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1. 发明授权

US09570311B2 Modular grinding apparatuses and methods for wafer thinning 有权
标题翻译：用于晶片薄化的模块化研磨装置和方法
公开(公告)号：US09570311B2
公开(公告)日：2017-02-14
申请号：US13370946
申请日：2012-02-10
申请人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
发明人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
IPC分类号： H01L21/304 , B24B37/04 , B24B37/00
CPC分类号： H01L21/304 , B24B37/00 , B24B37/042
摘要： Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.
摘要翻译：公开了使多个半导体晶片变薄的方法及其实施方法。一组研磨模块内的研磨模块接收并研磨半导体晶片。抛光模块从研磨模块接收半导体晶片并抛光晶片。抛光模块被配置为在比研磨模块构造成磨碎相应晶片的时间少的时间内抛光半导体晶片。

2. 发明授权

US09676114B2 Wafer edge trim blade with slots 有权
公开(公告)号：US09676114B2
公开(公告)日：2017-06-13
申请号：US13408327
申请日：2012-02-29
申请人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
发明人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
IPC分类号： B26D1/143 , B28D5/02 , B24D5/02 , B24D5/12 , B23D61/02 , B28D1/04 , B26D7/18 , B28D1/12
CPC分类号： B26D7/18 , B23D61/02 , B23D61/021 , B24D5/02 , B24D5/12 , B26D1/143 , B28D1/04 , B28D1/121 , B28D5/022 , Y10T83/0448 , Y10T83/9372
摘要： A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.

3. 发明申请

US20140024170A1 Methods for Minimizing Edge Peeling in the Manufacturing of BSI Chips 有权
标题翻译：在BSI芯片制造中最小化边缘剥离的方法
公开(公告)号：US20140024170A1
公开(公告)日：2014-01-23
申请号：US13551457
申请日：2012-07-17
申请人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
发明人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
IPC分类号： H01L31/18
CPC分类号： H01L27/1464 , H01L21/02087 , H01L21/0209 , H01L27/14687
摘要： A method includes forming top metal lines over a semiconductor substrate, wherein the semiconductor substrate is a portion of a wafer having a bevel. When the top metal lines are exposed, an etchant is supplied on the bevel, wherein regions of the wafer sprayed with the etchant has an inner defining line forming a first ring having a first diameter. A trimming step is performed to trim an edge portion of the wafer, wherein an edge of a remaining portion of the wafer has a second diameter substantially equal to or smaller than the first diameter.
摘要翻译：一种方法包括在半导体衬底上形成顶部金属线，其中半导体衬底是具有斜面的晶片的一部分。当顶部金属线暴露时，在斜面上提供蚀刻剂，其中用蚀刻剂喷射的晶片的区域具有形成具有第一直径的第一环的内部限定线。进行修整步骤以修剪晶片的边缘部分，其中晶片的剩余部分的边缘具有基本上等于或小于第一直径的第二直径。

4. 发明申请

US20130023188A1 Apparatus for Wafer Grinding 有权
公开(公告)号：US20130023188A1
公开(公告)日：2013-01-24
申请号：US13188028
申请日：2011-07-21
申请人： Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang , Chun-Ting Kuo
发明人： Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang , Chun-Ting Kuo
IPC分类号： B24B1/00 , B24B7/00
CPC分类号： B24B7/228 , B24D7/14
摘要： A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.

5. 发明授权

US09120194B2 Apparatus for wafer grinding 有权
标题翻译：晶圆研磨设备
公开(公告)号：US09120194B2
公开(公告)日：2015-09-01
申请号：US13188028
申请日：2011-07-21
申请人： Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang , Chun-Ting Kuo
发明人： Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang , Chun-Ting Kuo
IPC分类号： B24B7/22 , B24D7/14
CPC分类号： B24B7/228 , B24D7/14
摘要： A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.
摘要翻译：砂轮包括具有第一附接谷物垫的外基部; 以及具有第二附着谷物垫的内框架; 以及由所述外基座和所述内框架共享的主轴，其中所述外基座和所述内框架中的至少一个可以沿着所述共享主轴轴线独立地移动; 并且其中所述外基座，所述内框架和所述共享主轴轴线都具有相同的中心。研磨系统包括上述砂轮和附接到共享主轴轴线的能够垂直移动的砂轮头，除了驱动砂轮旋转的马达之外，以及用于将晶片固定在卡盘台顶部的卡盘台; 其中所述砂轮与所述卡盘台的一部分重叠，所述卡盘台的每一个能够沿相反方向旋转。

6. 发明授权

US09064770B2 Methods for minimizing edge peeling in the manufacturing of BSI chips 有权
标题翻译： BSI芯片制造中边缘剥离最小化的方法
公开(公告)号：US09064770B2
公开(公告)日：2015-06-23
申请号：US13551457
申请日：2012-07-17
申请人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
发明人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
IPC分类号： H01L21/02 , H01L27/146
CPC分类号： H01L27/1464 , H01L21/02087 , H01L21/0209 , H01L27/14687
摘要： A method includes forming top metal lines over a semiconductor substrate, wherein the semiconductor substrate is a portion of a wafer having a bevel. When the top metal lines are exposed, an etchant is supplied on the bevel, wherein regions of the wafer sprayed with the etchant has an inner defining line forming a first ring having a first diameter. A trimming step is performed to trim an edge portion of the wafer, wherein an edge of a remaining portion of the wafer has a second diameter substantially equal to or smaller than the first diameter.
摘要翻译：一种方法包括在半导体衬底上形成顶部金属线，其中半导体衬底是具有斜面的晶片的一部分。当顶部金属线暴露时，在斜面上提供蚀刻剂，其中用蚀刻剂喷射的晶片的区域具有形成具有第一直径的第一环的内部限定线。进行修整步骤以修剪晶片的边缘部分，其中晶片的剩余部分的边缘具有基本上等于或小于第一直径的第二直径。

7. 发明授权

US08598803B2 LED driver having a pre-chargeable feedback for maintaining current and the method using the same 有权
标题翻译： LED驱动器具有用于维持电流的预充电反馈和使用其的方法
公开(公告)号：US08598803B2
公开(公告)日：2013-12-03
申请号：US12975362
申请日：2010-12-22
申请人： Chun-Ting Kuo , Chun-Fu Lin , Cheng-Han Hsieh
发明人： Chun-Ting Kuo , Chun-Fu Lin , Cheng-Han Hsieh
IPC分类号： G05F1/00
CPC分类号： H05B33/0827
摘要： A driving circuit of a light emitting diode (LED), including a driving unit, a current pre-charging unit and a feedback unit, is provided. The driving unit outputs a driving power to drive the LEDs and outputs at least one first feedback signal according to the current conducted in the LEDs. The current pre-charging unit is coupled to an output of the driving unit to provide a current path to the driving unit and generates a second feedback signal. One of the at least one first feedback signal is selected to adjust the driving power when the enable signal is at a first logic level; the second feedback signal is selected to adjust the driving power when the enable signal is at a second logic level so as to maintain a current to drive the LEDs.
摘要翻译：提供了包括驱动单元，电流预充电单元和反馈单元的发光二极管（LED）的驱动电路。驱动单元输出用于驱动LED的驱动电力，并根据LED中传导的电流输出至少一个第一反馈信号。当前的预充电单元耦合到驱动单元的输出端以提供到驱动单元的电流路径并产生第二反馈信号。当使能信号处于第一逻辑电平时，选择至少一个第一反馈信号中的一个来调节驱动功率; 选择第二反馈信号以在使能信号处于第二逻辑电平时调节驱动功率，以维持驱动LED的电流。

8. 发明授权

US09099044B2 Apparatus and method for driving light emitting diode 有权
标题翻译：用于驱动发光二极管的装置和方法
公开(公告)号：US09099044B2
公开(公告)日：2015-08-04
申请号：US12897794
申请日：2010-10-05
申请人： Chun-Ting Kuo , Chun-Fu Lin , Cheng-Han Hsieh
发明人： Chun-Ting Kuo , Chun-Fu Lin , Cheng-Han Hsieh
IPC分类号： G06F3/038 , G09G3/34
CPC分类号： G09G3/342
摘要： A driving apparatus for driving at least one first light emitting diode unit and a second light emitting diode unit includes a data transmitting unit and a driving unit. The data transmitting unit is used for receiving and storing driving data. The driving data includes first data corresponding to a first driving signal and second data corresponding to a second driving signal. The driving unit divides the first driving signal into a plurality of first sub-driving signals and the second driving signal into a plurality of second sub-driving signals, and then alternately outputs the first sub-driving signals and the second sub-driving signals to alternately drive the first light emitting diode unit and the second light emitting diode unit.
摘要翻译：用于驱动至少一个第一发光二极管单元和第二发光二极管单元的驱动装置包括数据发送单元和驱动单元。数据发送单元用于接收和存储驾驶数据。驱动数据包括对应于第一驱动信号的第一数据和对应于第二驱动信号的第二数据。驱动单元将第一驱动信号分成多个第一子驱动信号，将第二驱动信号分成多个第二子驱动信号，然后交替地将第一副驱动信号和第二副驱动信号输出到交替地驱动第一发光二极管单元和第二发光二极管单元。

9. 发明申请

US20120026019A1 DRIVING CIRCUIT OF LIGHT EMITTING DIODE, DECODING CIRCUIT AND DECODING METHOD THEREOF 审中-公开
标题翻译：发光二极管的驱动电路，解码电路及其解码方法
公开(公告)号：US20120026019A1
公开(公告)日：2012-02-02
申请号：US13103819
申请日：2011-05-09
申请人： CHUN-FU LIN , Chun-Ting Kuo , Cheng-Han Hsieh
发明人： CHUN-FU LIN , Chun-Ting Kuo , Cheng-Han Hsieh
IPC分类号： H03M7/00 , H05B37/02
CPC分类号： H05B33/0845 , H05B37/0272
摘要： A driving circuit, a decoding circuit and a decoding method thereof are provided. The decoding circuit includes an oscillator and a decoder including a frequency determining unit and a decoding unit. The frequency determining unit receives a clock signal and a data signal which is corresponding to DMX512 protocol, and samples one slot of the data signal according to the clock signal to generate a sample number corresponding to a slot period of the slot. Then, the frequency determining unit outputs a reference signal corresponding to the frequency of the clock signal according to the sample number. The decoding unit samples the data signal according to the clock signal and the reference signal to decode data carried on the data signal. The decoding circuit is able to sample the data signal correctly without disposing any external frequency adjusting element.
摘要翻译：提供驱动电路，解码电路及其解码方法。解码电路包括振荡器和包括频率确定单元和解码单元的解码器。频率确定单元接收对应于DMX512协议的时钟信号和数据信号，并根据时钟信号对数据信号的一个时隙进行采样，以产生与该时隙的时隙周期对应的采样数。然后，频率确定单元根据样本号输出与时钟信号的频率相对应的参考信号。解码单元根据时钟信号和参考信号对数据信号进行采样，以对数据信号上承载的数据进行解码。解码电路能够正确地对数据信号进行采样，而无需设置任何外部频率调节元件。

10. 发明授权

US08835559B2 Rubber-modified polystyrene resin composition for making an electroplatable article 有权
标题翻译：用于制造电镀制品的橡胶改性聚苯乙烯树脂组合物
公开(公告)号：US08835559B2
公开(公告)日：2014-09-16
申请号：US13299086
申请日：2011-11-17
申请人： Chien-Chung Wu , Chun-Ting Kuo , Wen-Yi Su , Chen-Hsiang Fang
发明人： Chien-Chung Wu , Chun-Ting Kuo , Wen-Yi Su , Chen-Hsiang Fang
IPC分类号： C08L51/04 , C08F279/02 , C25D5/54 , C08L55/02
CPC分类号： C08F279/02 , C08L51/04 , C08L55/02 , C25D5/54 , C08L25/12
摘要： A rubber-modified polystyrene resin composition is for making an electroplatable article which has a sectioned layer defining a unit area. The rubber-modified polystyrene resin composition includes a resin matrix, occlusion rubber particles dispersed in the resin matrix, and non-occlusion rubber particles dispersed in the resin matrix. A total sectional area ratio of the occlusion rubber particles to the non-occlusion rubber particles in the unit area ranges from 1.1 to 14.
摘要翻译：橡胶改性聚苯乙烯树脂组合物用于制造具有限定单位面积的分层的电镀制品。橡胶改性聚苯乙烯树脂组合物包括树脂基质，分散在树脂基质中的阻塞橡胶颗粒和分散在树脂基质中的非阻塞性橡胶颗粒。闭塞橡胶颗粒与单位面积中的非闭塞橡胶颗粒的总截面积比为1.1〜14。

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