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1. 发明授权

US07196275B2 EMI shield that adheres to and conforms with printed circuit board surfaces 有权
标题翻译： EMI屏蔽层粘附并符合印刷电路板表面
公开(公告)号：US07196275B2
公开(公告)日：2007-03-27
申请号：US10674107
申请日：2003-09-29
申请人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
发明人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
IPC分类号： H05K9/00
CPC分类号： H01L23/552 , H01L2924/0002 , H01L2924/3011 , H05K1/0218 , H05K3/284 , H05K9/0039 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T428/25 , H01L2924/00
摘要： An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.
摘要翻译：一种电连续接地的保形EMI保护屏蔽以及将其直接施加到印刷电路板表面的方法。 EMI屏蔽层粘附并符合组件和印刷电路板的表面。屏蔽层采取覆盖表面的形状，同时几乎不增加表面的尺寸。 EMI屏蔽包括低粘度，高粘附导电和电介质涂层，其中每一层可以使用常规喷涂技术施加在一层或多层中。导电涂层基本上防止由屏蔽组件产生的所有电磁辐射发散超过保形涂层。介电涂层最初被施加到印刷电路板的选定位置，以便插入在导电涂层和印刷电路板之间，防止导电涂层电接触所选择的部件和印刷电路板区域。

2. 发明授权

US06717485B2 Interference signal decoupling using a board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces 有权
标题翻译：使用电路板EMI屏蔽的干扰信号去耦，其粘附并符合印刷电路板部件和电路板表面
公开(公告)号：US06717485B2
公开(公告)日：2004-04-06
申请号：US10079638
申请日：2002-02-19
申请人： Lowell E. Kolb , Samuel M. Babb
发明人： Lowell E. Kolb , Samuel M. Babb
IPC分类号： H04B328
CPC分类号： H05K9/0024 , H04B15/02 , H05K1/0218 , H05K3/284
摘要： A decoupling circuit on a printed circuit board is disclosed. The decoupling circuit comprises an electrical filter circuit electrically connected between an interconnect post and a ground land of the printed circuit board. The ground land is connected to a ground plane in the printed circuit board. The electrical filter shunts conducted interfering signals received at the interconnect post to the ground plane. Components of the electrical filter circuit and ground plane form a first receiver loop in which induced interfering signals can be generated. The decoupling circuit also comprises a second receiver loop comprising a conductive coating of an EMI shield conformingly adhered to surfaces of the decoupling circuit, and a conductive path of the first receiver loop. The second receiver loop is adapted to have induced therein a signal having a direction and magnitude sufficient to cancel interfering signals induced in the first receiver loop.
摘要翻译：公开了印刷电路板上的去耦电路。去耦电路包括电连接在印刷电路板的互连柱和接地片之间的电滤波器电路。接地片连接到印刷电路板的接地层。电气滤波器将在互连柱处接收的干扰信号分流到接地层。电滤波器电路和接地平面的组件形成第一接收器环路，其中可以产生感应的干扰信号。去耦电路还包括第二接收器回路，其包括顺应地粘附到去耦电路的表面的EMI屏蔽的导电涂层以及第一接收器环路的导电路径。第二接收器环路适于在其中感应出具有足以抵消在第一接收器环路中感应的干扰信号的方向和幅度的信号。

3. 发明授权

US08156644B2 Method for manufacturing a printed circuit board having conformal EMI shield 有权
标题翻译：制造具有适形EMI屏蔽的印刷电路板的方法
公开(公告)号：US08156644B2
公开(公告)日：2012-04-17
申请号：US11605381
申请日：2006-11-29
申请人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
发明人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
IPC分类号： H05K3/30
CPC分类号： H01L23/552 , H01L2924/0002 , H01L2924/3011 , H05K1/0218 , H05K3/284 , H05K9/0039 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T428/25 , H01L2924/00
摘要： An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions. A high viscosity, non-electrically-conductive filler material is applied to printed circuit board regions that have surfaces that are cavitatious and/or which have a highly variable slope.
摘要翻译：一种电连续接地的保形EMI保护屏蔽以及将其直接施加到印刷电路板表面的方法。 EMI屏蔽层粘附并符合组件和印刷电路板的表面。屏蔽层采取覆盖表面的形状，同时几乎不增加表面的尺寸。 EMI屏蔽包括低粘度，高粘附性导电和电介质涂层，每个可以施加在一个或多个层中。介电涂层最初被施加到印刷电路板的选定位置，以便插入在导电涂层和印刷电路板之间，防止导电涂层电接触所选择的部件和印刷电路板区域。将高粘度非导电填料材料施加到具有空腔表面和/或具有高度可变斜率的表面的印刷电路板区域上。

4. 发明授权

US06900383B2 Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces 有权
公开(公告)号：US06900383B2
公开(公告)日：2005-05-31
申请号：US09812274
申请日：2001-03-19
申请人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
发明人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
IPC分类号： H01L23/552 , H05K1/02 , H05K3/28 , H05K9/00
CPC分类号： H01L23/552 , H01L2924/0002 , H01L2924/3011 , H05K1/0218 , H05K3/284 , H05K9/0039 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T428/25 , H01L2924/00
摘要： An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions. A high viscosity, non-electrically-conductive filler material is applied to printed circuit board regions that have surfaces that are cavitatious and/or which have a highly variable slope. The filler material can be used in conjunction with conformal EMI shield board level coating. The high viscosity, electrically non-conductive filler material substantially covers each cavity such that the covered cavity is inaccessible and that the covered region of the printed circuit board has a contiguous, contoured surface. A pre-manufactured non-electrically-conductive component cover can be mounted over a corresponding component and secured to the printed wiring board. The component cover and printed wiring board surround the component, forming a sealed enclosure. The component cover has a thin cross-section and an interior surface that follows closely the surface of the component. This minimizes the volume enclosed by the component cover. In addition, the exterior surface of the component cover has a low profile, and prevents the conformal EMI shield from physically contacting the covered component. Instead, the exterior surface of the component cover is coated with the EMI shield.

5. 发明授权

US07109817B2 Interference signal decoupling on a printed circuit board 有权
标题翻译：印刷电路板上的干扰信号去耦
公开(公告)号：US07109817B2
公开(公告)日：2006-09-19
申请号：US10674083
申请日：2003-09-29
申请人： Lowell E. Kolb , Samuel M. Babb
发明人： Lowell E. Kolb , Samuel M. Babb
IPC分类号： H04B3/28 , H05K9/00 , H05K1/00
CPC分类号： H05K9/0024 , H04B15/02 , H05K1/0218 , H05K3/284
摘要： A decoupling circuit on a printed circuit board is disclosed. The decoupling circuit comprises an electrical filter circuit electrically connected between an interconnect post and a ground land of the printed circuit board. The ground land is connected to a ground plane in the printed circuit board. The electrical filter shunts conducted interfering signals received at the interconnect post to the ground plane. Components of the electrical filter circuit and ground plane form a first receiver loop in which induced interfering signals can be generated. The decoupling circuit also comprises a second receiver loop comprising a conductive coating of an EMI shield conformingly adhered to surfaces of the decoupling circuit, and a conductive path of the first receiver loop. The second receiver loop is adapted to have induced therein a signal having a direction and magnitude sufficient to cancel interfering signals induced in the first receiver loop.
摘要翻译：公开了印刷电路板上的去耦电路。去耦电路包括电连接在印刷电路板的互连柱和接地片之间的电滤波器电路。接地片连接到印刷电路板的接地层。电气滤波器将在互连柱处接收的干扰信号分流到接地层。电滤波器电路和接地平面的组件形成第一接收器环路，其中可以产生感应的干扰信号。去耦电路还包括第二接收器回路，其包括顺应地粘附到去耦电路的表面的EMI屏蔽的导电涂层以及第一接收器环路的导电路径。第二接收器环路适于在其中感应出具有足以抵消在第一接收器环路中感应的干扰信号的方向和幅度的信号。

6. 发明授权

US5844417A Simulated infinite ground screen in an RF test chamber 失效
标题翻译：在RF测试室中模拟无限地面屏幕
公开(公告)号：US5844417A
公开(公告)日：1998-12-01
申请号：US792466
申请日：1997-01-31
申请人： Samuel M. Babb , Lowell E. Kolb
发明人： Samuel M. Babb , Lowell E. Kolb
IPC分类号： G01R29/10 , G01R29/08 , H01Q17/00 , H05K9/00 , G01R27/28
CPC分类号： H01Q17/008 , G01R29/0821 , H01Q17/00 , H01Q17/007 , H05K9/0001
摘要： The degree of variation in the normalized site attenuation of an RF test chamber may be reduced by adjusting the properties of the RF absorbers lining the walls of the RF test chamber such that for the frequencies of greatest variation the ground screen formed by the conductive floor of the chamber appears to be much greater than its actual finite size. This may be done by progressively reducing the degree of chamber wall absorption (for the frequencies of interest) for locations on the walls closer to the floor. The reduction begins at a height above the floor equal to the height of the device under test above the floor, and proceeds to some maximum reduction in absorption at the level of the floor. The reduction in absorption has the effect of making the ground screen appear to be much larger than it really is, and may be obtained either by spacing the absorbing tiles apart by increasing amounts nearer to the floor, or by using less absorptive tiles closer to the floor, or both.
摘要翻译： RF测试室的归一化位置衰减的变化程度可以通过调整衬套在RF测试室的壁上的RF吸收体的性质来降低，使得对于最大变化的频率，由导电层的该房间似乎比其实际有限尺寸大得多。这可以通过逐渐减小靠近地板的壁上的位置的室壁吸收程度（感兴趣的频率）来完成。减速从地板上方的高度开始等于被测设备的高度，高于地面，并且在地面水平上进行一些最大的吸收减小。吸收的减少具有使地面屏幕看起来比实际大得多的效果，并且可以通过将吸收瓦片间隔开来，通过增加接近地板的量来获得，或者通过使用较少的吸收性瓷砖地板或两者。

7. 发明授权

US07692910B2 Failure detection in a voltage regulator 有权
标题翻译：电压调节器故障检测
公开(公告)号：US07692910B2
公开(公告)日：2010-04-06
申请号：US11729646
申请日：2007-03-29
申请人： Jack Lavier , Samuel M. Babb , Kelly Jean Pracht
发明人： Jack Lavier , Samuel M. Babb , Kelly Jean Pracht
IPC分类号： H02H3/08 , H02H9/02 , G05J1/569 , G05J1/573
CPC分类号： G01R31/40 , H02M1/32 , H02M3/156 , H02M2001/0012
摘要： A control logic detects voltage regulator failure in a power supply. The control logic comprises first and second lines configured for respective connection to a controller node and a phase node of a voltage regulator, a delay element coupled to the first line configured to delay signals at the controller node into alignment with signals at the phase node, and a level detector coupled to the second line configured to convert the signals at the phase node into at least two digital representations indicative of respective signal thresholds. A logic compares timing of the delayed signals with the digital representations and detects occurrence of a voltage regulator fault based on the timing comparison.
摘要翻译：控制逻辑检测电源中的稳压器故障。控制逻辑包括被配置用于相应连接到控制器节点和电压调节器的相位节点的第一和第二线路，耦合到第一线路的延迟元件，其配置成将控制器节点处的信号延迟与相位节点处的信号对准，以及耦合到所述第二线路的电平检测器，其被配置为将所述相位节点处的信号转换成指示相应信号阈值的至少两个数字表示。逻辑将延迟信号的定时与数字表示进行比较，并且基于定时比较来检测电压调节器故障的发生。

8. 发明申请

US20080270808A1 Electronic Device 有权
标题翻译：电子设备
公开(公告)号：US20080270808A1
公开(公告)日：2008-10-30
申请号：US11742440
申请日：2007-04-30
申请人： Robert J. Blakely , Samuel M. Babb , Bradley D. Winick , Robert B. Smith
发明人： Robert J. Blakely , Samuel M. Babb , Bradley D. Winick , Robert B. Smith
IPC分类号： G06F1/00
CPC分类号： G06F1/26 , H02J2001/008 , Y10T307/50
摘要： An electronic device is disclosed herein. An embodiment of the electronic device comprises an electronic component, wherein the electronic component is operated by a DC voltage. The electronic component comprises an AC to DC converter that converts an AC voltage to the DC voltage, wherein the RMS value of the AC voltage is greater than the DC voltage. The electronic device further comprises a power supply comprising an input and an output. The input is connectable to a line voltage and the output is connected to the AC to DC converter of electronic component. The AC voltage is output by the output of the power supply.
摘要翻译：本文公开了一种电子设备。电子设备的实施例包括电子部件，其中电子部件由DC电压操作。电子部件包括将AC电压转换为DC电压的AC-DC转换器，其中AC电压的RMS值大于DC电压。电子设备还包括电源，其包括输入和输出。输入可连接到线路电压，输出端连接到电子元件的交直流转换器。交流电压由电源输出输出。

9. 发明申请

US20080180108A1 Fault Detection Circuit 有权
标题翻译：故障检测电路
公开(公告)号：US20080180108A1
公开(公告)日：2008-07-31
申请号：US11627730
申请日：2007-01-26
申请人： Kelly Jean Pracht , Samuel M. Babb , Jack Lavier
发明人： Kelly Jean Pracht , Samuel M. Babb , Jack Lavier
IPC分类号： G01R31/08
CPC分类号： G01R31/40
摘要： Power supplies are disclosed herein. One embodiment of a power supply comprises a first input and a second input, wherein the first input and the second input are connectable to a pulse width modulation controller and wherein a pulse width modulation signal is outputable from the pulse width modulation controller. A power stage connected to the first input and the second input. A first comparator having a first comparator first input is connected to the first input and a first comparator second input connected to the output of the power stage. A change of voltage at the output of the first comparator constitutes a difference in phase between the first input and the output of the power stage.
摘要翻译：这里公开了电源。电源的一个实施例包括第一输入和第二输入，其中第一输入和第二输入可连接到脉宽调制控制器，并且其中可从脉宽调制控制器输出脉宽调制信号。连接到第一输入和第二输入的功率级。具有第一比较器第一输入的第一比较器连接到第一输入端，第一比较器第二输入端连接到功率级的输出。在第一比较器的输出处的电压变化构成功率级的第一输入和输出之间的相位差。

10. 发明授权

US5821454A Method and apparatus for reducing electromagnetic emissions from openings in the enclosure of an electronic device 失效
标题翻译：用于减少电子设备外壳中的开口的电磁辐射的方法和设备
公开(公告)号：US5821454A
公开(公告)日：1998-10-13
申请号：US520800
申请日：1995-08-30
申请人： Samuel M. Babb , W. Peter Rawson
发明人： Samuel M. Babb , W. Peter Rawson
IPC分类号： H05K9/00
CPC分类号： H05K9/0052
摘要： Unwanted RF emissions from an imperfect enclosure surrounding an electronic apparatus are reduced by first investigating the RF field strengths inside the enclosure while the apparatus is in operation, and identifying locations where the field strengths are significantly higher than elsewhere. The field strengths at these identified locations are then lowered significantly by placing lossy materials thereat to absorb and thus dissipate RF energy. If the lossy materials are placed in the near field of the actual circuitry that generates the RF then some of that RF is dissipated according to the degree of loading, but without associated reflected energy, and without the need for the lossy material to be a free field absorber that matches the characteristic impedance of the interior of the enclosure. A hybrid arrangement also exists where the lossy material is neither a free field absorber nor located in the near field of the generator, so long as it is located in the near field of a reflector. Thus, a significant portion of the RF that would otherwise leak out is absorbed before it gets the chance, thus reducing the absolute amount of energy that does leak out.
摘要翻译：通过首先在设备运行时首先研究外壳内的射频场强度，以及识别场强显着高于其他地方的位置，来减少来自电子设备周围的不完美外壳的不期望的RF发射。然后通过在其上放置有损耗材料来吸收并消散RF能量，从而显着降低了这些识别位置处的场强。如果有损耗材料被放置在产生RF的实际电路的近场中，那么RF中的一些根据负载的程度而消失，但没有相关的反射能量，并且不需要有损耗材料是自由的场吸收器匹配外壳内部的特性阻抗。还存在混合布置，其中有损材料既不是自由场吸收体也不位于发生器的近场中，只要其位于反射器的近场中。因此，否则泄漏的RF的很大一部分在其获得机会之前被吸收，从而减少漏出的能量的绝对量。

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