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1. 发明授权

US09120194B2 Apparatus for wafer grinding 有权
标题翻译：晶圆研磨设备
公开(公告)号：US09120194B2
公开(公告)日：2015-09-01
申请号：US13188028
申请日：2011-07-21
申请人： Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang , Chun-Ting Kuo
发明人： Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang , Chun-Ting Kuo
IPC分类号： B24B7/22 , B24D7/14
CPC分类号： B24B7/228 , B24D7/14
摘要： A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.
摘要翻译：砂轮包括具有第一附接谷物垫的外基部; 以及具有第二附着谷物垫的内框架; 以及由所述外基座和所述内框架共享的主轴，其中所述外基座和所述内框架中的至少一个可以沿着所述共享主轴轴线独立地移动; 并且其中所述外基座，所述内框架和所述共享主轴轴线都具有相同的中心。研磨系统包括上述砂轮和附接到共享主轴轴线的能够垂直移动的砂轮头，除了驱动砂轮旋转的马达之外，以及用于将晶片固定在卡盘台顶部的卡盘台; 其中所述砂轮与所述卡盘台的一部分重叠，所述卡盘台的每一个能够沿相反方向旋转。

2. 发明授权

US09064770B2 Methods for minimizing edge peeling in the manufacturing of BSI chips 有权
标题翻译： BSI芯片制造中边缘剥离最小化的方法
公开(公告)号：US09064770B2
公开(公告)日：2015-06-23
申请号：US13551457
申请日：2012-07-17
申请人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
发明人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
IPC分类号： H01L21/02 , H01L27/146
CPC分类号： H01L27/1464 , H01L21/02087 , H01L21/0209 , H01L27/14687
摘要： A method includes forming top metal lines over a semiconductor substrate, wherein the semiconductor substrate is a portion of a wafer having a bevel. When the top metal lines are exposed, an etchant is supplied on the bevel, wherein regions of the wafer sprayed with the etchant has an inner defining line forming a first ring having a first diameter. A trimming step is performed to trim an edge portion of the wafer, wherein an edge of a remaining portion of the wafer has a second diameter substantially equal to or smaller than the first diameter.
摘要翻译：一种方法包括在半导体衬底上形成顶部金属线，其中半导体衬底是具有斜面的晶片的一部分。当顶部金属线暴露时，在斜面上提供蚀刻剂，其中用蚀刻剂喷射的晶片的区域具有形成具有第一直径的第一环的内部限定线。进行修整步骤以修剪晶片的边缘部分，其中晶片的剩余部分的边缘具有基本上等于或小于第一直径的第二直径。

3. 发明授权

US08970132B2 Lighting device controlling chip, apparatus, system and addressing method thereof 有权
标题翻译：照明装置控制芯片，装置，系统及其寻址方法
公开(公告)号：US08970132B2
公开(公告)日：2015-03-03
申请号：US13231955
申请日：2011-09-13
申请人： Chun-Fu Lin , Chun-Ting Kuo , Cheng-Han Hsieh
发明人： Chun-Fu Lin , Chun-Ting Kuo , Cheng-Han Hsieh
IPC分类号： H05B37/02
CPC分类号： H05B37/0254
摘要： A lighting device controlling chip, an apparatus, a system and an addressing method thereof are provided. The lighting device has a trigger terminal for receiving a first setting voltage, an output terminal for outputting a second setting voltage and a signal receiving interface for receiving a data packet having a plurality of serially transmitted data slots. The lighting device controlling chip may automatically set an address thereof according to a voltage level of the first setting voltage and a counting signal corresponding to the number of the received data slots.
摘要翻译：提供照明装置控制芯片，装置，系统及其寻址方法。照明装置具有用于接收第一设定电压的触发端子，用于输出第二设定电压的输出端子和用于接收具有多个串行发送的数据时隙的数据分组的信号接收接口。照明装置控制芯片可以根据第一设定电压的电压电平和对应于接收到的数据时隙的数量的计数信号来自动设置地址。

4. 发明授权

US08773414B2 Driving circuit of light emitting diode and ghost phenomenon elimination circuit thereof 有权
标题翻译：发光二极管的驱动电路及其重影现象消除电路
公开(公告)号：US08773414B2
公开(公告)日：2014-07-08
申请号：US13555046
申请日：2012-07-20
申请人： Chun-Fu Lin , Chun-Ting Kuo , Cheng-Han Hsieh
发明人： Chun-Fu Lin , Chun-Ting Kuo , Cheng-Han Hsieh
IPC分类号： G06F3/038
CPC分类号： H05B33/086 , G09G3/32 , G09G2300/06 , G09G2310/0205 , G09G2310/0275 , G09G2310/061 , G09G2320/0257
摘要： A driving circuit of a light emitting diode (LED) and a ghost phenomenon elimination circuit thereof are disclosed. The ghost phenomenon elimination circuit which includes a ghost phenomenon elimination unit and a counter unit may determine a black insertion period according to a gray scale clock signal, and output an enable signal to the ghost phenomenon elimination unit during the black insertion period. The ghost phenomenon elimination unit may pull up the voltage levels at current driving terminals of the driving circuit so as to prevent the ghost phenomenon from occurring.
摘要翻译：公开了一种发光二极管（LED）的驱动电路及其重影现象消除电路。包含重影现象消除单元和计数器单元的鬼现象消除电路可以根据灰度时钟信号确定黑插入时段，并且在黑插入时段期间向幽灵现象消除单元输出使能信号。鬼现象消除单元可以提升驱动电路的电流驱动端子处的电压电平，以防止发生重影现象。

5. 发明申请

US20130220090A1 WAFER EDGE TRIM BLADE WITH SLOTS 有权
标题翻译： WAFER EDGE TRIM刀片与SLOTS
公开(公告)号：US20130220090A1
公开(公告)日：2013-08-29
申请号：US13408327
申请日：2012-02-29
申请人： Chun-Ting KUO , Kei-Wei CHEN , Ying-Lang WANG , Kuo-Hsiu WEI
发明人： Chun-Ting KUO , Kei-Wei CHEN , Ying-Lang WANG , Kuo-Hsiu WEI
IPC分类号： B26D1/14 , B26D7/18 , B24D3/00
CPC分类号： B26D7/18 , B23D61/02 , B23D61/021 , B24D5/02 , B24D5/12 , B26D1/143 , B28D1/04 , B28D1/121 , B28D5/022 , Y10T83/0448 , Y10T83/9372
摘要： A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.
摘要翻译：晶片边缘修剪刀片包括圆形刀片本体和从圆刀片本体的外边缘向内形成的至少一个槽。所述至少一个槽被配置成使用晶片边缘修剪刀片去除在晶片边缘修整期间产生的碎屑。

6. 发明申请

US20130093358A1 DRIVING CIRCUIT OF LIGHT EMITTING DIODE AND GHOST PHENOMENON ELIMINATION CIRCUIT THEREOF 有权
标题翻译：发光二极管及其发光二极管的驱动电路
公开(公告)号：US20130093358A1
公开(公告)日：2013-04-18
申请号：US13555046
申请日：2012-07-20
申请人： CHUN-FU LIN , CHUN-TING KUO , CHENG-HAN HSIEH
发明人： CHUN-FU LIN , CHUN-TING KUO , CHENG-HAN HSIEH
IPC分类号： H05B37/02
CPC分类号： H05B33/086 , G09G3/32 , G09G2300/06 , G09G2310/0205 , G09G2310/0275 , G09G2310/061 , G09G2320/0257
摘要： A driving circuit of a light emitting diode (LED) and a ghost phenomenon elimination circuit thereof are disclosed. The ghost phenomenon elimination circuit which includes a ghost phenomenon elimination unit and a counter unit may determine a black insertion period according to a gray scale clock signal, and output an enable signal to the ghost phenomenon elimination unit during the black insertion period. The ghost phenomenon elimination unit may pull up the voltage levels at current driving terminals of the driving circuit so as to prevent the ghost phenomenon from occurring.
摘要翻译：公开了一种发光二极管（LED）的驱动电路及其重影现象消除电路。包含重影现象消除单元和计数器单元的鬼现象消除电路可以根据灰度时钟信号确定黑插入时段，并且在黑插入时段期间向幽灵现象消除单元输出使能信号。鬼现象消除单元可以提升驱动电路的电流驱动端子处的电压电平，以防止发生重影现象。

7. 发明申请

US20110156604A1 DRIVING CIRCUIT OF LIGHT EMITTING DIODE 有权
标题翻译：发光二极管的驱动电路
公开(公告)号：US20110156604A1
公开(公告)日：2011-06-30
申请号：US12975362
申请日：2010-12-22
申请人： Chun-Ting Kuo , Chun-Fu Lin , Cheng-Han Hsieh
发明人： Chun-Ting Kuo , Chun-Fu Lin , Cheng-Han Hsieh
IPC分类号： H05B37/02 , H05B41/24 , H05B37/00
CPC分类号： H05B33/0827
摘要： A driving circuit of a light emitting diode (LED) is provided, including a driving unit, a current pre-charging unit and a feedback selecting unit. The driving unit outputs a driving power to drive the LEDs and outputs at least a first feedback signal according to the current conducted by the LEDs. The current pre-charging unit is coupled to an output of the driving unit to provide a current path to the driving unit and generates a second feedback signal according to a current conducted by the current pre-charging unit. The feedback selecting unit selects and outputs one of first feedback signals or the second feedback signal according to an enable signal, and the driving unit adjusts the driving power according to an output of the feedback selecting unit so as to maintain a current driving capability of the driving circuit to provide a sufficient current to drive the LEDs.
摘要翻译：提供了一种发光二极管（LED）的驱动电路，包括驱动单元，电流预充电单元和反馈选择单元。驱动单元输出用于驱动LED的驱动电力，并且根据由LED传导的电流至少输出第一反馈信号。当前预充电单元耦合到驱动单元的输出端以提供到驱动单元的电流路径，并根据当前预充电单元传导的电流产生第二反馈信号。反馈选择单元根据使能信号选择并输出第一反馈信号或第二反馈信号中的一个，并且驱动单元根据反馈选择单元的输出来调整驱动功率，以保持驱动能力驱动电路以提供足够的电流来驱动LED。

8. 发明申请

US20090231286A1 ACTIVE TOUCH PANEL VOLTAGE COMPENSATION CIRCUIT 审中-公开
标题翻译：主动触控面板电压补偿电路
公开(公告)号：US20090231286A1
公开(公告)日：2009-09-17
申请号：US12046906
申请日：2008-03-12
申请人： Chun-Ting Kuo
发明人： Chun-Ting Kuo
IPC分类号： G06F3/041
CPC分类号： G06F3/044 , G06F3/045
摘要： An active touch panel voltage compensation circuit, which is to improve voltage distribution in the border of an electrode layer of a touch panel, comprises: a power supply unit provides an initial voltage to a plurality of voltage-applying points of the electrode layer. A differential amplifier unit sets a calibration level. The differential amplifier unit is coupled to a plurality of detection points to obtain a plurality of detected voltages, and compares the detected voltages with the calibration level to obtain a plurality of deviation values. A processing unit works out the compensation voltages for the voltage-applying points according to the deviation values, generates a plurality of gain-modulation signals according to the compensation voltages and sends the gain-modulation signals to the power supply unit. The power supply unit regulates the initial voltage to the plurality of compensation voltages so that the detected voltages can reach the calibration level.
摘要翻译：一种用于改善触摸面板的电极层边界的电压分布的有源触摸屏电压补偿电路包括：电源单元向电极层的多个施加电压点提供初始电压。差分放大器单元设置校准电平。差分放大器单元耦合到多个检测点以获得多个检测电压，并将检测到的电压与校准电平进行比较以获得多个偏差值。处理单元根据偏差值来计算施加电压的补偿电压，根据补偿电压产生多个增益调制信号，并将增益调制信号发送到电源单元。电源单元调节多个补偿电压的初始电压，使得检测到的电压可以达到校准水平。

9. 发明授权

US09570311B2 Modular grinding apparatuses and methods for wafer thinning 有权
标题翻译：用于晶片薄化的模块化研磨装置和方法
公开(公告)号：US09570311B2
公开(公告)日：2017-02-14
申请号：US13370946
申请日：2012-02-10
申请人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
发明人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
IPC分类号： H01L21/304 , B24B37/04 , B24B37/00
CPC分类号： H01L21/304 , B24B37/00 , B24B37/042
摘要： Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.
摘要翻译：公开了使多个半导体晶片变薄的方法及其实施方法。一组研磨模块内的研磨模块接收并研磨半导体晶片。抛光模块从研磨模块接收半导体晶片并抛光晶片。抛光模块被配置为在比研磨模块构造成磨碎相应晶片的时间少的时间内抛光半导体晶片。

10. 发明授权

US09099044B2 Apparatus and method for driving light emitting diode 有权
标题翻译：用于驱动发光二极管的装置和方法
公开(公告)号：US09099044B2
公开(公告)日：2015-08-04
申请号：US12897794
申请日：2010-10-05
申请人： Chun-Ting Kuo , Chun-Fu Lin , Cheng-Han Hsieh
发明人： Chun-Ting Kuo , Chun-Fu Lin , Cheng-Han Hsieh
IPC分类号： G06F3/038 , G09G3/34
CPC分类号： G09G3/342
摘要： A driving apparatus for driving at least one first light emitting diode unit and a second light emitting diode unit includes a data transmitting unit and a driving unit. The data transmitting unit is used for receiving and storing driving data. The driving data includes first data corresponding to a first driving signal and second data corresponding to a second driving signal. The driving unit divides the first driving signal into a plurality of first sub-driving signals and the second driving signal into a plurality of second sub-driving signals, and then alternately outputs the first sub-driving signals and the second sub-driving signals to alternately drive the first light emitting diode unit and the second light emitting diode unit.
摘要翻译：用于驱动至少一个第一发光二极管单元和第二发光二极管单元的驱动装置包括数据发送单元和驱动单元。数据发送单元用于接收和存储驾驶数据。驱动数据包括对应于第一驱动信号的第一数据和对应于第二驱动信号的第二数据。驱动单元将第一驱动信号分成多个第一子驱动信号，将第二驱动信号分成多个第二子驱动信号，然后交替地将第一副驱动信号和第二副驱动信号输出到交替地驱动第一发光二极管单元和第二发光二极管单元。

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