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1. 发明授权

US06777630B1 Liquid metal micro switches using as channels and heater cavities matching patterned thick film dielectric layers on opposing thin ceramic plates 失效
标题翻译：液态金属微动开关，用作通道和加热器腔体，在相对的薄陶瓷板上匹配图案化的厚膜电介质层
公开(公告)号：US06777630B1
公开(公告)日：2004-08-17
申请号：US10426449
申请日：2003-04-30
申请人： Lewis R Dove , Paul Thomas Carson , John F Casey , Marvin Glenn Wong
发明人： Lewis R Dove , Paul Thomas Carson , John F Casey , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H2029/008 , H01H2061/006
摘要： An efficient way to fabricate the channels and cavities in a LIMMS device is to form them as matching upper and lower portions each created as a patterned layer of thick film dielectric material deposited on a respective upper or lower substrate. The two portions are adhered together by a patterned layer of adhesive, and hermetically sealed around an outer perimeter. The heater resistors are mounted atop the lower layer, thus suspending them away from that substrate and exposing more of their surface area. Vias can be used to route the conductors for the heaters and the switched signal contacts through the lower substrate to cooperate with surface mount techniques using solder balls on an array of contact pads. These vias can be made hermetic by their placement within the patterned layers of dielectric material and by covering their exposed ends with pads of hermetic metal. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heracus and the 4141A/D thick film compositions from DuPont.
摘要翻译：在LIMMS装置中制造通道和空腔的有效方法是将它们形成为匹配上部和下部，每个上部和下部被形成为沉积在相应的上部或下部基底上的厚膜介电材料的图案化层。两个部分通过图案化的粘合剂层粘合在一起，并围绕外周密封。加热电阻器安装在下层的顶部，从而将它们悬挂在远离基板并暴露出更多的表面积。通孔可用于将加热器的导体和切换的信号触点通过下基板布线，以使用在接触焊盘阵列上的焊球的表面贴装技术配合。这些通孔可以通过它们放置在图案化的电介质材料层内并通过用气密金属垫覆盖其暴露的末端而形成为气密的。可以作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。

2. 发明授权

US06689976B1 Electrically isolated liquid metal micro-switches for integrally shielded microcircuits 失效
公开(公告)号：US06689976B1
公开(公告)日：2004-02-10
申请号：US10266872
申请日：2002-10-08
申请人： Lewis R Dove , John F Casey , Marvin Glenn Wong
发明人： Lewis R Dove , John F Casey , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H61/00 , H01H2029/008 , H01H2061/006
摘要： Liquid metal micro-switches. Liquid metal micro-switches and techniques for fabricating them in integrally shielded microcircuits are disclosed. The liquid metal micro-switches can be integrated directly into the construction of shielded thick film microwave modules. This integration is useful in applications requiring high frequency switching with high levels of electrical isolation.

3. 发明授权

US06750413B1 Liquid metal micro switches using patterned thick film dielectric as channels and a thin ceramic or glass cover plate 失效
标题翻译：使用图案化厚膜电介质作为通道的液态金属微动开关和薄陶瓷或玻璃盖板
公开(公告)号：US06750413B1
公开(公告)日：2004-06-15
申请号：US10423316
申请日：2003-04-25
申请人： Lewis R Dove , Marvin Glenn Wong
发明人： Lewis R Dove , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H61/02 , H01H2029/008 , H01H2061/006
摘要： Channels and cavities in a LIMMS device are formed from a layer of thick film dielectric material deposited on a substrate, which layer is then covered with a thin cover plate of ceramic or perhaps glass. The layer of dielectric material may be patterned using established thick film techniques, and good dimensional control can be achieved. The dielectric layer is itself its own hermetic seal against the substrate, and readily lends itself to the formation of the additional hermetic seal needed between itself and the cover plate. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141A/D thick film compositions from DuPont.
摘要翻译： LIMMS装置中的通道和空腔由沉积在基底上的厚膜介电材料层形成，然后该层被陶瓷或可能的玻璃的薄盖板覆盖。可以使用已建立的厚膜技术对电介质材料层进行图案化，并且可以实现良好的尺寸控制。电介质层本身就是其自身对衬底的气密密封，并且容易使其自身与形成其本身与盖板之间所需的另外的气密密封。可以作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。

4. 发明授权

US06781075B2 Electrically isolated liquid metal micro-switches for integrally shielded microcircuits 失效
标题翻译：用于整体屏蔽微电路的电隔离液态金属微动开关
公开(公告)号：US06781075B2
公开(公告)日：2004-08-24
申请号：US10639539
申请日：2003-08-12
申请人： Lewis R Dove , John F Casey , Marvin Glenn Wong
发明人： Lewis R Dove , John F Casey , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H61/00 , H01H2029/008 , H01H2061/006
摘要： Liquid metal micro-switches. Liquid metal micro-switches and techniques for fabricating them in integrally shielded microcircuits are disclosed. The liquid metal micro-switches can be integrated directly into the construction of shielded thick film microwave modules. This integration is useful in applications requiring high frequency switching with high levels of electrical isolation.
摘要翻译：液态金属微动开关。公开了用于在整体屏蔽的微电路中制造它们的液态金属微动开关和技术。液态金属微动开关可以直接集成到屏蔽厚膜微波模块的结构中。该集成在需要高电平隔离的高频开关的应用中非常有用。

5. 发明授权

US06457979B1 Shielded attachment of coaxial RF connector to thick film integrally shielded transmission line on a substrate 失效
标题翻译：将同轴射频连接器屏蔽连接到厚膜上，整体屏蔽了基片上的传输线
公开(公告)号：US06457979B1
公开(公告)日：2002-10-01
申请号：US10016285
申请日：2001-10-29
申请人： Lewis R Dove , Marvin G Wong , John F Casey , Wesley C Whiteley
发明人： Lewis R Dove , Marvin G Wong , John F Casey , Wesley C Whiteley
IPC分类号： H01R1200
CPC分类号： H01R9/0515 , H01R4/04 , H05K1/0219 , H05K1/117
摘要： A solution to the problem of connecting a merchant straight through coaxial RF connector to an quasi-coaxial transmission line formed on the substrate of a hybrid is to, if necessary, gradually increase the height of the center conductor of the quasi-coaxial transmission line by increasing the thickness of underlying deposited dielectric until the center conductor of the transmission line matches the position of the center conductor of the connector, which two may then be joined with solder or conductive adhesive. One style of coaxial RF connector of interest has four prongs disposed in a rectangle around the center conductor on the permanent and non-threaded side. Two of the prongs define a long side of a rectangle and may be soldered or otherwise attached to the substrate with conductive adhesive, and the two prongs that define the long side closest to the center conductor can support a small cover that physically bridges and electrically shields the gap between the connector and the end of the quasi-coaxial transmission line. The cover provides complete shielding and assists in minimizing the discontinuity in characteristic impedance caused by the transition between the connector and the quasi-coaxial transmission line.
摘要翻译：通过同轴RF连接器将商人连接到形成在混合物的基板上的准同轴传输线的问题的解决方案是，如果需要，通过以下方式逐渐增加准同轴传输线的中心导体的高度增加底层沉积电介质的厚度，直到传输线的中心导体与连接器的中心导体的位置相匹配，然后将两个导体与焊料或导电粘合剂相连接。感兴趣的同轴RF连接器的一种类型的四个插脚设置在永久和非螺纹侧上的中心导体周围的矩形中。两个尖头限定长方形的长边，并且可以用导电粘合剂焊接或以其他方式附接到基板，并且限定最接近中心导体的长边的两个插脚可以支撑物理桥接和电屏蔽的小盖子连接器与准同轴传输线端部之间的间隙。该盖提供完整的屏蔽，有助于最小化由连接器和准同轴传输线之间的过渡引起的特性阻抗的不连续性。

6. 发明授权

US06388206B2 Microcircuit shielded, controlled impedance “Gatling gun”via 失效
标题翻译：微电路屏蔽，控制阻抗“加特林枪”通过
公开(公告)号：US06388206B2
公开(公告)日：2002-05-14
申请号：US09182287
申请日：1998-10-29
申请人： Lewis R Dove , John F. Casey , Ron Barnett
发明人： Lewis R Dove , John F. Casey , Ron Barnett
IPC分类号： H01R1204
CPC分类号： H05K1/0222 , H01L23/66 , H01L24/48 , H01L2223/6616 , H01L2223/6622 , H01L2224/05599 , H01L2224/48091 , H01L2224/85399 , H01L2924/00014 , H01L2924/01039 , H01L2924/01068 , H01L2924/01078 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H05K3/42 , H05K2201/09618 , H05K2201/09809 , H05K2203/049 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/45099
摘要： A “Gatling gun” via to interconnect circuitry from a first side of a substrate or printed circuit board, to a second side of the substrate or board. The present via structure comprises a center conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the center conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. In one embodiment, the conductor via is electrically connected to a conductive pattern on the substrate by a wire bond.
摘要翻译： “加特林枪”通过将电路从基板或印刷电路板的第一侧连接到基板或板的第二侧。本通孔结构包括由多个接地通孔围绕的中心导体通孔。多个接地通孔屏蔽中心导体通孔，从而为导体通孔与电路的其余部分提供电隔离。在一个实施例中，导体通孔通过引线接合电连接到衬底上的导电图案。

7. 发明授权

US06534844B1 Integrated decoupling networks fabricated on a substrate having shielded quasi-coaxial conductors 失效
标题翻译：在具有屏蔽准同轴导体的基板上制造的集成去耦网络
公开(公告)号：US06534844B1
公开(公告)日：2003-03-18
申请号：US10021380
申请日：2001-10-30
申请人： Lewis R Dove , John F Casey , Anthony R Blume
发明人： Lewis R Dove , John F Casey , Anthony R Blume
IPC分类号： H01L2900
CPC分类号： H05K1/162 , H01L23/66 , H01L24/48 , H01L2223/6622 , H01L2223/6627 , H01L2224/05599 , H01L2224/48091 , H01L2224/484 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01058 , H01L2924/01068 , H01L2924/01072 , H01L2924/01079 , H01L2924/1903 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0221 , H05K1/0306 , H05K1/167 , H05K2201/09672 , H05K2201/09809 , H05K2201/09981 , H01L2224/45099
摘要： A hybrid circuit having a quasi-coaxial fully shielded conductor, and incorporating a ground plane on the component side of a substrate, can bypass and/or filter a signal using integrated thick film components and without through holes or vias. A thin pad of suitable dielectric material may be printed onto the ground plane and then have a layer of metal deposited on its top surface, forming a bypass capacitor. The bypass capacitor can be located very near where it is needed, and only a very short conductor is required to connect the metallic top of the bypass capacitor to the location to be bypassed. The short connecting conductor does not go from one side of the substrate to the other, and the thickness and low dielectric constant of the substrate do not compromise the value of the bypass capacitor. Thick film resistors can be included to form filters, and surface mount resistors and capacitors can be used also.
摘要翻译：具有准同轴全屏蔽导体并且在基板的部件侧上并入接地平面的混合电路可以使用集成的厚膜部件并且没有通孔或通孔来旁路和/或滤波信号。可以将合适介电材料的薄垫片印刷到接地平面上，然后在其顶表面上沉积一层金属，形成旁路电容器。旁路电容器可以非常靠近需要的位置，并且只需要非常短的导体将旁路电容器的金属顶部连接到要旁路的位置。短连接导体不从衬底的一侧到另一侧，并且衬底的厚度和低介电常数不会损害旁路电容器的值。可以包括厚膜电阻器以形成滤波器，并且还可以使用表面贴装电阻器和电容器。

8. 发明授权

US06187372B1 Method for producing large area thick film resistors with uniform thickness 失效
标题翻译：生产厚度均匀的大面积厚膜电阻的方法
公开(公告)号：US06187372B1
公开(公告)日：2001-02-13
申请号：US09301898
申请日：1999-04-29
申请人： Rosemary O Johnson , John F Casey , Lewis R Dove
发明人： Rosemary O Johnson , John F Casey , Lewis R Dove
IPC分类号： B05D512
CPC分类号： H01C17/065 , H05K1/167 , H05K3/1233
摘要： A method for creating large area, thick film resistors with improved predictability and uniformity. “Tent poles” are employed during the printing of the large area resistors to prop up the screen mesh to ensure the resultant resistor does not have a scooped out center portion. The tent poles can be made from gold pads, resistor spots or emulsion spots.
摘要翻译：一种创建具有改进的可预测性和均匀性的大面积厚膜电阻器的方法。在打印大面积电阻器期间采用“帐篷杆”来支撑筛网，以确保所得到的电阻器不具有舀出的中心部分。帐篷杆可以由金垫，电阻点或乳液点制成。

9. 发明授权

US06646527B1 High frequency attenuator using liquid metal micro switches 失效
标题翻译：高频衰减器采用液态金属微动开关
公开(公告)号：US06646527B1
公开(公告)日：2003-11-11
申请号：US10136147
申请日：2002-04-30
申请人： Lewis R Dove , John R Lindsey , David J Dascher
发明人： Lewis R Dove , John R Lindsey , David J Dascher
IPC分类号： H01H2900
CPC分类号： H01P1/22 , H01H1/0036 , H01H29/28 , H01H2029/008
摘要： Resonance within an attenuator relay caused by stray coupling capacitances to, and stray reactance within the switched conductor that replaces the attenuator section, is mitigated by reducing the stray coupling capacitances to as low a value as possible, and by using a conductor that is a section of controlled impedance transmission line that matches the system into which the attenuator relay has been placed. A substrate having SPDT LIMMS switches on either side of a switched transmission line segment and its associated attenuator, all of which are fabricated on the substrate, will have significantly lower stray coupling capacitance across the open parts of the switches when the attenuator segment is in use. This will increase the frequency for the onset of the resonance driven by the RF voltage drop across the attenuator. A reduction in the amplitude of the resonance can be obtained by including on the substrate an additional pair of LIMMS damping switches at each end of the transmission line segment. These damping switches each connect a terminating resistor to the ends of the transmission line segment when the attenuator section is in use. This loads the resonator and reduces the amplitude of the resonance. Still further improvement can be obtained by locating one of the damping switches and its termination resistor near (but preferably not exactly at) the middle of the transmission line segment.
摘要翻译：由杂散耦合电容引起的衰减器继电器中的谐振和取代衰减器部分的开关导体内的杂散电抗可以通过将杂散耦合电容减小到尽可能低的值，并通过使用导体与控制阻抗传输线匹配的衰减器继电器已经放置在其中的系统。在使用衰减器段时，具有SPDT LIMMS的开关的开关部分上的开关传输线段及其相关联的衰减器的基板上的所有这些都被制造在基板上将具有明显较低的开关部分的杂散耦合电容。这将增加由衰减器上的RF电压降驱动的谐振开始的频率。可以通过在基板上在传输线段的每一端包括另外的一对LIMMS阻尼开关来获得谐振振幅的减小。当衰减器部分使用时，这些阻尼开关各自将终端电阻器连接到传输线段的端部。这样会加载谐振器并降低谐振的幅度。通过将阻尼开关及其终端电阻之一定位在传输线路段的中间附近（但优选地不在精确地）处，可以获得进一步的改进。

10. 发明授权

US06255730B1 Integrated low cost thick film RF module 失效
标题翻译：集成低成本厚膜射频模块
公开(公告)号：US06255730B1
公开(公告)日：2001-07-03
申请号：US09302395
申请日：1999-04-30
申请人： Lewis R Dove , John F Casey , Anthony R Blume
发明人： Lewis R Dove , John F Casey , Anthony R Blume
IPC分类号： H01L2334
CPC分类号： H01L23/552 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16153 , H01L2924/1903 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An integrated low cost thick film RF module and method for making same. An improved thick film dielectric is employed to build three-dimensional, high frequency structures. This new dielectric can be utilized to create novel RF and microwave modules that inexpensively integrate the I/O and electrical isolation functions of traditional microcircuits without using the usual set of expensive components. In particular, the module comprises a substrate; a conductive ground plane disposed above the substrate; a first dielectric layer printed on top of the ground plane; a microstrip disposed on top of the first dielectric; a second dielectric layer printed on top of the microstrip; a top ground plane disposed on top of the second dielectric; and a shield, electrically coupled to the top ground plane.
摘要翻译：一种集成的低成本厚膜RF模块及其制造方法。采用改进的厚膜电介质构建三维高频结构。这种新的电介质可以用于创建新颖的射频和微波模块，可以廉价地集成传统微电路的I / O和电气隔离功能，而无需使用通常的昂贵组件。具体地，该模块包括基板; 设置在所述基板上方的导电接地平面; 印刷在接地平面顶部的第一电介质层; 布置在第一电介质顶部的微带; 印刷在微带的顶部上的第二电介质层; 设置在第二电介质顶部的顶部接地平面; 以及电耦合到顶部接地平面的屏蔽。

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