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1. 发明授权

US09905402B2 Plasma processing chamber with a grounded electrode assembly 有权
公开(公告)号：US09905402B2
公开(公告)日：2018-02-27
申请号：US14807883
申请日：2015-07-24
申请人： Lam Research Corporation
发明人： Arnold Kholodenko , Anwar Husain
IPC分类号： C23C16/00 , H01J37/32 , H01L21/67
CPC分类号： H01J37/32532 , H01J37/32055 , H01J37/32082 , H01J37/32091 , H01J37/32174 , H01J37/32458 , H01J37/32559 , H01J37/32577 , H01J37/32651 , H01J37/32724 , H01L21/67069
摘要： An optimized plasma processing chamber configured to provide a current path is provided. The optimized plasma processing chamber includes at least an upper electrode, a powered lower electrode, a heating plate, a cooling plate, a plasma chamber lid, and clamp ring. Both the heating plate and the cooling plate are disposed above the upper electrode whereas the heating plate is configured to heat the upper electrode while the cooling plate is configured to cool the upper electrode. The clamp ring is configured to secure the upper electrode to a plasma chamber lid and to provide a current path from the upper electrode to the plasma chamber lid. A pocket may be formed between the clamp ring and the upper electrode to hold at least the heater plate, wherein the pocket is configured to allow longitudinal and lateral tolerances for thermal expansion of the heater plate from repetitive thermal cycling.

2. 发明授权

US08900400B2 Proximity head having a fluid resistor 有权
标题翻译：接近头具有流体电阻
公开(公告)号：US08900400B2
公开(公告)日：2014-12-02
申请号：US13661969
申请日：2012-10-26
申请人： Lam Research Corporation
发明人： Arnold Kholodenko , Cheng-Yu (Sean) Lin , Russell Martin
IPC分类号： H01L21/67 , B08B3/00
CPC分类号： H01L21/67051 , Y10S134/902 , Y10T29/49826
摘要： A proximity head defined by a body having a length. The body includes a main bore defined therein and extending along the length. A resistor bore is defined in the body and extends along the length. The resistor bore defined below the main bore. A first plurality of bores defined between the main bore and the resistor bore and a second plurality of bores defined between the resistor bore and an exterior surface of the body. The exterior surface of the body defining a proximity surface of the proximity head.
摘要翻译：由具有长度的主体限定的邻近头。主体包括限定在其中并沿着长度延伸的主孔。电阻孔定义在主体中并沿着长度延伸。电阻孔位于主孔下方。限定在主孔和电阻器孔之间的第一多个孔和限定在电阻器孔和主体的外表面之间的第二多个孔。主体的外表面限定了邻近头部的接近表面。

3. 发明申请

US20140251382A1 Methods for Confinement of Foam Delivered by a Proximity Head 审中-公开
标题翻译：用接近头发的泡沫隔离方法
公开(公告)号：US20140251382A1
公开(公告)日：2014-09-11
申请号：US14285603
申请日：2014-05-22
申请人： Lam Research Corporation
发明人： Arnold Kholodenko , Cheng-Yu Lin , Leon Ginzburg , Mark Mandelboym , Greg Tomasch , Anwar Husain
IPC分类号： H01L21/67
CPC分类号： H01L21/6704 , B08B3/003 , C11D11/0047 , C11D11/0058 , H01L21/67051 , H01L21/67057 , H01L21/6719 , H01L21/6776
摘要： A method suctions liquid from an upper surface of a substrate as the substrate is transported by a carrier under a head in a chamber. This operation is performed by the first section of the head. The method causes a first film of cleaning foam to flow onto the upper surface of the substrate as the substrate proceeds under the head. This operation is performed by a second section which is contiguous to the first section in the head. The method causes a second film of rinsing fluid to flow onto the upper surface of the substrate as the substrate is carried under the head. This rinsing operation is performed by a third section which is contiguous to the second section in the head and which is defined partially around the second section and up to the first section.
摘要翻译：一种方法是从衬底的上表面吸取液体，因为衬底通过载体在腔室中的头部下运送。该操作由头部的第一部分执行。当衬底在头部下进行时，该方法使清洁泡沫的第一膜流到衬底的上表面。该操作由与头部中的第一部分邻接的第二部分执行。该方法使得当基底被载置在头部下方时，冲洗流体的第二膜流到基底的上表面。这种冲洗操作由与头部中的第二部分邻接并且部分地围绕第二部分限定直到第一部分的第三部分执行。

4. 发明申请

US20140041581A1 Single Substrate Processing Head For Particle Removal Using Low Viscosity Fluid 审中-公开
标题翻译：单基板加工头使用低粘度流体去除颗粒
公开(公告)号：US20140041581A1
公开(公告)日：2014-02-13
申请号：US14052194
申请日：2013-10-11
申请人： Lam Research Corporation
发明人： Arnold Kholodenko , Cheng-yu Lin , Leon Ginzburg , Mark Mandelboym , Gregory A. Tomasch , Anwar Hussain
IPC分类号： H01L21/67
CPC分类号： H01L21/67023 , H01L21/67051 , H01L21/67173 , H01L21/67748 , Y10T137/85938
摘要： A head for dispensing a thin film of a fluid over a substrate is disclosed. The head includes a body assembly that extends between a first and a second end that is at least a width of the substrate. The body includes a main bore that is defined between the first and the second ends, the main bore connected to an upper side of a reservoir through a plurality of feeds that are defined between the main bore and the reservoir. The body also includes a plurality of outlets connected to a lower side of the reservoir and extends to an outlet slot. The plurality of feeds has a larger cross-sectional area than the plurality of outlets and the plurality of feeds are fewer than the plurality of outlets. The fluid is configured to flow through the main bore, through the plurality of feeds along the bore and fill the reservoir up to at least the threshold level before fluid is evenly output as a film out of the outlet slot onto the substrate.
摘要翻译：公开了一种用于在衬底上分配流体薄膜的头部。头部包括主体组件，其在至少基板的宽度的第一端和第二端之间延伸。主体包括限定在第一和第二端之间的主孔，主孔通过限定在主孔和储存器之间的多个进料连接到储存器的上侧。主体还包括连接到储存器的下侧并延伸到出口狭槽的多个出口。多个进料具有比多个出口更大的横截面面积，并且多个进料比多个出口少。流体构造成流过主孔，通过沿着孔的多个进料，并且将流体均匀地输出为出口狭缝之前的流体均匀地输出到基底上之前，将储存器填充到至少阈值水平。

5. 发明申请

US20150325416A1 Plasma Processing Chamber With a Grounded Electrode Assembly 审中-公开
标题翻译：具有接地电极组件的等离子体处理室
公开(公告)号：US20150325416A1
公开(公告)日：2015-11-12
申请号：US14807883
申请日：2015-07-24
申请人： Lam Research Corporation
发明人： Arnold Kholodenko , Anwar Husain
IPC分类号： H01J37/32
CPC分类号： H01J37/32532 , H01J37/32055 , H01J37/32082 , H01J37/32091 , H01J37/32174 , H01J37/32458 , H01J37/32559 , H01J37/32577 , H01J37/32651 , H01J37/32724 , H01L21/67069
摘要： An optimized plasma processing chamber configured to provide a current path is provided. The optimized plasma processing chamber includes at least an upper electrode, a powered lower electrode, a heating plate, a cooling plate, a plasma chamber lid, and clamp ring. Both the heating plate and the cooling plate are disposed above the upper electrode whereas the heating plate is configured to heat the upper electrode while the cooling plate is configured to cool the upper electrode. The clamp ring is configured to secure the upper electrode to a plasma chamber lid and to provide a current path from the upper electrode to the plasma chamber lid. A pocket may be formed between the clamp ring and the upper electrode to hold at least the heater plate, wherein the pocket is configured to allow longitudinal and lateral tolerances for thermal expansion of the heater plate from repetitive thermal cycling.
摘要翻译：提供了一种被配置为提供电流路径的优化等离子体处理室。优化的等离子体处理室至少包括上电极，动力下电极，加热板，冷却板，等离子体室盖和夹环。加热板和冷却板都设置在上电极的上方，而加热板构造成加热上电极，同时冷却板构造为冷却上电极。夹紧环被构造成将上部电极固定到等离子体室盖并且提供从上部电极到等离子体室盖的电流路径。可以在夹紧环和上部电极之间形成一个口袋，以至少保持加热板，其中该口袋构造成允许加热器板的热膨胀的重复热循环的纵向和横向公差。

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