会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Chip packaging technique
    • 芯片封装技术
    • US06320257B1
    • 2001-11-20
    • US08312862
    • 1994-09-27
    • Kumaraswamy JayarajThomas E. NollHarry F. Lockwood
    • Kumaraswamy JayarajThomas E. NollHarry F. Lockwood
    • H01L2334
    • H01L23/057H01L25/0655H01L25/105H01L2224/16H01L2224/73253H01L2225/1023H01L2225/107H01L2225/1094H01L2924/01079H01L2924/09701H01L2924/16152H01L2924/16195H01L2924/3011
    • A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.
    • 提供一种用于至少一个半导体芯片的密封封装,其由其上具有选择性地接合半导体芯片的电互连的基板和优选用作散热器的盖形成,其中围绕 基片和散热片之间的芯片。 基材由具有低透湿性的热塑性材料层形成或包含一层,该材料优选为液晶聚合物(LCP),并且为优选实施方式的多轴取向LCP材料。 在盖是散热器的情况下,散热器由具有高导热性并且优选地与芯片的热膨胀系数基本上匹配的热膨胀系数的材料形成。 在每个芯片的与基板连接的侧面和散热片之间形成密封。 衬底和盖/散热器之间的热粘合可以是压紧的密封件,或者可以例如通过LCP框架提供,所述LCP框架在一侧与衬底密封或密封,并且在另一侧与盖/热 水槽。 芯片可以在RF或微波带上工作,在衬底上具有合适的互连,并且芯片还可以包括光学部件,其中光纤被密封到衬底中并且与相应的光学部件对齐以在至少一个方向上透射光。 多个封装可以在堆叠中物理和电连接在一起以形成3D阵列。
    • 2. 发明授权
    • Microchannel amplifier with tailored pore resistance
    • 微通道放大器具有定制的孔隙电阻
    • US07408142B2
    • 2008-08-05
    • US11532008
    • 2006-09-14
    • David R. BeaulieuHarry F. LockwoodAnton S. Tremsin
    • David R. BeaulieuHarry F. LockwoodAnton S. Tremsin
    • H01J40/14
    • H01J29/023H01J43/246
    • A microchannel amplifier includes an insulating substrate that defines at least one microchannel pore through the substrate from an input surface to an output surface. A conductive layer is formed on an outer surface of the at least one microchannel pore that has a non-uniform resistance as a function of distance through the at least one microchannel pore. The non-uniform resistance is selected to simulate saturation by reducing gain as a function of input current and bias voltage compared with uniform resistance. A first and second electrode is deposited on a respective one of the input and the output surfaces of the insulating substrate. The microchannel amplifier amplifying emissions propagating through the at least one microchannel pore when the first and second electrodes are biased.
    • 微通道放大器包括绝缘基板,其从输入表面到输出表面限定穿过基板的至少一个微通道孔。 在所述至少一个微通道孔的外表面上形成导电层,所述微通道孔具有通过所述至少一个微通道孔的距离的函数的不均匀电阻。 选择非均匀电阻来模拟饱和,通过减小作为输入电流和偏置电压的函数的增益与均匀电阻相比。 第一和第二电极沉积在绝缘基板的输入和输出表面中的相应一个上。 当第一和第二电极偏置时,微通道放大器放大通过至少一个微通道孔传播的发射。
    • 5. 发明授权
    • Field emission device with microchannel gain element
    • 具有微通道增益元件的场致发射器件
    • US5729244A
    • 1998-03-17
    • US416079
    • 1995-04-04
    • Harry F. Lockwood
    • Harry F. Lockwood
    • H01J3/02H01J29/04H01J29/46H01J43/24G09G3/22
    • H01J29/482H01J29/04H01J29/467H01J3/021H01J43/246
    • A field emission device with microchannel gain element provides a plurality of field emission or "cold" cathodes formed generally into an array. The cold cathodes are typically modulated by a grid having a driving voltage. A microchannel gain element is located adjacent the array of cathodes and provides a series of microchannels having a secondary electron emissive material within each of the channels. The channels correspond in number and location to the cathodes and enable multiplication of electrons emitted by the cathodes. Multiplication of the electrons enables the cathodes to be driven at a lower current of emitted electrons than normally applied, absent the microchannel, to obtain the same resulting beam. The beam exiting each of the microchannels is directed to an anode which can comprise a phosphor for use in a flat panel display.
    • 具有微通道增益元件的场发射器件提供了大致形成阵列形成的多个场发射或“冷”阴极。 冷阴极通常由具有驱动电压的电网调制。 微通道增益元件位于阴极阵列附近,并提供在每个通道内具有二次电子发射材料的一系列微通道。 通道的数量和位置对应于阴极,并且使得能够乘以由阴极发射的电子。 电子的乘法使得阴极能够在没有微通道的情况下以比通常施加的更低的发射电子电流被驱动,以获得相同的所得到的光束。 离开每个微通道的光束被引导到可以包括用于平板显示器的荧光体的阳极。
    • 9. 发明授权
    • Field emission device with microchannel gain element
    • 具有微通道增益元件的场致发射器件
    • US06522061B1
    • 2003-02-18
    • US09622701
    • 2000-08-21
    • Harry F. Lockwood
    • Harry F. Lockwood
    • H01J102
    • H01J43/246
    • A field emission device with a micro-channel gain element included a plurality of field emission or “cold” cathodes (102) formed into an array. The cold cathodes are typically modulated by a grid (108) having a driving voltage. A microchannel gain element (114) is secondary electron emissive material within each of the channels. The channels correspond number and location to the cathode and enable multiplication of electron emitted by the cathodes. Multiplication of the electrons enables the cathodes to be driven at a lower current of emitted electrons than normally applied, absent the microchannel, to obtain the same resulting beam. The beam existing each of the micro-channels is directed to an anode (130), which can include a phosphor (128) for use in a flat panel display. Alternatively, anode can include a semiconductor substrate having a reactive resist, and an electrostatic lens structure can be employed to focus the beams to produce a mask pattern on the substrate according to a predetermined mask pattern.
    • 具有微通道增益元件的场发射器件包括形成阵列的多个场发射或“冷”阴极(102)。 冷阴极通常由具有驱动电压的电网(108)调制。 微通道增益元件(114)是每个通道内的二次电子发射材料。 通道对应于阴极的数量和位置,并使得能够乘以由阴极发射的电子。 电子的乘法使得阴极能够在没有微通道的情况下以比通常施加的更低的发射电子电流被驱动,以获得相同的所得到的光束。 存在每个微通道的光束被引导到阳极(130),阳极可以包括用于平板显示器的荧光体(128)。 或者,阳极可以包括具有反应性抗蚀剂的半导体衬底,并且可以采用静电透镜结构来聚焦光束,以根据预定的掩模图案在衬底上产生掩模图案。