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1. 发明授权

US10568204B2 Conformal 3D non-planar multi-layer circuitry 有权
公开(公告)号：US10568204B2
公开(公告)日：2020-02-18
申请号：US15876552
申请日：2018-01-22
申请人： LOCKHEED MARTIN CORPORATION
发明人： Stephen Gonya , Kenn Twigg , Jim Patterson
IPC分类号： H05K1/11 , H05K1/05 , H05K3/00 , H05K1/02 , H05K3/46 , H05K1/09
摘要： A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.

2. 发明申请

US20160105970A1 FINE LINE 3D NON-PLANAR CONFORMING CIRCUIT 审中-公开
公开(公告)号：US20160105970A1
公开(公告)日：2016-04-14
申请号：US14511549
申请日：2014-10-10
申请人： Lockheed Martin Corporation
发明人： Stephen Gonya , James Sean Eiche , James Patterson , Kenneth R. Twigg
IPC分类号： H05K3/02 , H05K3/28 , H05K1/11 , H05K1/02 , H05K1/09 , H05K3/00 , H05K3/40
CPC分类号： H05K1/0284 , H05K3/06 , H05K2201/0179 , H05K2201/0317 , H05K2201/09872
摘要： A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed.

3. 发明授权

US09812228B2 X-ray obscuration film and related techniques 有权
公开(公告)号：US09812228B2
公开(公告)日：2017-11-07
申请号：US15367642
申请日：2016-12-02
申请人： Lockheed Martin Corporation
发明人： Stephen Gonya , Jesse Iannon
IPC分类号： H01L23/00 , G21F3/00 , H05K1/02 , H01L23/552
CPC分类号： G21F3/00 , H01L23/552 , H01L23/573 , H01L2924/0002 , H05K1/02 , H05K1/0209 , H05K1/0275 , H05K2201/0715 , H05K2201/09681 , H01L2924/00
摘要： An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.

4. 发明申请

US20150303154A1 X-RAY OBSCURATION FILM AND RELATED TECHNIQUES 有权
标题翻译： X射线观察膜及相关技术
公开(公告)号：US20150303154A1
公开(公告)日：2015-10-22
申请号：US14789885
申请日：2015-07-01
申请人： Lockheed Martin Corporation
发明人： Stephen Gonya , Jesse Iannon
IPC分类号： H01L23/00 , H05K9/00
CPC分类号： G21F3/00 , H01L23/552 , H01L23/573 , H01L2924/0002 , H05K1/02 , H05K1/0209 , H05K1/0275 , H05K2201/0715 , H05K2201/09681 , H01L2924/00
摘要： An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.
摘要翻译：包括一个或多个金属丝网层和相邻的铟箔层的X射线遮蔽（XRO）膜，其具有延伸到金属丝网的开口中并与其金属部分接触的部分。 XRO膜能够吸收X射线能量的至少一部分，从而当XRO膜与电子电路耦合并且放置在X射线源和X射线检测器之间并经受射线照相时产生干涉图案检查。干涉图案可以产生足够的视觉静电，以在经受射线照相检查技术时有效地遮蔽电子电路中的电路线。 XRO膜可以比用于防止X射线检查的现有解决方案薄得多，示例性实施例不超过5密耳厚。金属XRO膜还可以为电子电路提供电磁屏蔽和/或散热。

5. 发明授权

US10123410B2 Fine line 3D non-planar conforming circuit 有权
公开(公告)号：US10123410B2
公开(公告)日：2018-11-06
申请号：US14511549
申请日：2014-10-10
申请人： Lockheed Martin Corporation
发明人： Stephen Gonya , James Sean Eiche , James Patterson , Kenneth R. Twigg
IPC分类号： H05K1/11 , H05K1/05 , H05K1/09 , H05K13/00 , H05K1/02 , H05K3/06
摘要： A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed.

6. 发明申请

US20140374627A1 X-RAY OBSCURATION FILM AND RELATED TECHNIQUES 有权
标题翻译： X射线观察膜及相关技术
公开(公告)号：US20140374627A1
公开(公告)日：2014-12-25
申请号：US14325670
申请日：2014-07-08
申请人： Lockheed Martin Corporation
发明人： Stephen Gonya , Jesse Iannon
IPC分类号： G21F3/00
CPC分类号： G21F3/00 , H01L23/552 , H01L23/573 , H01L2924/0002 , H05K1/02 , H05K1/0209 , H05K1/0275 , H05K2201/0715 , H05K2201/09681 , H01L2924/00
摘要： An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.
摘要翻译：包括一个或多个金属丝网层和相邻的铟箔层的X射线遮蔽（XRO）膜，其具有延伸到金属丝网的开口中并与其金属部分接触的部分。 XRO膜能够吸收X射线能量的至少一部分，从而当XRO膜与电子电路耦合并且放置在X射线源和X射线检测器之间并经受射线照相时产生干涉图案检查。干涉图案可以产生足够的视觉静电，以在经受射线照相检查技术时有效地遮蔽电子电路中的电路线。 XRO膜可以比用于防止X射线检查的现有解决方案薄得多，示例性实施例不超过5密耳厚。金属XRO膜还可以为电子电路提供电磁屏蔽和/或散热。

7. 发明授权

US08772745B1 X-ray obscuration film and related techniques 有权
标题翻译： X射线遮蔽膜及相关技术
公开(公告)号：US08772745B1
公开(公告)日：2014-07-08
申请号：US13827297
申请日：2013-03-14
申请人： Lockheed Martin Corporation
发明人： Stephen Gonya , Jesse Iannon
IPC分类号： B41M3/14
CPC分类号： G21F3/00 , H01L23/552 , H01L23/573 , H01L2924/0002 , H05K1/02 , H05K1/0209 , H05K1/0275 , H05K2201/0715 , H05K2201/09681 , H01L2924/00
摘要： An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.
摘要翻译：包括一个或多个金属丝网层和相邻的铟箔层的X射线遮蔽（XRO）膜，其具有延伸到金属丝网的开口中并与其金属部分接触的部分。 XRO膜能够吸收X射线能量的至少一部分，从而当XRO膜与电子电路耦合并且放置在X射线源和X射线检测器之间并经受射线照相时产生干涉图案检查。干涉图案可以产生足够的视觉静电，以在经受射线照相检查技术时有效地遮蔽电子电路中的电路线。 XRO膜可以比用于防止X射线检查的现有解决方案薄得多，示例性实施例不超过5密耳厚。金属XRO膜还可以为电子电路提供电磁屏蔽和/或散热。

8. 发明授权

US10827608B2 Conformal 3D non-planar multi-layer circuitry 有权
公开(公告)号：US10827608B2
公开(公告)日：2020-11-03
申请号：US16351250
申请日：2019-03-12
申请人： LOCKHEED MARTIN CORPORATION
发明人： Stephen Gonya , Kenn Twigg , Jim Patterson
IPC分类号： H05K1/11 , H05K1/05 , H05K3/00 , H05K1/02 , H05K3/46 , H05K1/09
摘要： A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited.

9. 发明授权

US09087617B2 X-ray obscuration film and related techniques 有权
标题翻译： X射线遮蔽膜及相关技术
公开(公告)号：US09087617B2
公开(公告)日：2015-07-21
申请号：US14325670
申请日：2014-07-08
申请人： Lockheed Martin Corporation
发明人： Stephen Gonya , Jesse Iannon
IPC分类号： G21F1/12 , G21F3/00 , H05K1/02 , H01L23/00
CPC分类号： G21F3/00 , H01L23/552 , H01L23/573 , H01L2924/0002 , H05K1/02 , H05K1/0209 , H05K1/0275 , H05K2201/0715 , H05K2201/09681 , H01L2924/00
摘要： An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.
摘要翻译：包括一个或多个金属丝网层和相邻的铟箔层的X射线遮蔽（XRO）膜，其具有延伸到金属丝网的开口中并与其金属部分接触的部分。 XRO膜能够吸收X射线能量的至少一部分，从而当XRO膜与电子电路耦合并且放置在X射线源和X射线检测器之间并经受射线照相时产生干涉图案检查。干涉图案可以产生足够的视觉静电，以在经受射线照相检查技术时有效地遮蔽电子电路中的电路线。 XRO膜可以比用于防止X射线检查的现有解决方案薄得多，示例性实施例不超过5密耳厚。金属XRO膜还可以为电子电路提供电磁屏蔽和/或散热。

10. 发明授权

US10154584B2 Method of producing a fine line 3D non-planar conforming circuit 有权
公开(公告)号：US10154584B2
公开(公告)日：2018-12-11
申请号：US15222333
申请日：2016-07-28
申请人： Lockheed Martin Corporation
发明人： Stephen Gonya , James Sean Eiche , James Patterson , Kenneth R. Twigg
IPC分类号： H05K1/02 , H05K3/06
摘要： A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed.

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