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    • 1. 发明授权
    • Chip packaging technique
    • 芯片封装技术
    • US06320257B1
    • 2001-11-20
    • US08312862
    • 1994-09-27
    • Kumaraswamy JayarajThomas E. NollHarry F. Lockwood
    • Kumaraswamy JayarajThomas E. NollHarry F. Lockwood
    • H01L2334
    • H01L23/057H01L25/0655H01L25/105H01L2224/16H01L2224/73253H01L2225/1023H01L2225/107H01L2225/1094H01L2924/01079H01L2924/09701H01L2924/16152H01L2924/16195H01L2924/3011
    • A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.
    • 提供一种用于至少一个半导体芯片的密封封装,其由其上具有选择性地接合半导体芯片的电互连的基板和优选用作散热器的盖形成,其中围绕 基片和散热片之间的芯片。 基材由具有低透湿性的热塑性材料层形成或包含一层,该材料优选为液晶聚合物(LCP),并且为优选实施方式的多轴取向LCP材料。 在盖是散热器的情况下,散热器由具有高导热性并且优选地与芯片的热膨胀系数基本上匹配的热膨胀系数的材料形成。 在每个芯片的与基板连接的侧面和散热片之间形成密封。 衬底和盖/散热器之间的热粘合可以是压紧的密封件,或者可以例如通过LCP框架提供,所述LCP框架在一侧与衬底密封或密封,并且在另一侧与盖/热 水槽。 芯片可以在RF或微波带上工作,在衬底上具有合适的互连,并且芯片还可以包括光学部件,其中光纤被密封到衬底中并且与相应的光学部件对齐以在至少一个方向上透射光。 多个封装可以在堆叠中物理和电连接在一起以形成3D阵列。