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1. 发明申请

US20110254039A1 LIGHT EMITTING DIODE PACKAGE, LIGHTING APPARATUS HAVING THE SAME, AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE 审中-公开
标题翻译：发光二极管封装，具有该发光二极管封装的照明装置，以及制造发光二极管封装的方法
公开(公告)号：US20110254039A1
公开(公告)日：2011-10-20
申请号：US13087799
申请日：2011-04-15
申请人： Kyu Sang KIM , Jin Ha Kim , Jae Yoo Jeong , Moo Youn Park , Chung Bae Jeon
发明人： Kyu Sang KIM , Jin Ha Kim , Jae Yoo Jeong , Moo Youn Park , Chung Bae Jeon
IPC分类号： H01L33/50
CPC分类号： H01L33/50 , H01L24/97 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/56 , H01L2224/14 , H01L2224/48091 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode (LED) package, a lighting apparatus including the same, and a method for manufacturing an LED package are disclosed. The LED package includes: a package substrate; an LED chip mounted on the package substrate; and a wavelength conversion layer formed to cover at least a portion of an upper surface of the LED chip when a surface formed by the LED chip when viewed from above is defined as the upper surface of the LED chip, wherein the wavelength conversion layer is formed so as not to exceed the area of the upper surface of the LED chip and includes a flat surface parallel to the upper surface of the LED chip and curved surfaces connecting the corners of the upper surface of the LED chip.
摘要翻译：公开了一种发光二极管（LED）封装，包括该发光二极管（LED）封装的照明装置以及制造LED封装的方法。 LED封装包括：封装基板; 安装在封装基板上的LED芯片; 以及波长转换层，形成为当从上方观察由LED芯片形成的表面时，将LED芯片的上表面的至少一部分覆盖为LED芯片的上表面，形成波长转换层以便不超过LED芯片的上表面的面积，并且包括平行于LED芯片的上表面的平坦表面和连接LED芯片的上表面的拐角的曲面。

2. 发明申请

US20090087994A1 METHOD OF FORMING FINE PATTERNS AND MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME 有权
标题翻译：形成精细图案的方法和使用其制造半导体发光器件
公开(公告)号：US20090087994A1
公开(公告)日：2009-04-02
申请号：US12239122
申请日：2008-09-26
申请人： Jong Ho LEE , Moo Youn Park , Soo Ryong Hwang , Il Hyung Jung , Gwan Su Lee , Jin Ha Kim
发明人： Jong Ho LEE , Moo Youn Park , Soo Ryong Hwang , Il Hyung Jung , Gwan Su Lee , Jin Ha Kim
IPC分类号： H01L21/302
CPC分类号： H01L33/20 , H01L21/30617 , H01L21/30621 , H01L21/3083 , H01L33/22 , H01L33/382
摘要： A method of forming a fine pattern begins with providing a c-plane hexagonal semiconductor crystal. A mask having a predetermined pattern is formed on the semiconductor crystal. The semiconductor crystal is dry-etched by using the mask to form a first fine pattern on the semiconductor crystal. The semiconductor crystal including the first fine pattern is wet-etched to expand the first fine pattern in a horizontal direction to form a second fine pattern. The second fine pattern obtained in the wet-etching the semiconductor crystal has a bottom surface and a sidewall that have unique crystal planes, respectively. The present fine-pattern forming process can be advantageously applied to a semiconductor light emitting device, particularly, to a phonic crystal structure required to have fine patterns or a structure using a surface plasmon resonance principle.
摘要翻译：形成精细图案的方法开始于提供c面六边形半导体晶体。在半导体晶体上形成具有预定图案的掩模。通过使用掩模对半导体晶体进行干蚀刻以在半导体晶体上形成第一精细图案。包括第一精细图案的半导体晶体被湿蚀刻以在第一精细图案沿水平方向扩展以形成第二精细图案。在半导体晶体的湿式蚀刻中获得的第二精细图案分别具有独特的晶面的底面和侧壁。本发明的精细图案形成方法可以有利地应用于半导体发光器件，特别是应用于具有精细图案所需的语音晶体结构或使用表面等离子体共振原理的结构。

3. 发明授权

US08080480B2 Method of forming fine patterns and manufacturing semiconductor light emitting device using the same 有权
标题翻译：形成精细图案的方法和制造使用其的半导体发光器件
公开(公告)号：US08080480B2
公开(公告)日：2011-12-20
申请号：US12239122
申请日：2008-09-26
申请人： Jong Ho Lee , Moo Youn Park , Soo Ryong Hwang , Il Hyung Jung , Gwan Su Lee , Jin Ha Kim
发明人： Jong Ho Lee , Moo Youn Park , Soo Ryong Hwang , Il Hyung Jung , Gwan Su Lee , Jin Ha Kim
IPC分类号： H01L21/302
CPC分类号： H01L33/20 , H01L21/30617 , H01L21/30621 , H01L21/3083 , H01L33/22 , H01L33/382
摘要： A method of forming a fine pattern begins with providing a c-plane hexagonal semiconductor crystal. A mask having a predetermined pattern is formed on the semiconductor crystal. The semiconductor crystal is dry-etched by using the mask to form a first fine pattern on the semiconductor crystal. The semiconductor crystal including the first fine pattern is wet-etched to expand the first fine pattern in a horizontal direction to form a second fine pattern. The second fine pattern obtained in the wet-etching the semiconductor crystal has a bottom surface and a sidewall that have unique crystal planes, respectively. The present fine-pattern forming process can be advantageously applied to a semiconductor light emitting device, particularly, to a phonic crystal structure required to have fine patterns or a structure using a surface plasmon resonance principle.
摘要翻译：形成精细图案的方法开始于提供c面六边形半导体晶体。在半导体晶体上形成具有预定图案的掩模。通过使用掩模对半导体晶体进行干蚀刻以在半导体晶体上形成第一精细图案。包括第一精细图案的半导体晶体被湿蚀刻以在第一精细图案沿水平方向扩展以形成第二精细图案。在半导体晶体的湿式蚀刻中获得的第二精细图案分别具有独特的晶面的底面和侧壁。本发明的精细图案形成方法可以有利地应用于半导体发光器件，特别是应用于具有精细图案所需的语音晶体结构或使用表面等离子体共振原理的结构。

4. 发明授权

US08198609B2 Apparatus for forming nano pattern and method for forming the nano pattern using the same 有权
标题翻译：用于形成纳米图案的装置和使用其形成纳米图案的方法
公开(公告)号：US08198609B2
公开(公告)日：2012-06-12
申请号：US12219547
申请日：2008-07-23
申请人： Moo Youn Park , Jin Ha Kim , Soo Ryong Hwang , Il Hyung Jung , Jong Ho Lee
发明人： Moo Youn Park , Jin Ha Kim , Soo Ryong Hwang , Il Hyung Jung , Jong Ho Lee
IPC分类号： G21G1/00
CPC分类号： G03F7/70408 , G02B5/1857
摘要： The present invention relates to an apparatus for forming a nano pattern capable of fabricating the uniform nano pattern at a low cost including a laser for generating a beam; a beam splitter for splitting the beam from the laser into two beams with the same intensity; variable mirrors for reflecting the two beams split by the beam splitter to a substrate; beam expansion units for expanding diameters of the beams by being positioned on paths of the two beams traveling toward the substrate; and a beam blocking unit, installed on an upper part of the substrate, transmitting only a specific region expanded through the beam expansion unit and blocking regions a remaining region, and a method for forming the nano pattern using the same.
摘要翻译：本发明涉及一种用于形成能够以低成本制造均匀纳米图案的纳米图案的装置，包括用于产生光束的激光器; 用于将来自激光束的光束分成具有相同强度的两个光束的分束器; 用于将由分束器分裂的两束光反射到基板的可变镜; 光束扩展单元，用于通过定位在朝向基板行进的两个光束的路径上来扩展光束的直径; 以及安装在基板的上部的光束阻挡单元，仅透射通过光束扩展单元扩展的特定区域和阻挡区域的剩余区域，以及使用其形成纳米图案的方法。

5. 发明申请

US20070171146A1 LED driving apparatus with temperature compensation function 有权
标题翻译： LED驱动装置具有温度补偿功能
公开(公告)号：US20070171146A1
公开(公告)日：2007-07-26
申请号：US11657083
申请日：2007-01-24
申请人： Dong Woo Lee , Soo Ryong Hwang , Moo Youn Park
发明人： Dong Woo Lee , Soo Ryong Hwang , Moo Youn Park
IPC分类号： G09G3/14
CPC分类号： H05B33/0851 , G09G3/3406 , G09G2320/041
摘要： An LED driving apparatus having a temperature compensation function includes a reference voltage generator for generating a first reference voltage and a non-inversion amplification unit for performing non-inversion amplification to a difference voltage between the first reference voltage and a forward voltage with a preset gain. A driving unit adjusts a supply voltage in response to the voltage from the non-inversion amplification unit to supply the adjusted supply voltage to a light source having light emitting diodes. A forward voltage detector detects the forward voltage at an anode of the light emitting diodes of the light source to supply the forward voltage to the non-inversion amplification unit. Luminance variation can be compensated according to temperature changes by using a forward voltage of an LED light source so that the forward voltage of the LED light source can be controlled in association with a target current value of ambient temperature.
摘要翻译：具有温度补偿功能的LED驱动装置包括用于产生第一参考电压的参考电压发生器和用于对第一参考电压和正向电压之间的差电压执行非反相放大的预设增益。驱动单元响应于来自非反相放大单元的电压调节电源电压，以将经调整的电源电压提供给具有发光二极管的光源。正向电压检测器检测光源的发光二极管的阳极处的正向电压，以向非反相放大单元提供正向电压。可以通过使用LED光源的正向电压根据温度变化来补偿亮度变化，使得可以与目标电流值环境温度相关联地控制LED光源的正向电压。

6. 发明授权

US08882319B2 Light emitting device assembly and headlamp including the same 有权
公开(公告)号：US08882319B2
公开(公告)日：2014-11-11
申请号：US13475486
申请日：2012-05-18
申请人： Hee Dong Kim , Moo Youn Park , Soo Hwan Lee , Hee Seok Park
发明人： Hee Dong Kim , Moo Youn Park , Soo Hwan Lee , Hee Seok Park
IPC分类号： F21V13/04 , H01L33/60 , F21S8/10 , H01L33/50 , H01L33/46 , H01L33/44
CPC分类号： F21S48/1388 , F21S41/143 , F21S41/16 , F21S41/255 , F21S41/32 , F21S41/323 , F21S41/37 , H01L33/44 , H01L33/46 , H01L33/50 , H01L33/501 , H01L33/507 , H01L33/60 , H01L2933/0091
摘要： An LED assembly according to an embodiment of the present invention may improve dark regions generated between LED chips by employing a first reflective layer between the LED chips. By employing a transparent optical layer or an optical layer including a scattering particle between an LED chip and a phosphor layer, direct contact between the LED chip and the phosphor layer may be avoided, thereby preventing a low light extraction efficiency. Further, by employing a second reflection layer on side surfaces of an LED chip, an optical layer, and a phosphor layer, a relatively high contrast may be obtained. An LED assembly may enhance contrast through a reflective layer while increasing light extraction efficiency by including a scattering particle in a phosphor layer.

7. 发明授权

US07683864B2 LED driving apparatus with temperature compensation function 有权
标题翻译： LED驱动装置具有温度补偿功能
公开(公告)号：US07683864B2
公开(公告)日：2010-03-23
申请号：US11657083
申请日：2007-01-24
申请人： Dong Woo Lee , Soo Ryong Hwang , Moo Youn Park
发明人： Dong Woo Lee , Soo Ryong Hwang , Moo Youn Park
IPC分类号： G09G3/32 , G09G3/36 , G09G5/00
CPC分类号： H05B33/0851 , G09G3/3406 , G09G2320/041
摘要： An LED driving apparatus having a temperature compensation function includes a reference voltage generator for generating a first reference voltage and a non-inversion amplification unit for performing non-inversion amplification to a difference voltage between the first reference voltage and a forward voltage with a preset gain. A driving unit adjusts a supply voltage in response to the voltage from the non-inversion amplification unit to supply the adjusted supply voltage to a light source having light emitting diodes. A forward voltage detector detects the forward voltage at an anode of the light emitting diodes of the light source to supply the forward voltage to the non-inversion amplification unit. Luminance variation can be compensated according to temperature changes by using a forward voltage of an LED light source so that the forward voltage of the LED light source can be controlled in association with a target current value of ambient temperature.
摘要翻译：具有温度补偿功能的LED驱动装置包括用于产生第一参考电压的参考电压发生器和用于对第一参考电压和正向电压之间的差电压执行非反相放大的预设增益。驱动单元响应于来自非反相放大单元的电压调节电源电压，以将经调整的电源电压提供给具有发光二极管的光源。正向电压检测器检测光源的发光二极管的阳极处的正向电压，以向非反相放大单元提供正向电压。可以通过使用LED光源的正向电压根据温度变化来补偿亮度变化，使得可以与目标电流值环境温度相关联地控制LED光源的正向电压。

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