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1. 发明授权

US06841746B2 Bent switching fluid cavity 失效
标题翻译：弯曲开关流体腔
公开(公告)号：US06841746B2
公开(公告)日：2005-01-11
申请号：US10414343
申请日：2003-04-14
申请人： Marvin Glenn Wong , Lewis R. Dove , Julius K. Botka
发明人： Marvin Glenn Wong , Lewis R. Dove , Julius K. Botka
IPC分类号： H01H29/28 , H01H61/00 , H01H29/00
CPC分类号： H01H29/28 , H01H61/00 , H01H2029/008 , H01H2061/006
摘要： A switch having first and second mated substrates that define therebetween first and second intersecting channels of a bent switching fluid cavity. A switching fluid is held within the bent switching fluid cavity and is movable between first and second switch states in response to forces that are applied to the switching fluid. More of the switching fluid is forced into the first of the intersecting channels in the first switch state, and more of the switching fluid is forced into the second of the intersecting channels in the second switch state.
摘要翻译：一种具有第一和第二配合基板的开关，其在弯曲开关流体腔的第一和第二相交通道之间限定它们。开关流体保持在弯曲的开关流体腔内，并响应于施加到开关流体的力而在第一和第二开关状态之间移动。更多的开关流体在第一开关状态下被迫进入第一相交通道，并且在第二开关状态下，更多的开关流体被迫进入相交通道中的第二个。

2. 发明授权

US06689976B1 Electrically isolated liquid metal micro-switches for integrally shielded microcircuits 失效
公开(公告)号：US06689976B1
公开(公告)日：2004-02-10
申请号：US10266872
申请日：2002-10-08
申请人： Lewis R Dove , John F Casey , Marvin Glenn Wong
发明人： Lewis R Dove , John F Casey , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H61/00 , H01H2029/008 , H01H2061/006
摘要： Liquid metal micro-switches. Liquid metal micro-switches and techniques for fabricating them in integrally shielded microcircuits are disclosed. The liquid metal micro-switches can be integrated directly into the construction of shielded thick film microwave modules. This integration is useful in applications requiring high frequency switching with high levels of electrical isolation.

3. 发明授权

US06534844B1 Integrated decoupling networks fabricated on a substrate having shielded quasi-coaxial conductors 失效
标题翻译：在具有屏蔽准同轴导体的基板上制造的集成去耦网络
公开(公告)号：US06534844B1
公开(公告)日：2003-03-18
申请号：US10021380
申请日：2001-10-30
申请人： Lewis R Dove , John F Casey , Anthony R Blume
发明人： Lewis R Dove , John F Casey , Anthony R Blume
IPC分类号： H01L2900
CPC分类号： H05K1/162 , H01L23/66 , H01L24/48 , H01L2223/6622 , H01L2223/6627 , H01L2224/05599 , H01L2224/48091 , H01L2224/484 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01058 , H01L2924/01068 , H01L2924/01072 , H01L2924/01079 , H01L2924/1903 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0221 , H05K1/0306 , H05K1/167 , H05K2201/09672 , H05K2201/09809 , H05K2201/09981 , H01L2224/45099
摘要： A hybrid circuit having a quasi-coaxial fully shielded conductor, and incorporating a ground plane on the component side of a substrate, can bypass and/or filter a signal using integrated thick film components and without through holes or vias. A thin pad of suitable dielectric material may be printed onto the ground plane and then have a layer of metal deposited on its top surface, forming a bypass capacitor. The bypass capacitor can be located very near where it is needed, and only a very short conductor is required to connect the metallic top of the bypass capacitor to the location to be bypassed. The short connecting conductor does not go from one side of the substrate to the other, and the thickness and low dielectric constant of the substrate do not compromise the value of the bypass capacitor. Thick film resistors can be included to form filters, and surface mount resistors and capacitors can be used also.
摘要翻译：具有准同轴全屏蔽导体并且在基板的部件侧上并入接地平面的混合电路可以使用集成的厚膜部件并且没有通孔或通孔来旁路和/或滤波信号。可以将合适介电材料的薄垫片印刷到接地平面上，然后在其顶表面上沉积一层金属，形成旁路电容器。旁路电容器可以非常靠近需要的位置，并且只需要非常短的导体将旁路电容器的金属顶部连接到要旁路的位置。短连接导体不从衬底的一侧到另一侧，并且衬底的厚度和低介电常数不会损害旁路电容器的值。可以包括厚膜电阻器以形成滤波器，并且还可以使用表面贴装电阻器和电容器。

4. 发明授权

US06187372B1 Method for producing large area thick film resistors with uniform thickness 失效
标题翻译：生产厚度均匀的大面积厚膜电阻的方法
公开(公告)号：US06187372B1
公开(公告)日：2001-02-13
申请号：US09301898
申请日：1999-04-29
申请人： Rosemary O Johnson , John F Casey , Lewis R Dove
发明人： Rosemary O Johnson , John F Casey , Lewis R Dove
IPC分类号： B05D512
CPC分类号： H01C17/065 , H05K1/167 , H05K3/1233
摘要： A method for creating large area, thick film resistors with improved predictability and uniformity. “Tent poles” are employed during the printing of the large area resistors to prop up the screen mesh to ensure the resultant resistor does not have a scooped out center portion. The tent poles can be made from gold pads, resistor spots or emulsion spots.
摘要翻译：一种创建具有改进的可预测性和均匀性的大面积厚膜电阻器的方法。在打印大面积电阻器期间采用“帐篷杆”来支撑筛网，以确保所得到的电阻器不具有舀出的中心部分。帐篷杆可以由金垫，电阻点或乳液点制成。

5. 发明授权

US05999861A Method and apparatus for computer-aided design of different-sized RF modular hybrid circuits 失效
标题翻译：用于不同尺寸RF模块混合电路的计算机辅助设计的方法和装置
公开(公告)号：US05999861A
公开(公告)日：1999-12-07
申请号：US872285
申请日：1997-06-10
申请人： Lewis R. Dove , Daniel J. Miller
发明人： Lewis R. Dove , Daniel J. Miller
IPC分类号： G06F17/50 , G06F19/00 , G06G7/66
CPC分类号： G06F17/5068
摘要： A method and apparatus is presented for designing an RF modular hybrid circuit assembly. The apparatus comprises a rule-based control mechanism, a graphical user interface and a library of RF hybrid elements including model front- and back-sides, and input/output instances. The method comprises the steps of initializing standardized front- and back-plane models, adding input/output instances along the perimeter of the back-plane, designing the hybrid circuit on the front-plane and combining the two planes to arrive at an RF modular hybrid layout design. A data library of RF hybrid elements is provided to facilitate rapid prototyping. The final design is then sent concurrently to a photo-plotter and a laser subsystem for printing the thick-film and cutting the PTHs respectively.
摘要翻译：提出了一种用于设计RF模块化混合电路组件的方法和装置。该装置包括基于规则的控制机制，图形用户界面和包括模型前端和后端以及输入/输出实例的RF混合元件库。该方法包括以下步骤：初始化标准化的前平面模型和后平面模型，沿着背面的周边添加输入/输出实例，在前平面上设计混合电路并组合两个平面以得到RF模块混合布局设计。提供RF混合元件的数据库，以促进快速原型设计。然后将最终设计同时发送到光绘图仪和用于印刷厚膜并分别切割PTH的激光子系统。

6. 发明授权

US06809931B2 Heat sink apparatus that provides electrical isolation for integrally shielded circuit 失效
公开(公告)号：US06809931B2
公开(公告)日：2004-10-26
申请号：US10615472
申请日：2003-07-07
申请人： Lewis R. Dove , Marvin G. Wong
发明人： Lewis R. Dove , Marvin G. Wong
IPC分类号： H05K720
CPC分类号： H01L23/552 , H01L23/13 , H01L23/3677 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a heat sink apparatus that provides electrical isolation for an integrally shielded, electronic circuit. The heat sink apparatus comprises a substrate having a first hole extending between a first and second sides of the substrate, a conductive layer attached to the second side, an electrically and thermally conductive heat sink having a protrusion, wherein the heat sink is attached to the first side of the substrate, and an electrically conductive plate having a second hole extending through the plate. The protrusion extends through the first hole and has a surface located at substantially the same level as that of the conductive layer. An electronic component is attachable to the protrusion surface. The plate is electrically coupled to the conductive layer and to the protrusion surface such that the area between the protrusion and the conductive layer is covered by electrically conducting area of the plate.

7. 发明授权

US06750413B1 Liquid metal micro switches using patterned thick film dielectric as channels and a thin ceramic or glass cover plate 失效
标题翻译：使用图案化厚膜电介质作为通道的液态金属微动开关和薄陶瓷或玻璃盖板
公开(公告)号：US06750413B1
公开(公告)日：2004-06-15
申请号：US10423316
申请日：2003-04-25
申请人： Lewis R Dove , Marvin Glenn Wong
发明人： Lewis R Dove , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H61/02 , H01H2029/008 , H01H2061/006
摘要： Channels and cavities in a LIMMS device are formed from a layer of thick film dielectric material deposited on a substrate, which layer is then covered with a thin cover plate of ceramic or perhaps glass. The layer of dielectric material may be patterned using established thick film techniques, and good dimensional control can be achieved. The dielectric layer is itself its own hermetic seal against the substrate, and readily lends itself to the formation of the additional hermetic seal needed between itself and the cover plate. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141A/D thick film compositions from DuPont.
摘要翻译： LIMMS装置中的通道和空腔由沉积在基底上的厚膜介电材料层形成，然后该层被陶瓷或可能的玻璃的薄盖板覆盖。可以使用已建立的厚膜技术对电介质材料层进行图案化，并且可以实现良好的尺寸控制。电介质层本身就是其自身对衬底的气密密封，并且容易使其自身与形成其本身与盖板之间所需的另外的气密密封。可以作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。

8. 发明授权

US06646527B1 High frequency attenuator using liquid metal micro switches 失效
标题翻译：高频衰减器采用液态金属微动开关
公开(公告)号：US06646527B1
公开(公告)日：2003-11-11
申请号：US10136147
申请日：2002-04-30
申请人： Lewis R Dove , John R Lindsey , David J Dascher
发明人： Lewis R Dove , John R Lindsey , David J Dascher
IPC分类号： H01H2900
CPC分类号： H01P1/22 , H01H1/0036 , H01H29/28 , H01H2029/008
摘要： Resonance within an attenuator relay caused by stray coupling capacitances to, and stray reactance within the switched conductor that replaces the attenuator section, is mitigated by reducing the stray coupling capacitances to as low a value as possible, and by using a conductor that is a section of controlled impedance transmission line that matches the system into which the attenuator relay has been placed. A substrate having SPDT LIMMS switches on either side of a switched transmission line segment and its associated attenuator, all of which are fabricated on the substrate, will have significantly lower stray coupling capacitance across the open parts of the switches when the attenuator segment is in use. This will increase the frequency for the onset of the resonance driven by the RF voltage drop across the attenuator. A reduction in the amplitude of the resonance can be obtained by including on the substrate an additional pair of LIMMS damping switches at each end of the transmission line segment. These damping switches each connect a terminating resistor to the ends of the transmission line segment when the attenuator section is in use. This loads the resonator and reduces the amplitude of the resonance. Still further improvement can be obtained by locating one of the damping switches and its termination resistor near (but preferably not exactly at) the middle of the transmission line segment.
摘要翻译：由杂散耦合电容引起的衰减器继电器中的谐振和取代衰减器部分的开关导体内的杂散电抗可以通过将杂散耦合电容减小到尽可能低的值，并通过使用导体与控制阻抗传输线匹配的衰减器继电器已经放置在其中的系统。在使用衰减器段时，具有SPDT LIMMS的开关的开关部分上的开关传输线段及其相关联的衰减器的基板上的所有这些都被制造在基板上将具有明显较低的开关部分的杂散耦合电容。这将增加由衰减器上的RF电压降驱动的谐振开始的频率。可以通过在基板上在传输线段的每一端包括另外的一对LIMMS阻尼开关来获得谐振振幅的减小。当衰减器部分使用时，这些阻尼开关各自将终端电阻器连接到传输线段的端部。这样会加载谐振器并降低谐振的幅度。通过将阻尼开关及其终端电阻之一定位在传输线路段的中间附近（但优选地不在精确地）处，可以获得进一步的改进。

9. 发明授权

US06255730B1 Integrated low cost thick film RF module 失效
标题翻译：集成低成本厚膜射频模块
公开(公告)号：US06255730B1
公开(公告)日：2001-07-03
申请号：US09302395
申请日：1999-04-30
申请人： Lewis R Dove , John F Casey , Anthony R Blume
发明人： Lewis R Dove , John F Casey , Anthony R Blume
IPC分类号： H01L2334
CPC分类号： H01L23/552 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16153 , H01L2924/1903 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An integrated low cost thick film RF module and method for making same. An improved thick film dielectric is employed to build three-dimensional, high frequency structures. This new dielectric can be utilized to create novel RF and microwave modules that inexpensively integrate the I/O and electrical isolation functions of traditional microcircuits without using the usual set of expensive components. In particular, the module comprises a substrate; a conductive ground plane disposed above the substrate; a first dielectric layer printed on top of the ground plane; a microstrip disposed on top of the first dielectric; a second dielectric layer printed on top of the microstrip; a top ground plane disposed on top of the second dielectric; and a shield, electrically coupled to the top ground plane.
摘要翻译：一种集成的低成本厚膜RF模块及其制造方法。采用改进的厚膜电介质构建三维高频结构。这种新的电介质可以用于创建新颖的射频和微波模块，可以廉价地集成传统微电路的I / O和电气隔离功能，而无需使用通常的昂贵组件。具体地，该模块包括基板; 设置在所述基板上方的导电接地平面; 印刷在接地平面顶部的第一电介质层; 布置在第一电介质顶部的微带; 印刷在微带的顶部上的第二电介质层; 设置在第二电介质顶部的顶部接地平面; 以及电耦合到顶部接地平面的屏蔽。

10. 发明授权

US5504986A Method of manufacturing collinear terminated transmission line structure with thick film circuitry 失效
标题翻译：使用厚膜电路制造共线端接传输线结构的方法
公开(公告)号：US5504986A
公开(公告)日：1996-04-09
申请号：US397594
申请日：1995-03-02
申请人： John F. Casey , Ronald W. Schroeder , Lewis R. Dove , Philip J. Yearsley
发明人： John F. Casey , Ronald W. Schroeder , Lewis R. Dove , Philip J. Yearsley
IPC分类号： H05K1/02 , H01C17/065 , H01C17/242 , H01L23/64 , H01L27/01 , H05K1/09 , H05K1/16 , H05K3/02 , H01C17/06
CPC分类号： H05K1/167 , H01C17/065 , H01C17/242 , H01L23/647 , H01L24/48 , H01L24/49 , H01L27/013 , H01L2224/05624 , H01L2224/05644 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/49175 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H05K1/0237 , H05K1/092 , H05K2201/0317 , H05K2201/09236 , H05K2203/049 , H05K2203/171 , H05K3/027
摘要： A collinear terminated transmission line structure and method for producing same is presented. The structure comprises a plurality of conductors electrically connected to a plurality of resistors. A predetermined spacing between each of the plurality of conductors ranges from 2 mils to 7 mils. Greater spacings are easily accomplished with the present method. The method comprises the steps of screen-printing a resistor swath onto a substrate, the swath being adjacent to one end of the plurality of conductors. After the substrate is dipped into a solution, the resistor swath is laser trimmed to form the plurality of resistors. The substrate is then rinsed with warm water to remove the solution. The solution can be a poly-vinyl alcohol and isopropyl alcohol mixture.
摘要翻译：提出了共线终端传输线结构及其制造方法。该结构包括电连接到多个电阻器的多个导体。多个导体中的每一个之间的预定间隔范围为2密耳至7密耳。使用本方法可以容易地实现更大的间隔。该方法包括以下步骤：将电阻丝网丝网印刷到基底上，该条带与多个导体的一端相邻。在将基板浸入溶液中之后，电阻器条被激光修整以形成多个电阻器。然后用温水冲洗底物以除去溶液。该溶液可以是聚乙烯醇和异丙醇混合物。

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