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    • 2. 发明授权
    • Photomask pattern
    • 光掩模图案
    • US07008732B2
    • 2006-03-07
    • US10457978
    • 2003-06-09
    • Chin-Lung LinChuen-Huei YangWen-Tien Hung
    • Chin-Lung LinChuen-Huei YangWen-Tien Hung
    • G03F9/00
    • G03F1/36G03F1/26
    • A photomask pattern on a substrate is provided. The photomask pattern comprises a main pattern and a sub-resolution assistant feature. The sub-resolution assistant feature is located on the sides of the main pattern. Furthermore, the sub-resolution assistant feature comprises a first assistant feature and a second assistant feature. The first assistant feature is formed close to the main pattern and the second assistant feature is formed further away from the main pattern but adjacent to the first assistant feature. There is a phase difference of 180° between the first assistant feature and the main pattern. Similarly, there is a phase difference of 180° between the second assistant feature and the first assistant feature. Since the main pattern is bordered by reverse-phase assistant feature, exposure resolution of the photomask is increased.
    • 提供了基板上的光掩模图案。 光掩模图案包括主图案和子分辨率辅助特征。 子分辨率辅助功能位于主图案的两侧。 此外,子分辨率辅助特征包括第一辅助特征和第二辅助特征。 第一辅助功能形成在主模式附近,第二辅助功能远离主模式形成,但与第一辅助功能相邻。 第一辅助特征与主图案之间存在180°的相位差。 类似地,在第二辅助特征和第一辅助特征之间存在180°的相位差。 由于主图案由反相辅助功能界定,因此增加了光掩模的曝光分辨率。
    • 8. 发明授权
    • Process utilizing relationship between reflectivity and resist thickness
for inhibition of side effect caused by halftone phase shift masks
    • 工艺利用反射率和抗蚀剂厚度之间的关系来抑制由半色调相移掩模引起的副作用
    • US5916717A
    • 1999-06-29
    • US44058
    • 1998-03-19
    • Chuen-Huei YangChang-Ming Dai
    • Chuen-Huei YangChang-Ming Dai
    • G03F7/16G03F9/00
    • G03F7/162
    • A method of forming and exposing a layer of resist which will minimize or eliminate side lobe effect resulting from the use of phase shifting masks or attenuating phase shifting masks in the exposed and developed layer of resist. The curve of reflectivity as a function of resist thickness, or swing curve, is calculated using the index of refraction, n, and the extinction coefficient, k, of the resist material and plotted. An optimum thickness of the resist corresponding to a relative maximum of the swing curve is chosen. The angular velocity used to spin the resist onto wafers is selected to produce the optimum thickness. Wafers having a resist layer with the optimum thickness are then prepared, exposed, and developed. The layer of resist may have a layer of anti-reflective material on the top surface of the layer of resist if desired.
    • 形成和曝光抗蚀剂层的方法,其将最小化或消除在曝光和显影的抗蚀剂层中使用相移掩模或衰减相移掩模产生的旁瓣效应。 使用折射率n和抗蚀剂材料的消光系数k来计算反射率作为抗蚀剂厚度或摆动曲线的函数的曲线,并绘制。 选择对应于摆动曲线的相对最大值的抗蚀剂的最佳厚度。 选择用于将抗蚀剂旋转到晶片上的角速度以产生最佳厚度。 然后制备具有最佳厚度的抗蚀剂层的晶片,曝光和显影。 如果需要,抗蚀剂层可以在抗蚀剂层的顶表面上具有一层抗反射材料。