子器件。

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