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1. 发明授权

US07563068B2 Low cost high throughput processing platform 有权
标题翻译：低成本高吞吐量处理平台
公开(公告)号：US07563068B2
公开(公告)日：2009-07-21
申请号：US11622361
申请日：2007-01-11
申请人： Leszek Niewmierzycki , David Barker , Daniel J. Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Daniel J. Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： B65H1/00
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.
摘要翻译：作为用于处理工件的系统的一部分，与处理室装置分开的工件支撑装置至少大体上以堆叠的关系支撑至少两个工件以形成工件柱。传送装置通过同时移动两个工件至少大致沿着分别在工件柱和第一和第二过程之间的第一和第二传送路径移动工件柱和处理室装置之间的至少两个工件车站。传送装置可以同时移动未经处理和处理的工件。描述了垂直运动摆臂和同轴摆臂。一对间隔开的摆臂，工件列和加工台可以协调地限定五边形形状。还描述了同步带齿隙消除，双自由度槽阀和低点室泵送，用于去除室污染物。

2. 发明授权

US08668422B2 Low cost high throughput processing platform 有权
标题翻译：低成本高吞吐量处理平台
公开(公告)号：US08668422B2
公开(公告)日：2014-03-11
申请号：US10919582
申请日：2004-08-17
申请人： Leszek Niewmierzycki , David Barker , Daniel J. Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Daniel J. Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： H01L21/677
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.
摘要翻译：作为用于处理工件的系统的一部分，与处理室装置分离的工件支撑装置至少大体上以堆叠关系支撑至少两个工件以形成工件柱。传送装置通过同时移动两个工件至少大致沿着分别在工件柱和第一和第二过程之间的第一和第二传送路径移动工件柱和处理室装置之间的至少两个工件车站。传送装置可以同时移动未经处理和处理的工件。描述了垂直运动摆臂和同轴摆臂。一对间隔开的摆臂，工件列和加工台可以协调地限定五边形形状。还描述了同步带齿隙消除，双自由度槽阀和低点室泵送，用于去除室污染物。

3. 发明申请

US20060039781A1 Advanced low cost high throughput processing platform 有权
标题翻译：先进的低成本高吞吐量处理平台
公开(公告)号：US20060039781A1
公开(公告)日：2006-02-23
申请号：US11097412
申请日：2005-04-01
申请人： Leszek Niewmierzycki , David Barker , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： H01L21/677
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： A wafer processing system and method in which a wafer, having a diameter, is movable between a loadlock and a processing chamber. A transfer chamber is arranged for selective pressure communication with the loadlock and the processing chamber. The transfer chamber having a configuration of lateral extents such that the wafer is movable through the transfer chamber between the loadlock and processing chamber along a wafer transfer path and the configuration of lateral extents causes the wafer, having the wafer diameter and moving along the wafer transfer path, to interfere with at least one of the loadlock and the processing chamber for any position along the wafer transfer path. The wafer includes a center and the wafer transfer path cab be defined by movement of the center through the transfer chamber. Swing arms are described that can independently move by different angles in opposing directions from a home position.
摘要翻译：一种晶片处理系统和方法，其中具有直径的晶片可在负载锁和处理室之间移动。传送室被布置成用于与装载锁和处理室的选择性压力连通。传送室具有横向范围的构造，使得晶片可沿着晶片传送路径移动通过负载锁和处理室之间的传送室，并且横向范围的配置导致具有晶片直径并沿着晶片传送移动的晶片路径，以便沿着晶片传送路径的任何位置干扰负载锁和处理室中的至少一个。晶片包括中心，并且晶片传送路径驾驶室由中心通过传送室的运动限定。描述了可以从起始位置以相反方向独立地移动不同角度的摆动臂。

4. 发明申请

US20070175864A1 Low Cost High Throughput Processing Platform 有权
标题翻译：低成本高吞吐量处理平台
公开(公告)号：US20070175864A1
公开(公告)日：2007-08-02
申请号：US11622361
申请日：2007-01-11
申请人： Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： C03C15/00 , B44C1/22 , H01L21/306
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.
摘要翻译：作为用于处理工件的系统的一部分，与处理室装置分离的工件支撑装置至少大体上以堆叠关系支撑至少两个工件以形成工件柱。传送装置通过同时移动两个工件至少大致沿着分别在工件柱和第一和第二过程之间的第一和第二传送路径移动工件柱和处理室装置之间的至少两个工件车站。传送装置可以同时移动未经处理和处理的工件。描述了垂直运动摆臂和同轴摆臂。一对间隔开的摆臂，工件列和加工台可以协调地限定五边形形状。还描述了同步带齿隙消除，双自由度槽阀和低点室泵送，用于去除室污染物。

5. 发明授权

US07658586B2 Advanced low cost high throughput processing platform 有权
标题翻译：先进的低成本高吞吐量处理平台
公开(公告)号：US07658586B2
公开(公告)日：2010-02-09
申请号：US11097412
申请日：2005-04-01
申请人： Leszek Niewmierzycki , David Barker , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： H01L21/67
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： A wafer processing system and method in which a wafer, having a diameter, is movable between a loadlock and a processing chamber. A transfer chamber is arranged for selective pressure communication with the loadlock and the processing chamber. The transfer chamber having a configuration of lateral extents such that the wafer is movable through the transfer chamber between the loadlock and processing chamber along a wafer transfer path and the configuration of lateral extents causes the wafer, having the wafer diameter and moving along the wafer transfer path, to interfere with at least one of the loadlock and the processing chamber for any position along the wafer transfer path. The wafer includes a center and the wafer transfer path cab be defined by movement of the center through the transfer chamber. Swing arms are described that can independently move by different angles in opposing directions from a home position.
摘要翻译：一种晶片处理系统和方法，其中具有直径的晶片可在负载锁和处理室之间移动。传送室被布置成用于与装载锁和处理室的选择性压力连通。传送室具有横向范围的构造，使得晶片可沿着晶片传送路径移动通过负载锁和处理室之间的传送室，并且横向范围的配置导致具有晶片直径并沿着晶片传送移动的晶片路径，以便沿着晶片传送路径的任何位置干扰负载锁和处理室中的至少一个。晶片包括中心，并且晶片传送路径驾驶室由中心通过传送室的运动限定。描述了可以从起始位置以相反方向独立地移动不同角度的摆动臂。

6. 发明申请

US20060045664A1 Low cost high throughput processing platform 有权
公开(公告)号：US20060045664A1
公开(公告)日：2006-03-02
申请号：US10919582
申请日：2004-08-17
申请人： Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： H01L21/677
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.

7. 发明授权

US06905624B2 Interferometric endpoint detection in a substrate etching process 失效
标题翻译：基板蚀刻工艺中的干涉测量端点检测
公开(公告)号：US06905624B2
公开(公告)日：2005-06-14
申请号：US10615159
申请日：2003-07-07
申请人： Coriolan I. Frum , Zhifeng Sui , Hongqing Shan
发明人： Coriolan I. Frum , Zhifeng Sui , Hongqing Shan
IPC分类号： H01L21/66 , C23F1/00 , C23F4/00 , C23F4/02 , G01N21/00 , H01J37/32 , H01L21/302 , H01L21/3065 , H01L21/461 , H01L21/465
CPC分类号： H01J37/32963 , H01J37/32935
摘要： A method of etching a substrate includes placing a substrate in a process zone. The substrate has a material with a thickness, and the material has exposed regions between features of a patterned mask. An etchant gas is introduced into the process zone. The etchant gas is energized to etch the material. An endpoint of etching the material of the substrate is determined by (i) reflecting a light beam from the substrate, the light beam having a wavelength selected to have a coherence length in the substrate of from about 1.5 to about 4 times the thickness of the material, and (ii) detecting the reflected light beam to determine an endpoint of the substrate etching process. Additionally, the wavelength of the light beam can be selected to maximize an absorption differential that is a difference between the absorption of the light beam in the patterned mask and the absorption of the light beam in the material.
摘要翻译：蚀刻衬底的方法包括将衬底放置在处理区中。衬底具有厚度的材料，并且材料在图案化掩模的特征之间具有曝光区域。将蚀刻剂气体引入过程区域。蚀刻剂气体通电以蚀刻材料。通过（i）反射来自衬底的光束来确定蚀刻衬底的材料的端点，所述光束具有被选择为具有衬底中的相干长度的波长为其厚度的约1.5至约4倍材料，和（ii）检测反射光束以确定基板蚀刻工艺的端点。此外，可以选择光束的波长以最大化作为图案化掩模中的光束的吸收与材料中光束的吸收之间的差异的吸收差异。

8. 发明授权

US06829056B1 Monitoring dimensions of features at different locations in the processing of substrates 失效
标题翻译：监测基板加工中不同位置特征的尺寸
公开(公告)号：US06829056B1
公开(公告)日：2004-12-07
申请号：US10646943
申请日：2003-08-21
申请人： Michael Barnes , John Holland , Hongqing Shan , Bryan Y. Pu , Mohit Jain , Zhifeng Sui , Michael D. Armacost , Neil E. Hanson , Diana Xiaobing Ma , Ashok K. Sinha , Dan Maydan
发明人： Michael Barnes , John Holland , Hongqing Shan , Bryan Y. Pu , Mohit Jain , Zhifeng Sui , Michael D. Armacost , Neil E. Hanson , Diana Xiaobing Ma , Ashok K. Sinha , Dan Maydan
IPC分类号： G01B1114
CPC分类号： H01L21/67253 , H01J37/32935 , H01L21/67069
摘要： A substrate processing apparatus has a chamber having a substrate support, gas distributor, gas energizer, and gas exhaust port. A process monitor is provided to monitor features in a first region of the substrate and generate a corresponding first signal, and to monitor features in a second region of the substrate and generate a second signal. A chamber controller receives and evaluates the first and second signals, and operates the chamber in relation to the signals. For example, the chamber controller can select a process recipe depending upon the signal values. The chamber controller can also set a process parameter at a first level in a first processing sector and at a second level in a second processing sector. The apparatus provides a closed control loop to independently monitor and control processing of features at different regions of the substrate.
摘要翻译：基板处理装置具有具有基板支撑件，气体分配器，气体激励器和排气口的腔室。提供过程监视器以监测衬底的第一区域中的特征并产生相应的第一信号，并且监测衬底的第二区域中的特征并产生第二信号。室控制器接收并评估第一和第二信号，并相对于信号操作室。例如，腔室控制器可以根据信号值选择工艺配方。腔室控制器还可以在第一处理扇区中将处理参数设置在第一电平处，并在第二处理扇区中将第二电平设置为第二电平。该装置提供一个闭合的控制回路以独立地监测和控制基板的不同区域处的特征的处理。

9. 发明授权

US06613689B2 Magnetically enhanced plasma oxide etch using hexafluorobutadiene 失效
公开(公告)号：US06613689B2
公开(公告)日：2003-09-02
申请号：US10144365
申请日：2002-05-13
申请人： Jingbao Liu , Takehiko Komatsu , Hongqing Shan , Keji Horioka , Bryan Y Pu
发明人： Jingbao Liu , Takehiko Komatsu , Hongqing Shan , Keji Horioka , Bryan Y Pu
IPC分类号： H01L21302
CPC分类号： H01L21/31116 , H01L21/76802
摘要： An oxide etch process practiced in a plasma etch reactor, such as a magnetically enhanced reactive ion etch (MERIE) reactor. The etching gas includes approximately equal amounts of a hydrogen-free fluorocarbon, most preferably C4F6, and oxygen and a much larger amount of argon diluent gas. The magnetic field is preferably maintained above about 50 gauss and the pressure at 40 milliTorr or above with chamber residence times of less than 70 milliseconds. A two-step process may be used for etching holes with very high aspect ratios. In the second step, the magnetic filed and the oxygen flow are reduced. Other fluorocarbons may be substituted which have F/C ratios of less than 2 and more preferably no more than 1.6 or 1.5.

10. 发明授权

US06521082B1 Magnetically enhanced plasma apparatus and method with enhanced plasma uniformity and enhanced ion energy control 失效
标题翻译：磁等离子体装置和方法，具有增强的等离子体均匀性和增强的离子能量控制
公开(公告)号：US06521082B1
公开(公告)日：2003-02-18
申请号：US10124161
申请日：2002-04-16
申请人： Michael S Barnes , Hongqing Shan
发明人： Michael S Barnes , Hongqing Shan
IPC分类号： H05H100
CPC分类号： H01J37/32623 , H01J37/3266
摘要： Within both a magnetically enhanced plasma apparatus and a magnetically enhanced plasma method there is employed: (1) a repetitive and geometrically selective pulsing of a magnetic field from a first level to a second level within a reactor chamber; and (2) a repetitive pulsing of a radio frequency power from a first level to a second level within the reactor chamber when repetitively and geometrically selectively pulsing from the first level to the second level the magnetic field within the reactor chamber. The concurrent repetitive pulsings provide a plasma within the reactor chamber with enhanced plasma uniformity and enhanced ion energy control.
摘要翻译：在磁增强等离子体装置和磁增强等离子体方法两者中，采用：（1）在反应器室内从第一级到第二级的磁场的重复和几何选择性脉冲; 以及（2）当从所述反应器室中的所述第一电平到所述第二电平将所述磁场重复地和几何地选择性地脉冲时，从所述反应器室内的第一电平到所述第二电平的射频功率的重复脉冲。同时的重复脉冲在反应器室内提供等离子体，具有增强的等离子体均匀性和增强的离子能量控制。

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