专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06891116B2 Substrate with liquid electrode 失效
标题翻译：基板与液体电极
公开(公告)号：US06891116B2
公开(公告)日：2005-05-10
申请号：US10414128
申请日：2003-04-14
申请人： Lewis R. Dove , Marvin Glenn Wong , Mitsuchika Saito
发明人： Lewis R. Dove , Marvin Glenn Wong , Mitsuchika Saito
IPC分类号： H01H29/28 , H01H29/00
CPC分类号： H01H29/28 , H01H2029/008
摘要： A substrate, a method for producing a substrate, and a switch incorporating a substrate are disclosed. In one embodiment, the substrate has a first layer, a first electrode deposited on the first layer, and a second layer mated to the first layer. The second layer defines a duct leading from the first electrode to a surface of the second layer opposite the first electrode. A liquid electrode fills at least a portion of the duct.
摘要翻译：公开了一种基板，一种基板的制造方法和一种结合有基板的开关。在一个实施例中，衬底具有第一层，沉积在第一层上的第一电极和与第一层配合的第二层。第二层限定从第一电极引导到与第一电极相对的第二层的表面的导管。液体电极填充管道的至少一部分。

2. 发明授权

US06894237B2 Formation of signal paths to increase maximum signal-carrying frequency of a fluid-based switch 失效
标题翻译：信号路径的形成，以增加基于流体的开关的最大信号承载频率
公开(公告)号：US06894237B2
公开(公告)日：2005-05-17
申请号：US10413855
申请日：2003-04-14
申请人： Marvin Glenn Wong , Julius K. Botka , Lewis R. Dove
发明人： Marvin Glenn Wong , Julius K. Botka , Lewis R. Dove
IPC分类号： H01H59/00 , H01H29/00 , H01H29/30
CPC分类号： H01H29/30 , H01H29/004 , H01H2029/008
摘要： A switch has a channel plate that defines at least a portion of a number of cavities. A switching fluid is held within one or more of the cavities, and is movable between at least first and second switch states in response to forces that are applied to the switching fluid. A plurality of planar signal conductors extend from edges of the switch to within the one or more cavities holding the switching fluid, and are in wetted contact with the switching fluid. Corners in paths of the planar signal conductors may be limited to greater than 90°, about 135°, or equal to or greater than 135°. In one embodiment, signal path corners are so limited, but the planar signal conductors do not extend to the edges of the switch. In another embodiment, the one or more cavities holding the switching fluid are at least partly defined by a bent switching fluid channel.
摘要翻译：开关具有限定多个空腔的至少一部分的通道板。开关流体保持在一个或多个空腔内，并且响应于施加到开关流体的力，可在至少第一和第二开关状态之间移动。多个平面信号导体从开关的边缘延伸到保持开关流体的一个或多个空腔内，并与开关流体接触。平面信号导体的路径中的角可以限制在大于90°，大约135°或等于或大于135°。在一个实施例中，信号路径角受到限制，但是平面信号导体不延伸到开关的边缘。在另一个实施例中，保持开关流体的一个或多个空腔至少部分地由弯曲的开关流体通道限定。

3. 发明授权

US06781075B2 Electrically isolated liquid metal micro-switches for integrally shielded microcircuits 失效
标题翻译：用于整体屏蔽微电路的电隔离液态金属微动开关
公开(公告)号：US06781075B2
公开(公告)日：2004-08-24
申请号：US10639539
申请日：2003-08-12
申请人： Lewis R Dove , John F Casey , Marvin Glenn Wong
发明人： Lewis R Dove , John F Casey , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H61/00 , H01H2029/008 , H01H2061/006
摘要： Liquid metal micro-switches. Liquid metal micro-switches and techniques for fabricating them in integrally shielded microcircuits are disclosed. The liquid metal micro-switches can be integrated directly into the construction of shielded thick film microwave modules. This integration is useful in applications requiring high frequency switching with high levels of electrical isolation.
摘要翻译：液态金属微动开关。公开了用于在整体屏蔽的微电路中制造它们的液态金属微动开关和技术。液态金属微动开关可以直接集成到屏蔽厚膜微波模块的结构中。该集成在需要高电平隔离的高频开关的应用中非常有用。

4. 发明授权

US06759610B1 Multi-layer assembly of stacked LIMMS devices with liquid metal vias 失效
标题翻译：具有液态金属通孔的堆叠LIMMS器件的多层组装
公开(公告)号：US06759610B1
公开(公告)日：2004-07-06
申请号：US10455031
申请日：2003-06-05
申请人： Lewis R. Dove , Marvin Glenn Wong
发明人： Lewis R. Dove , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H29/28 , H01H2029/008
摘要： The number of LIMMS devices in an assembly is increased by stacking multiple layers of LIMMS devices on top of one another, and interconnecting those device layers at an array of solder pads using solder balls. Each device layer uses vias to bring the needed conductors to the array of solder pads. All signals for the entire multi-layer assembly can be routed through the bottom LIMMS device layer to pass, through another array of solder pads onto a “mother substrate” of ceramic or other material that carries the multi-layer assembly. Alternatively, signals may enter or leave the upper LIMMS device layer by way of a flexible printed circuit harness. Vias may pass, either directly or by “dog legs” on interior surfaces, completely through the bottom LIMMS device layer, and through other device layers as needed. Opposing vias formed in the pair of substrates in a device layer have interior non-contacting pads that are bridged by a small ball of liquid metal held in place by a hole in a dielectric layer. Using patterned layers of dielectric to form bridging holes, cavities, channels and interconnecting passages for the LIMMS devices of both layers facilitates these needed vias and traces. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141A/D thick film compositions from DuPont.
摘要翻译：组装中LIMMS器件的数量通过将多层LIMMS器件堆叠在一起而增加，并且使用焊球将焊盘阵列上的那些器件层互连在一起。每个器件层使用通孔将所需的导体带到焊盘阵列上。用于整个多层组件的所有信号可以通过底部LIMMS器件层通过另一个焊盘阵列传递到陶瓷或承载多层组件的其它材料的“母体衬底”上。或者，信号可以通过柔性印刷电路线束进入或离开上LIMMS设备层。通孔可以直接或通过内表面上的“狗腿”完全通过底部LIMMS设备层，并根据需要通过其他设备层。在器件层中的一对衬底中形成的相反的通孔具有内部非接触焊盘，其通过由电介质层中的孔保持就位的液体金属的小球桥接。使用图案化的电介质层形成桥接孔，用于两层的LIMMS器件的空腔，通道和互连通道便于这些所需的通孔和迹线。可以作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。

5. 发明授权

US06750413B1 Liquid metal micro switches using patterned thick film dielectric as channels and a thin ceramic or glass cover plate 失效
标题翻译：使用图案化厚膜电介质作为通道的液态金属微动开关和薄陶瓷或玻璃盖板
公开(公告)号：US06750413B1
公开(公告)日：2004-06-15
申请号：US10423316
申请日：2003-04-25
申请人： Lewis R Dove , Marvin Glenn Wong
发明人： Lewis R Dove , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H61/02 , H01H2029/008 , H01H2061/006
摘要： Channels and cavities in a LIMMS device are formed from a layer of thick film dielectric material deposited on a substrate, which layer is then covered with a thin cover plate of ceramic or perhaps glass. The layer of dielectric material may be patterned using established thick film techniques, and good dimensional control can be achieved. The dielectric layer is itself its own hermetic seal against the substrate, and readily lends itself to the formation of the additional hermetic seal needed between itself and the cover plate. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141A/D thick film compositions from DuPont.
摘要翻译： LIMMS装置中的通道和空腔由沉积在基底上的厚膜介电材料层形成，然后该层被陶瓷或可能的玻璃的薄盖板覆盖。可以使用已建立的厚膜技术对电介质材料层进行图案化，并且可以实现良好的尺寸控制。电介质层本身就是其自身对衬底的气密密封，并且容易使其自身与形成其本身与盖板之间所需的另外的气密密封。可以作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。

6. 发明授权

US06841746B2 Bent switching fluid cavity 失效
标题翻译：弯曲开关流体腔
公开(公告)号：US06841746B2
公开(公告)日：2005-01-11
申请号：US10414343
申请日：2003-04-14
申请人： Marvin Glenn Wong , Lewis R. Dove , Julius K. Botka
发明人： Marvin Glenn Wong , Lewis R. Dove , Julius K. Botka
IPC分类号： H01H29/28 , H01H61/00 , H01H29/00
CPC分类号： H01H29/28 , H01H61/00 , H01H2029/008 , H01H2061/006
摘要： A switch having first and second mated substrates that define therebetween first and second intersecting channels of a bent switching fluid cavity. A switching fluid is held within the bent switching fluid cavity and is movable between first and second switch states in response to forces that are applied to the switching fluid. More of the switching fluid is forced into the first of the intersecting channels in the first switch state, and more of the switching fluid is forced into the second of the intersecting channels in the second switch state.
摘要翻译：一种具有第一和第二配合基板的开关，其在弯曲开关流体腔的第一和第二相交通道之间限定它们。开关流体保持在弯曲的开关流体腔内，并响应于施加到开关流体的力而在第一和第二开关状态之间移动。更多的开关流体在第一开关状态下被迫进入第一相交通道，并且在第二开关状态下，更多的开关流体被迫进入相交通道中的第二个。

7. 发明授权

US06689976B1 Electrically isolated liquid metal micro-switches for integrally shielded microcircuits 失效
公开(公告)号：US06689976B1
公开(公告)日：2004-02-10
申请号：US10266872
申请日：2002-10-08
申请人： Lewis R Dove , John F Casey , Marvin Glenn Wong
发明人： Lewis R Dove , John F Casey , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H61/00 , H01H2029/008 , H01H2061/006
摘要： Liquid metal micro-switches. Liquid metal micro-switches and techniques for fabricating them in integrally shielded microcircuits are disclosed. The liquid metal micro-switches can be integrated directly into the construction of shielded thick film microwave modules. This integration is useful in applications requiring high frequency switching with high levels of electrical isolation.

8. 发明授权

US06825429B2 Hermetic seal and controlled impedance RF connections for a liquid metal micro switch 失效
标题翻译：用于液态金属微动开关的密封和阻抗RF连接
公开(公告)号：US06825429B2
公开(公告)日：2004-11-30
申请号：US10403743
申请日：2003-03-31
申请人： Lewis R. Dove , Marvin Glenn Wong
发明人： Lewis R. Dove , Marvin Glenn Wong
IPC分类号： H01H904
CPC分类号： H01H29/28 , H01H2029/008
摘要： One or more LIMMS devices on a substrate, possibly having same-surface signal conductors, are hermetically sealed by either: (a) Enclosing each entire LIMMS device beneath a common or respective outer cover that is separate from the LIMMS device(s) and impervious to contaminants; or (b) Fabricating each LIMMS device such that its individual cover block (which is already a component of the LIMMS and is not a separate outer cover) can be hermetically sealed against the substrate. Each case must limit the effects of the hermetic seal upon impedances. In case (a) the substrate is covered with a layer of dielectric material matching the ribbon-like footprint of the perimeter of the separate outer cover. In case (b), the entire (solid) footprint of the LIMMS cover block on the substrate receives a layer of dielectric material, which may itself then be covered, save for near its perimeter, with suitable adhesive. In case (a) the outer cover may be soldered to the perimeter footprint. In case (b) the cover block may be soldered to dielectric layer. In another embodiment for cases (a) and (b) glass frit is used in place of solder. Disturbances to signal line impedance may be compensated by changes in signal conductor width. The layer of suitable dielectric material may be a thin sheet or gasket of previously patterned ceramic material, or it may be formed by the application of a thick film paste. Suitable thick film dielectric materials deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141 A/D thick film compositions from DuPont.
摘要翻译：可能具有相同表面信号导体的衬底上的一个或多个LIMMS器件通过以下方式密封：（a）将每个整个LIMMS器件封闭在与LIMMS器件分开的通用或相应的外盖下方，并且不可渗透污染物或（b）制造每个LIMMS装置，使其单独的盖块（其已经是LIMMS的部件并且不是单独的外盖）可以与衬底气密密封。每种情况都必须限制气密密封对阻抗的影响。在（a）的情况下，衬底被与分离的外盖的周边的带状足迹相匹配的介电材料层覆盖。在（b）的情况下，衬底上的LIMMS覆盖块的整个（实心）占地面积接收一层电介质材料，该材料层本身可以用合适的粘合剂在其周边附近被覆盖。在（a）的情况下，外盖可以焊接到周边覆盖区。在（b）的情况下，盖块可以焊接到电介质层。在（a）和（b）的情况的另一实施例中，使用玻璃料代替焊料。信号线阻抗的干扰可以通过信号导体宽度的变化来补偿。合适的介电材料层可以是先前图案化的陶瓷材料的薄片或垫片，或者可以通过施加厚膜糊形成。作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。

9. 发明授权

US06777630B1 Liquid metal micro switches using as channels and heater cavities matching patterned thick film dielectric layers on opposing thin ceramic plates 失效
标题翻译：液态金属微动开关，用作通道和加热器腔体，在相对的薄陶瓷板上匹配图案化的厚膜电介质层
公开(公告)号：US06777630B1
公开(公告)日：2004-08-17
申请号：US10426449
申请日：2003-04-30
申请人： Lewis R Dove , Paul Thomas Carson , John F Casey , Marvin Glenn Wong
发明人： Lewis R Dove , Paul Thomas Carson , John F Casey , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H2029/008 , H01H2061/006
摘要： An efficient way to fabricate the channels and cavities in a LIMMS device is to form them as matching upper and lower portions each created as a patterned layer of thick film dielectric material deposited on a respective upper or lower substrate. The two portions are adhered together by a patterned layer of adhesive, and hermetically sealed around an outer perimeter. The heater resistors are mounted atop the lower layer, thus suspending them away from that substrate and exposing more of their surface area. Vias can be used to route the conductors for the heaters and the switched signal contacts through the lower substrate to cooperate with surface mount techniques using solder balls on an array of contact pads. These vias can be made hermetic by their placement within the patterned layers of dielectric material and by covering their exposed ends with pads of hermetic metal. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heracus and the 4141A/D thick film compositions from DuPont.
摘要翻译：在LIMMS装置中制造通道和空腔的有效方法是将它们形成为匹配上部和下部，每个上部和下部被形成为沉积在相应的上部或下部基底上的厚膜介电材料的图案化层。两个部分通过图案化的粘合剂层粘合在一起，并围绕外周密封。加热电阻器安装在下层的顶部，从而将它们悬挂在远离基板并暴露出更多的表面积。通孔可用于将加热器的导体和切换的信号触点通过下基板布线，以使用在接触焊盘阵列上的焊球的表面贴装技术配合。这些通孔可以通过它们放置在图案化的电介质材料层内并通过用气密金属垫覆盖其暴露的末端而形成为气密的。可以作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。

10. 发明授权

US07070908B2 Feature formation in thick-film inks 失效
标题翻译：厚膜油墨中的特征形成
公开(公告)号：US07070908B2
公开(公告)日：2006-07-04
申请号：US10413854
申请日：2003-04-14
申请人： Marvin Glenn Wong
发明人： Marvin Glenn Wong
IPC分类号： G03F7/00
CPC分类号： H01H29/28 , G03F7/40 , H01H2029/008 , H05K3/1258 , H05K2203/0568 , Y10T428/24802
摘要： In a method for forming one or more features in a thick-film ink deposited on a substrate, a photoimagable material is used to define a negative of the one or more features on the substrate. A thick-film ink is then deposited on at least part of the substrate, abutting at least some of the photoimagable material. The thick-film ink is cured, and the photoimagable material is removed. One embodiment of the method is used to produce a channel plate. Another embodiment of the method is used to produce a switch.
摘要翻译：在沉积在基底上的厚膜油墨中形成一个或多个特征的方法中，使用光可光材料来限定衬底上一个或多个特征的负值。然后将厚膜油墨沉积在基板的至少一部分上，与至少一些可光成像材料邻接。固化厚膜油墨，除去光致变质材料。该方法的一个实施例用于产生通道板。该方法的另一实施例用于产生开关。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式