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    • 2. 发明申请
    • Film forming method
    • 成膜方法
    • US20040232603A1
    • 2004-11-25
    • US10843308
    • 2004-05-12
    • Kuraray Co., Ltd.
    • Tadao YoshikawaTatsuya Sunamoto
    • B29C055/28
    • B29C55/28B29C47/0004B29C47/0026B29C47/0057B29C47/0059B29C49/0005B29C67/24B29K2067/00B29K2077/10B29K2105/0079B29K2995/0012B29K2995/0044B29K2995/0053B29K2995/0097
    • The method of manufacturing a film of thermotropic liquid crystal polymer includes extruding a thermotropic liquid crystal polymer of a kind in which any one of activation energies Ea1 and Ea2 of a melt viscosity is within the range of 30 to 90 kcal/mol, with the ratio (Ea1/Ea2) of the activation energy Ea1 relative to the activation energy Ea2 being within the range of 1 to 1.7. The activation energies Ea1 and Ea2 are measured by means of a capillary rheometer, including a nozzle of 1 mm in inner diameter and 10 mm in length disposed at an angle of introduction of 90null and a barrel of 9.55 mm in inner diameter, at respective shear rates of 243 secondsnull1 and 2432 secondsnull1 under a temperature ranging from the temperature null(Tmnull10)null C.null, which is lower by 10null C. than the melting point null(Tm)null C.null of the thermotropic liquid crystal polymer, to the temperature null(Tmnull20)null C.null, which is higher by 20null C. than the melting point null(Tm)null C.null of the thermotropic liquid crystal polymer. The thermotropic liquid crystal polymer also has a melt viscosity of not lower than 400 poises measured under predetermined conditions, and is extruded from a die that is heated to a temperature of predetermined range.
    • 制造热致液晶聚合物膜的方法包括将熔融粘度的活化能Ea1和Ea2中的任一种的热致变液晶聚合物挤出在30〜90kcal / mol的范围内, (Ea1 / Ea2)相对于活化能Ea2在1〜1.7的范围内。 活化能Ea1和Ea2通过毛细管流变仪测量,毛细管流变仪包括内径为1mm的内径为10mm的长度,以90°的引入角设置,内径为9.55mm的管,分别为 在温度[(Tm-10)℃]的温度范围内,剪切速率为243秒-1和2432秒-1,比熔点[(Tm)低10℃) 热变液晶聚合物的温度[...(Tm + 20)℃],比热致液晶聚合物的熔点[(Tm)℃]高20℃。 聚合物。 该热致液晶聚合物的熔融粘度在预定条件下测得的不低于400泊,并从加热至预定范围温度的模具中挤出。
    • 3. 发明申请
    • Method for making inflation films
    • 制作通风薄膜的方法
    • US20040094877A1
    • 2004-05-20
    • US10650847
    • 2003-08-29
    • Kuraray Co., Ltd.
    • Takahiro MiyataKatsunori HatashiTatsuya SunamotoTadao Yoshikawa
    • B29C047/00
    • B29C47/8835B29C47/0026B29C47/0057B29C47/0059B29C2035/1666B29K2023/06B29K2025/00B29K2077/00B29L2007/008
    • An inflation film is formed by extruding a raw resin in a molten state through a circular die to form a tubular film, expanding the tubular film by the pressure of a gaseous medium introduced into an inner space of the tubular film, while the tubular film is being cooled to be solidified by blowing a cooling gas to the outer surface of the tubular film, and drawing the film while being progressively flattened by guide members. During the manufacture, the temperature Tf (null C.) of the solidified tubular film at the time it contacts the guide member for the first time is so adjusted as not to be higher than Tr (5) nullnull C.null; wherein Tr (5) represents the temperature at which the thermal deformation ratio of the solidified tubular film becomes 5% when it is measured, being loaded with a stress of a value equal to the frictional force received from the guide members under the conditions of manufacture of the film.
    • 吹塑薄膜是通过圆形模头挤出熔融状态的原料树脂而形成的,以形成管状薄膜,通过引入管状薄膜的内部空间的气态介质的压力使管状薄膜膨胀,同时管状薄膜 通过向管状膜的外表面吹入冷却气体而冷却固化,并且在被引导构件逐渐变平的状态下拉伸膜。 在制造过程中,凝固的管状膜在首次与导向件接触时的温度Tf(℃)被调节为不高于Tr(5)[℃]。 其中Tr(5)表示在测量时凝固的管状膜的热变形率变为5%的温度,在制造条件下加载等于从引导构件接收的摩擦力的值的应力 的电影。
    • 4. 发明申请
    • Multi-layer circuit board and method of making the same
    • 多层电路板及其制作方法
    • US20040040651A1
    • 2004-03-04
    • US10639648
    • 2003-08-13
    • Kuraray Co., Ltd.
    • Toshinori TsugaruTatsuya SunamotoTadao Yoshikawa
    • B32B003/00B32B031/00
    • H05K3/4655H05K3/386H05K3/4069H05K3/4617H05K3/4626H05K3/4652H05K2201/0129H05K2201/0141H05K2201/0195H05K2201/09881H05K2203/1189Y10T428/24917
    • To provide a simplified method of making a multi-layer circuit board capable of observing a high density surface mounting of electronic parts, a method is provided for making a multi-layer circuit board including a first film (A) and at least two more films, second and third films (B and C), each being made of thermoplastic polymer capable of forming an optically anisotropic melt phase. The first film (A) has a low melting point (Tm1), and the second and third films (B and C) have respective melting points (Tm2B and Tm2C) higher than the melting point (Tm1) of the first film (A). And at least one of the second and the third films have a circuit pattern thereon. The first to third films (A to C) are thermo compressed together with the first film (A) interposed between the second and third films (B and C). The method includes causing at least one of the circuit patterns (D) on one of the second and third films (B and C) to contact an opposing surface of the other of the second and third films (B and C) through the first film (A) during the thermo compression bonding of the first to third films (A to C).
    • 为了提供能够观察电子部件的高密度表面安装的多层电路板的简化方法,提供了一种制造包括第一膜(A)和至少两个以上膜的多层电路板的方法 ,第二和第三膜(B和C),每个由能够形成光学各向异性熔融相的热塑性聚合物制成。 第一膜(A)具有低熔点(Tm1),第二和第三膜(B和C)具有比第一膜(A)的熔点(Tm1)高的熔点(Tm2B和Tm2C) 。 并且第二和第三薄膜中的至少一个具有其上的电路图案。 第一至第三膜(A至C)与介于第二和第三膜(B和C)之间的第一膜(A)一起被热压。 所述方法包括使所述第二和第三膜(B和C)中的一个上的电路图案(D)中的至少一个与所述第二和第三膜(B和C)中的另一个的相对表面通过所述第一膜 (A)在第一至第三膜(A至C)的热压接期间。