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1. 发明申请

US20140232427A1 FINE PITCH MICROELECTRONIC CONTACT ARRAY AND METHOD OF MAKING SAME 有权
标题翻译：精细微电子接触阵列及其制造方法
公开(公告)号：US20140232427A1
公开(公告)日：2014-08-21
申请号：US13511137
申请日：2011-11-09
申请人： Laksmi Namburi , Matt Losey , Florent Cros
发明人： Laksmi Namburi , Matt Losey , Florent Cros
IPC分类号： G01R1/067 , H05K13/00 , G01R1/073
CPC分类号： G01R1/06794 , G01R1/0491 , G01R1/06716 , G01R1/06755 , G01R1/07314 , G01R1/07357 , G01R3/00 , G01R31/2889 , H01L2224/13191 , H01L2924/1461 , H05K13/00 , Y10T29/49155 , H01L2924/00
摘要： Provided are microfabricated probe elements, including elastomer elements, and methods of making the same, that can be readily used with fine pitch microelectronic arrays, for instance by providing sufficient compliance in a small package, while minimizing deflection forces, and while precisely maintaining the planarity and positioning of the contact tips across vast grid arrays. Elastomer elements may be generated using photolithography, either directly or through a sacrificial lost-mold process. Elastomer probe elements are provided with rigid tip structures microfabricated thereon to improve contact pressure. A novel space transformation probe card assembly is also provided.
摘要翻译：提供了微制造的探针元件，包括弹性体元件及其制造方法，其可以容易地与细间距微电子阵列一起使用，例如通过在小封装中提供足够的柔量，同时最小化偏转力，同时精确地保持平面度并将接触尖端定位在广泛的网格阵列上。弹性体元件可以使用光刻技术直接地或通过牺牲损失模具工艺来产生。弹性体探针元件设置有微加工在其上的刚性尖端结构以改善接触压力。还提供了一种新颖的空间转换探针卡组件。

2. 发明授权

US08917106B2 Fine pitch microelectronic contact array and method of making same 有权
标题翻译：细间距微电子接触阵列及其制造方法
公开(公告)号：US08917106B2
公开(公告)日：2014-12-23
申请号：US13511137
申请日：2011-11-09
申请人： Laksmi Namburi , Matt Losey , Florent Cros
发明人： Laksmi Namburi , Matt Losey , Florent Cros
IPC分类号： G01R1/067 , G01R3/00 , G01R1/073 , H05K13/00
CPC分类号： G01R1/06794 , G01R1/0491 , G01R1/06716 , G01R1/06755 , G01R1/07314 , G01R1/07357 , G01R3/00 , G01R31/2889 , H01L2224/13191 , H01L2924/1461 , H05K13/00 , Y10T29/49155 , H01L2924/00
摘要： Provided are microfabricated probe elements, including elastomer elements, and methods of making the same, that can be readily used with fine pitch microelectronic arrays, for instance by providing sufficient compliance in a small package, while minimizing deflection forces, and while precisely maintaining the planarity and positioning of the contact tips across vast grid arrays. Elastomer elements may be generated using photolithography, either directly or through a sacrificial lost-mold process. Elastomer probe elements are provided with rigid tip structures microfabricated thereon to improve contact pressure. A novel space transformation probe card assembly is also provided.
摘要翻译：提供了微制造的探针元件，包括弹性体元件及其制造方法，其可以容易地与细间距微电子阵列一起使用，例如通过在小封装中提供足够的柔量，同时最小化偏转力，同时精确地保持平面度并将接触尖端定位在广泛的网格阵列上。弹性体元件可以使用光刻技术直接地或通过牺牲损失模具工艺来产生。弹性体探针元件设置有微加工在其上的刚性尖端结构以改善接触压力。还提供了一种新颖的空间转换探针卡组件。

3. 发明授权

US08278956B2 Probecard system and method 有权
标题翻译： Probecard系统和方法
公开(公告)号：US08278956B2
公开(公告)日：2012-10-02
申请号：US12756578
申请日：2010-04-08
申请人： Matt Losey , Melvin Khoo , Yohannes Desta , Chang Huang
发明人： Matt Losey , Melvin Khoo , Yohannes Desta , Chang Huang
IPC分类号： G01R31/00
CPC分类号： G01R31/2889 , G01R1/06744
摘要： A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices. The adjustment mechanisms allow for quick, sensitive adjustment of the positions of microelectronic contactors relative to semiconductor devices to be tested.
摘要翻译：微电子接触器组件可以包括具有微电子接触器的探针头，用于接触半导体器件的端子以测试半导体器件。加强件组件可以为微电子接触器提供机械支撑并将探针卡组件连接到探测机。加强件组件可以包括第一和第二加强件本体，其在其中心部分处与诸如三个差速螺旋机构的调节机构连接在一起。探针头可以在其中心部分外部的位置处附接到第一加强体，而探针机可以在其中心部分外部的位置处附接到第二加强体。第一和第二加强体可具有不同的热膨胀系数。加强件组件允许微电子接触器组件的各种部件的差分热膨胀，同时最小化可能干扰接触半导体器件的端子的伴随的尺寸变形。调节机构允许微电子接触器相对于要测试的半导体器件的位置的快速灵敏调节。

4. 发明申请

US20110248735A1 Probecard System and Method 有权
标题翻译： Probecard系统和方法
公开(公告)号：US20110248735A1
公开(公告)日：2011-10-13
申请号：US12756578
申请日：2010-04-08
申请人： Matt Losey , Melvin Khoo , Yohannes Desta , Chang Huang
发明人： Matt Losey , Melvin Khoo , Yohannes Desta , Chang Huang
IPC分类号： G01R31/02 , G01R31/26 , G01R31/20
CPC分类号： G01R31/2889 , G01R1/06744
摘要： A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices. The adjustment mechanisms allow for quick, sensitive adjustment of the positions of microelectronic contactors relative to semiconductor devices to be tested.
摘要翻译：微电子接触器组件可以包括具有微电子接触器的探针头，用于接触半导体器件的端子以测试半导体器件。加强件组件可以为微电子接触器提供机械支撑并将探针卡组件连接到探测机。加强件组件可以包括第一和第二加强件本体，其在其中心部分处与诸如三个差速螺旋机构的调节机构连接在一起。探针头可以在其中心部分外部的位置处附接到第一加强体，而探针机可以在其中心部分外部的位置处附接到第二加强体。第一和第二加强体可具有不同的热膨胀系数。加强件组件允许微电子接触器组件的各种部件的差分热膨胀，同时最小化可能干扰接触半导体器件的端子的伴随的尺寸变形。调节机构允许微电子接触器相对于要测试的半导体器件的位置的快速灵敏调节。

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