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    • 3. 发明授权
    • Method of manufacturing mask read-only memory cell
    • 制造掩模只读存储单元的方法
    • US06327174B1
    • 2001-12-04
    • US09513266
    • 2000-02-24
    • Le-Tien JungMing-Jing Ho
    • Le-Tien JungMing-Jing Ho
    • G11C1122
    • H01L27/11206
    • A method of manufacturing a ROM cell. A DRAM cell is provided. An ONO (oxide-nitride-oxide) stacked layer is used as a dielectric film of a capacitor of the DRAM cell. When a supply power is over 6 volts, the dielectric layer would be breakdown so that leakage is occurred between a lower electrode and an upper electrode of the capacitor. The DRAM cell, which can be used as a ROM cell, is thus readout as a stock at fault to stock a logic state of “1” or “0”. The stored data as “1” or “0” is depended on voltage of the upper electrode (VPL) and a voltage of the bit line (VBL). If VPL>VBL, the breakdown of the dielectric film would make the cell stock at “1”, and a normal DRAM cell is stocked at “0”, and vice versa.
    • 一种制造ROM单元的方法。 提供了DRAM单元。 使用ONO(氧化物 - 氮化物 - 氧化物)层叠层作为DRAM单元的电容器的电介质膜。 当电源功率超过6伏时,电介质层将被击穿,从而在电容器的下电极和上电极之间发生泄漏。 因此,可以用作ROM单元的DRAM单元作为库存被故障地读出以存储“1”或“0”的逻辑状态。 存储的数据为“1”或“0”取决于上电极(VPL)的电压和位线(VBL)的电压。 如果VPL> VBL,电介质膜的击穿将使电池库存为“1”,并且正常DRAM单元被存储为“0”,反之亦然。
    • 6. 发明授权
    • Integrated circuit with ESD protection circuit
    • 集成电路采用ESD保护电路
    • US07463466B2
    • 2008-12-09
    • US11163571
    • 2005-10-24
    • Kuey-Lung Kelvin HsuehMing-Jing Ho
    • Kuey-Lung Kelvin HsuehMing-Jing Ho
    • H02H9/00
    • H02H9/046
    • An integrated circuit (IC) having an electrostatic discharge (ESD) protection circuit therein is provided. The IC comprises a plurality of bonding pads, a plurality of ESD units, a first ESD bus and a second ESD bus. The first ESD bus has no direct connection with any power pad of the IC. Each ESD unit comprises a first diode, a second diode and an ESD clamping device. Due to the one-to-one correspondent of each bonding pad with an ESD unit, the present invention ensures ESD continuity through a continuous charge dissipation path no matter what kind of pin-to-pin ESD test the IC is undergoing or how many power sources the IC has. In addition, a bonding pad over active circuitry (BOAC) structure can also be deployed in the present invention to provide a better ESD protection for the whole IC chip.
    • 提供其中具有静电放电(ESD)保护电路的集成电路(IC)。 IC包括多个接合焊盘,多个ESD单元,第一ESD总线和第二ESD总线。 第一个ESD总线与IC的任何电源板都没有直接连接。 每个ESD单元包括第一二极管,第二二极管和ESD钳位装置。 由于具有ESD单元的每个接合焊盘的一对一对应物,本发明通过连续的电荷耗散路径确保ESD连续性,而不管IC正在进行什么类型的针对针脚ESD测试或多少功率 IC的来源。 此外,在本发明中还可以部署有源电路(BOAC)结构上的焊盘以为整个IC芯片提供更好的ESD保护。
    • 7. 发明授权
    • Method of analyzing DRAM redundancy repair
    • 分析DRAM冗余修复的方法
    • US06573524B2
    • 2003-06-03
    • US09948073
    • 2001-09-06
    • Ming-Jing Ho
    • Ming-Jing Ho
    • G01N2188
    • G11C29/006G11C11/401G11C29/24
    • A method of determining the correctness of a DRAM redundancy repair. The method is capable of detecting whether a redundancy repair has been properly conducted. The method includes illuminating a die on a wafer with a convergent light beam and observing the physical bit map produced after illumination on a screen. When the convergent light beam aims at a defective array, two semicircular shaped images appear on the screen. When the convergent light beam aims at a redundancy element used in a redundancy repair, a bright line appears on the screen. Through gauging the relative positions between the bright line and the pair of semicircular images, proper replacement by a redundancy element can be ascertained.
    • 确定DRAM冗余修复的正确性的方法。 该方法能够检测冗余修复是否已正确进行。 该方法包括用会聚光束在晶片上照射晶片,并观察在屏幕上照明之后产生的物理位图。 当收敛光束瞄准有缺陷的阵列时,屏幕上出现两个半圆形图像。 当收敛光束瞄准冗余修复中使用的冗余元素时,屏幕上会出现亮线。 通过测量亮线和一对半圆形图像之间的相对位置,可以确定冗余元件的适当替换。
    • 9. 发明申请
    • SIGNAL DELAY CIRCUIT AND SIGNAL DELAY METHOD
    • 信号延迟电路和信号延迟方法
    • US20130127508A1
    • 2013-05-23
    • US13480492
    • 2012-05-25
    • Shih-Lun ChenMing-Jing Ho
    • Shih-Lun ChenMing-Jing Ho
    • H03H11/26
    • H03K5/133H03K5/135H03K5/14
    • A signal delay circuit comprising: a first delay stage, for delaying a first input signal to generate a first delay signal; and a second delay stage, for cooperating with part of delay units of the first delay stage to delay the first delay signal to generate a second delay signal. The signal delay circuit selectively enables the delay stages of the first delay stage or the second delay stage, wherein the signal delay circuit mixes the first delay signal and the second delay signal to generate a first mixed signal when the first delay stage and the second delay stage are both enabled.
    • 一种信号延迟电路,包括:第一延迟级,用于延迟第一输入信号以产生第一延迟信号; 以及第二延迟级,用于与第一延迟级的延迟单元的一部分协作以延迟第一延迟信号以产生第二延迟信号。 所述信号延迟电路选择性地启动所述第一延迟级或所述第二延迟级的延迟级,其中所述信号延迟电路混合所述第一延迟信号和所述第二延迟信号以在所述第一延迟级和所述第二延迟阶段产生第一混合信号 舞台都启用了。
    • 10. 发明申请
    • INTEGRATED CIRCUIT WITH ESD PROTECTION CIRCUIT
    • 集成电路与ESD保护电路
    • US20070091521A1
    • 2007-04-26
    • US11163571
    • 2005-10-24
    • Kuey-Lung HsuehMing-Jing Ho
    • Kuey-Lung HsuehMing-Jing Ho
    • H02H9/00
    • H02H9/046
    • An integrated circuit (IC) having an electrostatic discharge (ESD) protection circuit therein is provided. The IC comprises a plurality of bonding pads, a plurality of ESD units, a first ESD bus and a second ESD bus. The first ESD bus has no direct connection with any power pad of the IC. Each ESD unit comprises a first diode, a second diode and an ESD clamping device. Due to the one-to-one correspondent of each bonding pad with an ESD unit, the present invention ensures ESD continuity through a continuous charge dissipation path no matter what kind of pin-to-pin ESD test the IC is undergoing or how many power sources the IC has. In addition, a bonding pad over active circuitry (BOAC) structure can also be deployed in the present invention to provide a better ESD protection for the whole IC chip.
    • 提供其中具有静电放电(ESD)保护电路的集成电路(IC)。 IC包括多个接合焊盘,多个ESD单元,第一ESD总线和第二ESD总线。 第一个ESD总线与IC的任何电源板都没有直接连接。 每个ESD单元包括第一二极管,第二二极管和ESD钳位装置。 由于具有ESD单元的每个接合焊盘的一对一对应物,本发明通过连续的电荷耗散路径确保ESD连续性,而不管IC正在进行什么类型的针对针脚ESD测试或多少功率 IC的来源。 此外,在本发明中还可以部署有源电路(BOAC)结构上的焊盘以为整个IC芯片提供更好的ESD保护。