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1. 发明授权

US5266834A Semiconductor device and an electronic device with the semiconductor devices mounted thereon 失效
标题翻译：半导体器件和其上安装有半导体器件的电子器件
公开(公告)号：US5266834A
公开(公告)日：1993-11-30
申请号：US915761
申请日：1992-07-21
申请人： Kunihiko Nishi , Michio Tanimoto , Toshihiro Yasuhara , Katsuhiro Tabata , Yasuhiro Yoshikawa , Isao Akima , Souichi Kunito , Toshio Nosaka , Hideaki Nakamura
发明人： Kunihiko Nishi , Michio Tanimoto , Toshihiro Yasuhara , Katsuhiro Tabata , Yasuhiro Yoshikawa , Isao Akima , Souichi Kunito , Toshio Nosaka , Hideaki Nakamura
IPC分类号： H01L23/495 , H01L25/10 , H01L23/02
CPC分类号： H01L23/4951 , H01L23/49568 , H01L25/105 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48471 , H01L2224/73215 , H01L2225/1029 , H01L2225/1041 , H01L2225/107 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/1305 , H01L2924/1815 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511
摘要： A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.
摘要翻译：提供了用于实现更高的堆积密度和更高的存储器电路集成的封装，特别地，提供了具有堆叠的多个薄的表面贴装封装的结构。每个层叠包装包括半导体颗粒，固定在颗粒的前表面的引线，固定到其后表面的散热板和树脂模制构件。为了实现稳定的层压结构，模具构件在颗粒的前侧成形为凸形，并且在其后侧成为凹形，使得一个包装的凹部能够与凸部接合的另一个包。

2. 发明申请

US20110043375A1 AIR PRESSURE MANAGEMENT DEVICE FOR VEHICLE TIRE AND VEHICLE TIRE CAPABLE OF OUTPUTTING AIR PRESSURE INFORMATION 有权
标题翻译：用于车辆轮胎和车辆轮胎的空气压力管理装置可输出空气压力信息
公开(公告)号：US20110043375A1
公开(公告)日：2011-02-24
申请号：US12859438
申请日：2010-08-19
申请人： Masahide Tanaka , Yasuhiro Yoshikawa
发明人： Masahide Tanaka , Yasuhiro Yoshikawa
IPC分类号： H04Q9/00
CPC分类号： B60C23/041 , B60C23/0408
摘要： Vibration electric power generation is carried out by a relative parallel movement of a ferroelectric member including floating electrodes arranged in parallel and a movable member including electrets maintaining a surface electric potential of approximately 100 volts at a temperature of 100° C. and opposed electrode portions alternately arranged, the ferroelectric member and the movable member being provided in a tire.
摘要翻译：振动发电通过包括平行布置的浮动电极的铁电构件和包括在100℃的温度保持大约100伏的表面电位的驻极体的可动构件的相对平行移动进行，并且相对的电极部分交替所述铁电构件和所述可动构件设置在轮胎中。

3. 发明授权

US07551329B2 Led chip mounting structure and image reader having same 有权
标题翻译： LED芯片安装结构和图像读取器具有相同的功能
公开(公告)号：US07551329B2
公开(公告)日：2009-06-23
申请号：US10518225
申请日：2003-06-20
申请人： Yasuhiro Yoshikawa
发明人： Yasuhiro Yoshikawa
IPC分类号： H04N1/04 , H01L29/80
CPC分类号： H01L33/62 , H01L24/32 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83851 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/12041 , H01L2924/00 , H01L2924/01014 , H01L2924/3512 , H01L2224/05599
摘要： An LED chip mounting structure provided by the present invention includes a wiring board with a mounting pad an LED chip with an electrode facing the mounting pad a bump disposed between the mounting pad and the electrode to electrically connect the mounting pad to the electrode and an adhesive member for fixing the LED chip to the wiring board.
摘要翻译：由本发明提供的LED芯片安装结构包括具有安装焊盘的布线板，具有面向安装焊盘的电极的LED芯片，设置在安装焊盘和电极之间的凸块，以将安装焊盘电连接到电极和粘合剂用于将LED芯片固定到接线板的部件。

4. 发明授权

US07164592B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07164592B2
公开(公告)日：2007-01-16
申请号：US11135297
申请日：2005-05-24
申请人： Yasuhiro Yoshikawa , Motoo Suwa , Hiroaki Nambu
发明人： Yasuhiro Yoshikawa , Motoo Suwa , Hiroaki Nambu
IPC分类号： G11C5/02
CPC分类号： H01L23/49838 , H01L23/49827 , H01L2224/16225 , H01L2924/01078 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/0237 , H05K1/0298 , H05K1/112 , H05K2201/09227 , H05K2201/10674 , H01L2924/00012
摘要： A wiring board includes a plurality of wiring layers, and one surface formed with a plurality of chip connecting electrodes and another surface formed with a plurality of external connecting electrodes of a semiconductor device. The wiring board has wiring layers and vias. The plurality of chip connecting electrodes include first chip connecting electrodes, each used for a first signal whose logic value changes, and second chip connecting electrodes, each used for a second signal that changes after a change timing of the first signal. A wiring layer in which wiring routing of paths extending from the first chip connecting electrodes to their corresponding first external connecting electrodes is performed, and a wiring layer in which wiring routing of paths extending from the second chip connecting electrodes disposed adjacent to the first chip connecting electrodes to their corresponding second external connecting electrodes is performed, are made different from each other.
摘要翻译：布线板包括多个布线层，一个表面形成有多个芯片连接电极，另一个表面形成有多个半导体器件的外部连接电极。接线板具有接线层和通孔。多个芯片连接电极包括第一芯片连接电极，每个用于其逻辑值改变的第一信号，第二芯片连接电极用于在第一信号的改变定时之后改变的第二信号。执行从第一芯片连接电极延伸到其对应的第一外部连接电极的路径的布线布线的布线层，以及布线层，其中从邻近第一芯片连接的第二芯片连接电极延伸的路径布线执行到它们对应的第二外部连接电极的电极彼此不同。

5. 发明授权

US5075453A Process for producing aryloxy-substituted phosphazene derivatives 失效
标题翻译：制备芳氧基取代的磷腈衍生物的方法
公开(公告)号：US5075453A
公开(公告)日：1991-12-24
申请号：US401570
申请日：1989-08-29
申请人： Shinichiro Ueyama , Kazuhiko Fujikawa , Yasuhiro Yoshikawa , Tetsuhiko Okamoto , Masayuki Furukawa , Tadaichi Nishikawa
发明人： Shinichiro Ueyama , Kazuhiko Fujikawa , Yasuhiro Yoshikawa , Tetsuhiko Okamoto , Masayuki Furukawa , Tadaichi Nishikawa
IPC分类号： C07F9/06 , C07F9/6581 , C08G79/02 , C10M105/74
CPC分类号： C07F9/65814 , C07F9/067 , C08G79/025 , C10M105/74
摘要： A process for producing an aryloxy-substituted phosphazene derivative represented by the formula(N.dbd.P).sub.n (OAr).sub.l Cl.sub.m-l R.sup.1.sub.p (III)which comprises reacting a chlorophosphazene derivative represented by the general formula(N.dbd.P).sub.n Cl.sub.m R.sup.1.sub.p (I)with, a hydroxy aryl compound represented by the general formulaHOAr (II)whereR.sup.1 represents hydroxy group, NH.sub.2 group, --OR.sup.4 group, --SR.sup.4 group or ##STR1## group, where R.sup.4, R.sup.5 and R.sup.6 represent independently an alkyl group, an alkenyl group, alkynyl group or an aryl group or one of R.sup.5 or R.sup.6 may be hydrogen or R.sup.5 and R.sup.6 may form, together with a nitrogen atom bonded thereto, a saturated or an unsaturated heterocyclic ring,n is an integer of 3 to 20,m is an integer of 1 to 2n,p is 2n-m,Ar represents substituted or unsubstituted phenyl, substituted or unsubstituted naphthyl, or substituted or unsubstituted N-maleimidophenyl,l is an integer of 1 to m,wherein the reaction is carried out under the presence of an acid acceptor and a pyridine derivative represented by the formula ##STR2## where Q.sup.1 and Q.sup.2 represent identical or different lower alkyl groups or constitute together with a nitrogen atom bonded thereto, a pyrrolidine ring, piperidine ring or morpholine ring.
摘要翻译：一种制备由式（N = P）n（OAr）1 Clm-lR1p（III）表示的芳氧基取代的磷腈衍生物的方法，其包括使由通式（N = P）nClmR1p（I）表示的氯代膦腈衍生物与通式为HOAr（II）表示的羟基芳基化合物，其中R 1表示羟基，NH 2基，-OR 4基团，-SR 4基团或基团，其中R 4，R 5和R 6独立地表示烷基，烯基，炔基或芳基，或者R 5或R 6中的一个可以是氢或R 5，R 6可以与其键合的氮原子一起形成饱和或不饱和杂环，n为3〜20的整数， m为1〜2n的整数，p为2n-m，Ar表示取代或未取代的苯基，取代或未取代的萘基，或取代或未取代的N-马来酰亚胺基苯基，l为1〜m的整数，其中，在酸受体和吡啶衍生物代表的存在下其中Q1和Q2表示相同或不同的低级烷基，或与其键合的氮原子一起构成吡咯烷环，哌啶环或吗啉环。

6. 发明申请

US20110127671A1 SEMICONDUCTOR DEVICE 失效
标题翻译：半导体器件
公开(公告)号：US20110127671A1
公开(公告)日：2011-06-02
申请号：US13023401
申请日：2011-02-08
申请人： Yasuhiro Yoshikawa , Motoo Suwa , Kazuyuki Sakata
发明人： Yasuhiro Yoshikawa , Motoo Suwa , Kazuyuki Sakata
IPC分类号： H01L23/498
CPC分类号： H01L23/50 , G11C5/02 , G11C5/04 , G11C5/063 , H01L23/5386 , H01L23/552 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/18 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/48235 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/32225 , H01L2224/45099 , H01L2224/05599
摘要： There is provided a semiconductor device which makes equalization of wirings between address system chips easy and reduce the influence of crosstalk noise and capacitive coupling noise among data system wirings for connecting the chips. There are mounted, on a module board, a plurality of stacked memory chips which a data processor chip simultaneously accesses. Address system bonding pads to which a plurality of memory chips correspond are commonly coupled by a wire to a bonding lead at one end of the module board wiring whose other end is coupled by a wire to an address system bonding pads of the data processor. Data system bonding pads of the data processor chip are individually coupled to data system bonding pads of the memory chip. With respect to an arrangement of the plurality of data system bonding pads of the data processor chip, an arrangement of the data system bonding pads to which the memory chip, coupled by the data system wiring, corresponds is made such that memory chips are disposed in an alternating sequence.
摘要翻译：提供了一种半导体器件，其使得地址系统芯片之间的布线均衡容易，并且减少了用于连接芯片的数据系统布线之间的串扰噪声和电容耦合噪声的影响。在模块板上安装数据处理器芯片同时访问的多个堆叠的存储器芯片。多个存储器芯片对应的地址系统接合焊盘通常通过线耦合到模块板配线的一端的接合引线，其另一端通过导线耦合到数据处理器的地址系统接合焊盘。数据处理器芯片的数据系统接合焊盘分别耦合到存储器芯片的数据系统焊盘。关于数据处理器芯片的多个数据系统接合焊盘的布置，数据系统接合焊盘的布置是通过数据系统布线耦合的与存储芯片对应的数据系统焊盘，使得存储芯片被布置在交替序列。

7. 发明授权

US07888795B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07888795B2
公开(公告)日：2011-02-15
申请号：US12795637
申请日：2010-06-07
申请人： Yasuhiro Yoshikawa , Motoo Suwa , Kazuyuki Sakata
发明人： Yasuhiro Yoshikawa , Motoo Suwa , Kazuyuki Sakata
IPC分类号： H01L23/50
CPC分类号： H01L23/50 , G11C5/02 , G11C5/04 , G11C5/063 , H01L23/5386 , H01L23/552 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/18 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/48235 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/32225 , H01L2224/45099 , H01L2224/05599
摘要： There is provided a semiconductor device which makes equalization of wirings between address system chips easy and reduce the influence of crosstalk noise and capacitive coupling noise among data system wirings for connecting the chips. There are mounted, on a module board, a plurality of stacked memory chips which a data processor chip simultaneously accesses. Address system bonding pads to which a plurality of memory chips correspond are commonly coupled by a wire to a bonding lead at one end of the module board wiring whose other end is coupled by a wire to an address system bonding pads of the data processor. Data system bonding pads of the data processor chip are individually coupled to data system bonding pads of the memory chip. With respect to an arrangement of the plurality of data system bonding pads of the data processor chip, an arrangement of the data system bonding pads to which the memory chip, coupled by the data system wiring, corresponds is made such that memory chips are disposed in an alternating sequence.
摘要翻译：提供了一种半导体器件，其使得地址系统芯片之间的布线均衡容易，并且减少了用于连接芯片的数据系统布线之间的串扰噪声和电容耦合噪声的影响。在模块板上安装数据处理器芯片同时访问的多个堆叠的存储器芯片。多个存储器芯片对应的地址系统接合焊盘通常通过线耦合到模块板配线的一端的接合引线，其另一端通过导线耦合到数据处理器的地址系统接合焊盘。数据处理器芯片的数据系统接合焊盘分别耦合到存储器芯片的数据系统焊盘。关于数据处理器芯片的多个数据系统接合焊盘的布置，数据系统接合焊盘的布置是通过数据系统布线耦合的与存储芯片对应的数据系统焊盘，使得存储芯片被布置在交替序列。

8. 发明授权

US06579125B1 Clip connector, method of attaching clip connector, and assembly of clip connector and support member 有权
标题翻译：夹子连接器，夹子连接器的连接方法以及夹子连接器和支撑件的组装
公开(公告)号：US06579125B1
公开(公告)日：2003-06-17
申请号：US09857686
申请日：2001-06-08
申请人： Takaya Nagahata , Koji Nishi , Shigeyoshi Ono , Yasuhiro Yoshikawa , Yoshinobu Kishimoto , Koichi Wada
发明人： Takaya Nagahata , Koji Nishi , Shigeyoshi Ono , Yasuhiro Yoshikawa , Yoshinobu Kishimoto , Koichi Wada
IPC分类号： H01R2400
CPC分类号： H01R12/721 , Y10S439/936
摘要： A clip connector (A) includes an insulating housing (1) and a plurality of terminals (2) projecting from the housing (1). The housing (1) includes an outer surface (1a) for engaging a support member such as a printed board. The outer surface (1a) is irregular, including a plurality of projecting portions (12) and a plurality of retreating portions (13). Each of the terminals (2) includes a straight portion (20a) and a bent portion (20b). Each of the straight portion (20a) is formed with a through-hole (22) through which a resin for bonding the support member and the outer surface (1a) is applied.
摘要翻译：夹子连接器（A）包括绝缘壳体（1）和从壳体（1）突出的多个端子（2）。壳体（1）包括用于接合诸如印刷板的支撑构件的外表面（1a）。外表面（1a）是不规则的，包括多个突出部分（12）和多个后退部分（13）。每个端子（2）包括直线部分（20a）和弯曲部分（20b）。每个直线部分（20a）形成有通孔（22），用于粘合支撑构件和外表面（1a）的树脂通过该通孔。

9. 发明授权

US06307580B1 Thermal printhead and method of making the same 失效
标题翻译：热敏打印头及其制作方法
公开(公告)号：US06307580B1
公开(公告)日：2001-10-23
申请号：US09665701
申请日：2000-09-20
申请人： Yasuhiro Yoshikawa
发明人： Yasuhiro Yoshikawa
IPC分类号： B41J2335
CPC分类号： B41J2/345
摘要： A method of making a thermal printhead including a primary substrate and an auxiliary substrate adjacent to the primary substrate. The method comprises the following steps. First, at least one positioning cutout is formed in either one or both of the primary and auxiliary substrates. The positioning cutout is formed at an edge of the selected substrate. Then, the primary and auxiliary substrates are positioned to each other by using a position-adjusting device provided with an upright pin fitted into the positioning cutout. Then, the electrical connection is established between the first and the second substrates via clip pins.
摘要翻译：一种制造热敏打印头的方法，所述热打印头包括与所述主基板相邻的初级基板和辅助基板。该方法包括以下步骤。首先，在主基板和辅助基板的一个或两个中形成至少一个定位切口。定位切口形成在所选择的基底的边缘。然后，通过使用设置有安装在定位切口中的直立销的位置调节装置将主辅助基板彼此定位。然后，通过夹脚在第一和第二基板之间建立电连接。

10. 发明授权

US08304958B2 Power generation apparatus including an electret and an opposing electrode on the surface of a movable member facing a dielectric 有权
标题翻译：发电装置，其在面向电介质的可动构件的表面上具有驻极体和对置电极
公开(公告)号：US08304958B2
公开(公告)日：2012-11-06
申请号：US12582903
申请日：2009-10-21
申请人： Seiji Aoyagi , Yasuhiro Yoshikawa
发明人： Seiji Aoyagi , Yasuhiro Yoshikawa
IPC分类号： H02N1/00
CPC分类号： H02N1/08
摘要： A power generation apparatus includes a dielectric, a movable member being opposed to the dielectric with a predetermined distance, and an electret and an opposing electrode that are formed on the surface of the movable member facing the dielectric so as to generate a fringe electric field penetrating the dielectric between the two electrodes. When the volume occupancy of the dielectric between the electret and the opposing electrode varies in accordance with a displacement of the movable member, the power generation apparatus outputs the electric charge induced in the opposing electrode as electric current.
摘要翻译：发电装置包括电介质，与电介质相对的预定距离的可动构件以及驻留体和相对电极，所述驻极体和相对电极形成在与所述电介质相对的所述可动构件的表面上，以产生穿过所述电场的边缘电场两个电极之间的电介质。当驻极体和对置电极之间的电介质的体积占有率根据可移动部件的位移而变化时，发电装置将在相对电极中感应的电荷输出为电流。

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