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1. 发明申请

US20070071886A1 Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces 有权
公开(公告)号：US20070071886A1
公开(公告)日：2007-03-29
申请号：US11605381
申请日：2006-11-29
申请人： Samuel Babb , Lowell Kolb , Brian Davis , Jonathan Mankin , Kristina Mann , Paul Mazurkiewicz , Marvin Wahlen
发明人： Samuel Babb , Lowell Kolb , Brian Davis , Jonathan Mankin , Kristina Mann , Paul Mazurkiewicz , Marvin Wahlen
IPC分类号： B05D5/12 , H05K3/00
CPC分类号： H01L23/552 , H01L2924/0002 , H01L2924/3011 , H05K1/0218 , H05K3/284 , H05K9/0039 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T428/25 , H01L2924/00
摘要： An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions. A high viscosity, non-electrically-conductive filler material is applied to printed circuit board regions that have surfaces that are cavitatious and/or which have a highly variable slope. The filler material can be used in conjunction with conformal EMI shield board level coating. The high viscosity, electrically non-conductive filler material substantially covers each cavity such that the covered cavity is inaccessible and that the covered region of the printed circuit board has a contiguous, contoured surface. A pre-manufactured non-electrically-conductive component cover can be mounted over a corresponding component and secured to the printed wiring board. The component cover and printed wiring board surround the component, forming a sealed enclosure. The component cover has a thin cross-section and an interior surface that follows closely the surface of the component. This minimizes the volume enclosed by the component cover. In addition, the exterior surface of the component cover has a low profile, and prevents the conformal EMI shield from physically contacting the covered component. Instead, the exterior surface of the component cover is coated with the EMI shield. This enables the covered component to be removed from the printed circuit board for repair, replacement or salvage without having to risk damage to the printed wiring board or component that may occur with the removal of a conformal EMI shield applied directly to the component.

2. 发明授权

US07196275B2 EMI shield that adheres to and conforms with printed circuit board surfaces 有权
标题翻译： EMI屏蔽层粘附并符合印刷电路板表面
公开(公告)号：US07196275B2
公开(公告)日：2007-03-27
申请号：US10674107
申请日：2003-09-29
申请人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
发明人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
IPC分类号： H05K9/00
CPC分类号： H01L23/552 , H01L2924/0002 , H01L2924/3011 , H05K1/0218 , H05K3/284 , H05K9/0039 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T428/25 , H01L2924/00
摘要： An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.
摘要翻译：一种电连续接地的保形EMI保护屏蔽以及将其直接施加到印刷电路板表面的方法。 EMI屏蔽层粘附并符合组件和印刷电路板的表面。屏蔽层采取覆盖表面的形状，同时几乎不增加表面的尺寸。 EMI屏蔽包括低粘度，高粘附导电和电介质涂层，其中每一层可以使用常规喷涂技术施加在一层或多层中。导电涂层基本上防止由屏蔽组件产生的所有电磁辐射发散超过保形涂层。介电涂层最初被施加到印刷电路板的选定位置，以便插入在导电涂层和印刷电路板之间，防止导电涂层电接触所选择的部件和印刷电路板区域。

3. 发明授权

US08156644B2 Method for manufacturing a printed circuit board having conformal EMI shield 有权
标题翻译：制造具有适形EMI屏蔽的印刷电路板的方法
公开(公告)号：US08156644B2
公开(公告)日：2012-04-17
申请号：US11605381
申请日：2006-11-29
申请人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
发明人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
IPC分类号： H05K3/30
CPC分类号： H01L23/552 , H01L2924/0002 , H01L2924/3011 , H05K1/0218 , H05K3/284 , H05K9/0039 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T428/25 , H01L2924/00
摘要： An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions. A high viscosity, non-electrically-conductive filler material is applied to printed circuit board regions that have surfaces that are cavitatious and/or which have a highly variable slope.
摘要翻译：一种电连续接地的保形EMI保护屏蔽以及将其直接施加到印刷电路板表面的方法。 EMI屏蔽层粘附并符合组件和印刷电路板的表面。屏蔽层采取覆盖表面的形状，同时几乎不增加表面的尺寸。 EMI屏蔽包括低粘度，高粘附性导电和电介质涂层，每个可以施加在一个或多个层中。介电涂层最初被施加到印刷电路板的选定位置，以便插入在导电涂层和印刷电路板之间，防止导电涂层电接触所选择的部件和印刷电路板区域。将高粘度非导电填料材料施加到具有空腔表面和/或具有高度可变斜率的表面的印刷电路板区域上。

4. 发明授权

US06900383B2 Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces 有权
公开(公告)号：US06900383B2
公开(公告)日：2005-05-31
申请号：US09812274
申请日：2001-03-19
申请人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
发明人： Samuel M. Babb , Lowell E Kolb , Brian Davis , Jonathan P Mankin , Kristina L Mann , Paul H Mazurkiewicz , Marvin Wahlen
IPC分类号： H01L23/552 , H05K1/02 , H05K3/28 , H05K9/00
CPC分类号： H01L23/552 , H01L2924/0002 , H01L2924/3011 , H05K1/0218 , H05K3/284 , H05K9/0039 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T428/25 , H01L2924/00
摘要： An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions. A high viscosity, non-electrically-conductive filler material is applied to printed circuit board regions that have surfaces that are cavitatious and/or which have a highly variable slope. The filler material can be used in conjunction with conformal EMI shield board level coating. The high viscosity, electrically non-conductive filler material substantially covers each cavity such that the covered cavity is inaccessible and that the covered region of the printed circuit board has a contiguous, contoured surface. A pre-manufactured non-electrically-conductive component cover can be mounted over a corresponding component and secured to the printed wiring board. The component cover and printed wiring board surround the component, forming a sealed enclosure. The component cover has a thin cross-section and an interior surface that follows closely the surface of the component. This minimizes the volume enclosed by the component cover. In addition, the exterior surface of the component cover has a low profile, and prevents the conformal EMI shield from physically contacting the covered component. Instead, the exterior surface of the component cover is coated with the EMI shield.

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