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1. 发明授权

US10568204B2 Conformal 3D non-planar multi-layer circuitry 有权
公开(公告)号：US10568204B2
公开(公告)日：2020-02-18
申请号：US15876552
申请日：2018-01-22
申请人： LOCKHEED MARTIN CORPORATION
发明人： Stephen Gonya , Kenn Twigg , Jim Patterson
IPC分类号： H05K1/11 , H05K1/05 , H05K3/00 , H05K1/02 , H05K3/46 , H05K1/09
摘要： A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.

2. 发明授权

US10827608B2 Conformal 3D non-planar multi-layer circuitry 有权
公开(公告)号：US10827608B2
公开(公告)日：2020-11-03
申请号：US16351250
申请日：2019-03-12
申请人： LOCKHEED MARTIN CORPORATION
发明人： Stephen Gonya , Kenn Twigg , Jim Patterson
IPC分类号： H05K1/11 , H05K1/05 , H05K3/00 , H05K1/02 , H05K3/46 , H05K1/09
摘要： A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited.

3. 发明授权

US09894760B2 Conformal 3D non-planar multi-layer circuitry 有权
公开(公告)号：US09894760B2
公开(公告)日：2018-02-13
申请号：US14993197
申请日：2016-01-12
申请人： Lockheed Martin Corporation
发明人： Stephen Gonya , Kenn Twigg , Jim Patterson
IPC分类号： H05K1/11 , H05K1/05 , H05K1/09 , H01B13/00 , H05K1/02 , H05K3/46
CPC分类号： H05K1/0298 , H05K1/0284 , H05K1/053 , H05K1/09 , H05K1/115 , H05K3/4644 , H05K2201/09018 , H05K2203/0315
摘要： A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.

4. 发明申请

US20160128185A1 CONFORMAL 3D NON-PLANAR MULTI-LAYER CIRCUITRY 有权
标题翻译：一致的3D非平面多层电路
公开(公告)号：US20160128185A1
公开(公告)日：2016-05-05
申请号：US14993197
申请日：2016-01-12
申请人： Lockheed Martin Corporation
发明人： Stephen Gonya , Kenn Twigg , Jim Patterson
IPC分类号： H05K1/02 , H05K1/09 , H05K1/11
CPC分类号： H05K1/0298 , H05K1/0284 , H05K1/053 , H05K1/09 , H05K1/115 , H05K3/4644 , H05K2201/09018 , H05K2203/0315
摘要： A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.
摘要翻译：描述了制造共形非平面多层电路的方法。该方法可以包括提供具有非平面表面的衬底和在衬底上沉积第一适形电介质层，第一保形电介质层与衬底的非平面表面一致并且具有非平面表面。该方法还可以包括在第一保形电介质层上施加第一保形电路层。该方法可以包括在第一共形电路层上沉积第二共形介电层，第二共形绝缘层与第一共形电路层的非平面表面一致，以及在第二共形介电层上施加第二共形电路层。连续层可以顺序沉积。微电极可以在电路层之间提供电连接。

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