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1. 发明授权

US5389814A Electrically blowable fuse structure for organic insulators 失效
标题翻译：有机绝缘子的可电熔熔丝结构
公开(公告)号：US5389814A
公开(公告)日：1995-02-14
申请号：US192760
申请日：1994-02-07
申请人： Kris V. Srikrishnan , James F. White , Jer-Ming Yang
发明人： Kris V. Srikrishnan , James F. White , Jer-Ming Yang
IPC分类号： H01L23/525 , H01L23/538 , H05K1/02 , H01L27/02 , H01L23/48 , H01L29/34
CPC分类号： H01L23/5256 , H01L23/5382 , H01L2924/0002 , H05K1/0263
摘要： An electrically blowable fuse structure usable with organic insulators in microelectronic parts is provided. The fuse structure is made of a first heat resistant member, a fusing element and a second heat resistant member. The heat resistant members are in substantial contact with the fuse and thermally insulate the fuse from the organic insulator. The ends of each fuse are electrically connected to a pair conductors.
摘要翻译：提供了可用于微电子部件中的有机绝缘体的可电熔熔融结构。熔丝结构由第一耐热构件，定影元件和第二耐热构件制成。耐热构件与保险丝基本接触，并将保险丝与有机绝缘体热绝缘。每个保险丝的端部电连接到一对导体。

2. 发明授权

US5469981A Electrically blowable fuse structure manufacturing for organic insulators 失效
标题翻译：有机绝缘子可电熔熔丝结构制造
公开(公告)号：US5469981A
公开(公告)日：1995-11-28
申请号：US323196
申请日：1994-10-14
申请人： Kris V. Srikrishnan , James F. White , Jer-Ming Yang
发明人： Kris V. Srikrishnan , James F. White , Jer-Ming Yang
IPC分类号： H01L23/525 , H01L23/538 , H05K1/02 , H01B13/00
CPC分类号： H01L23/5256 , H01L23/5382 , H01L2924/0002 , H05K1/0263
摘要： An electrically blowable fuse structure usable with organic insulators in microelectronic parts is provided. The fuse structure is made of a first heat resistant member, a fusing element and a second heat resistant member. The heat resistant members are in substantial contact with the fuse and thermally insulate the fuse from the organic insulator. The ends of each fuse are electrically connected to a pair conductors.A process for fabricating an electrically blowable fuse structure usable with an organic insulator is provided. A substrate with an organic insulator coating and containing electrically conductive features with exposed contacts is provided. A heat shield layer and a fuse layer are deposited sequentially and patterned by subtractive etching. Plurality of conductors are formed over so as to electrically connect each fuse element to a pair of conductors. A second heat resistant member is formed over the fuse area and the substrate is subsequently quoted with an organic insulator.
摘要翻译：提供了可用于微电子部件中的有机绝缘体的可电熔熔融结构。熔丝结构由第一耐热构件，定影元件和第二耐热构件制成。耐热构件与保险丝基本接触，并将保险丝与有机绝缘体热绝缘。每个保险丝的端部电连接到一对导体。提供了一种用于制造可用于有机绝缘体的电可熔融熔丝结构的工艺。提供了具有有机绝缘体涂层并且包含具有暴露触点的导电特征的衬底。依次沉积热屏蔽层和熔丝层，并通过减去蚀刻图案化。形成多个导体以便将每个熔丝元件电连接到一对导体。在保险丝区域上形成第二耐热构件，随后用有机绝缘体引用衬底。

3. 发明授权

US4613398A Formation of etch-resistant resists through preferential permeation 失效
标题翻译：通过优先渗透形成耐腐蚀抗蚀剂
公开(公告)号：US4613398A
公开(公告)日：1986-09-23
申请号：US741779
申请日：1985-06-06
申请人： Kaolin N. Chiong , Bea-Jane L. Yang , Jer-Ming Yang
发明人： Kaolin N. Chiong , Bea-Jane L. Yang , Jer-Ming Yang
IPC分类号： H01L21/302 , G03F7/26 , H01L21/3065 , B44C1/22 , B29C17/08 , C03C15/00 , C03C25/06
CPC分类号： G03F7/265
摘要： A method is provided for creation of oxygen etch-resistant polymeric films for use in the production of micron and submicron dimension patterns and fine lines. These etch-resistant polymeric films find use in fabrication of complex structures such as those in electronic devices and magnetic thin film heads. The etch resistance is achieved by incorporation of a protective-oxide-forming metal into a polymeric material using preferential permeation of organometallic materials into the polymeric material.
摘要翻译：提供了一种用于产生用于生产微米和亚微米尺寸图案和细线的耐氧蚀蚀聚合物膜的方法。这些耐蚀刻聚合物膜可用于制造诸如电子器件和磁性薄膜头中的那些复杂结构。通过使用有机金属材料优先渗透到聚合物材料中，将形成保护性氧化物的金属掺入聚合材料中来实现耐蚀刻性。

4. 发明授权

US5519193A Method and apparatus for stressing, burning in and reducing leakage current of electronic devices using microwave radiation 失效
标题翻译：使用微波辐射强化，燃烧和减少电子设备泄漏电流的方法和装置
公开(公告)号：US5519193A
公开(公告)日：1996-05-21
申请号：US966960
申请日：1992-10-27
申请人： Peter E. Freiermuth , Kathleen S. Ginn , Jeffrey A. Haley , Susan J. Lamaire , David A. Lewis , Gavin T. Mills , Timothy A. Redmond , Yuk L. Tsang , Joseph J. Van Horn , Alfred Viehbeck , George F. Walker , Jer-Ming Yang , Clarence S. Long
发明人： Peter E. Freiermuth , Kathleen S. Ginn , Jeffrey A. Haley , Susan J. Lamaire , David A. Lewis , Gavin T. Mills , Timothy A. Redmond , Yuk L. Tsang , Joseph J. Van Horn , Alfred Viehbeck , George F. Walker , Jer-Ming Yang , Clarence S. Long
IPC分类号： G01R31/26 , G01R31/28 , G01R31/311 , H01L21/265 , H01L21/268 , H01L21/326 , H01L21/329 , H05B6/80
CPC分类号： G01R31/2881 , G01R31/311 , Y10S148/071
摘要： The described invention is directed to microwave methods for burning-in, electrical stressing, thermal stressing and reducing rectifying junction leakage current in fully processed semiconductor chips individually and at wafer level, as well as burning in and stressing semiconductor chip packaging substrates and the combination of a semiconductor chip mounted onto a semiconductor chip packaging substrate. Microwaves burn-in devices in a substantially shorter period of time than conventional burn-in techniques and avoid the need for special workpiece holders which are required by conventional stress and burn-in techniques. Additionally, microwave methods are described for reducing the leakage current of recitfying junctions, such as PN junctions and Schottky barrier diode junctions of semiconductor devices on fully processed semiconductor chips and wafers.
摘要翻译：所描述的发明涉及在半导体芯片单独和晶圆级别的烧结，电应力，热应力和减少整流结漏电流的微波方法，以及对半导体芯片封装衬底的燃烧和应力的组合安装在半导体芯片封装基板上的半导体芯片。微波老化装置在比传统的老化技术更短的时间内，并且避免了对于常规应力和老化技术所要求的特殊工件支架的需要。此外，描述了微波方法，用于减少重新连接的漏电流，例如半导体器件在完全处理的半导体芯片和晶片上的PN结和肖特基势垒二极管接头。

5. 发明授权

US4810601A Top imaged resists 失效
标题翻译：顶级成像抗皱剂
公开(公告)号：US4810601A
公开(公告)日：1989-03-07
申请号：US880212
申请日：1986-06-30
申请人： Robert D. Allen , Kaolin N. Chiong , Ming-Fea Chow , Scott A. MacDonald , Jer-Ming Yang , Carlton G. Willson
发明人： Robert D. Allen , Kaolin N. Chiong , Ming-Fea Chow , Scott A. MacDonald , Jer-Ming Yang , Carlton G. Willson
IPC分类号： H01L21/027 , G03F7/038 , G03F7/20 , G03F7/26 , G03F7/38 , G03C3/00 , B05D3/06 , G03C5/00
CPC分类号： G03F7/265 , G03F7/038 , G03F7/2022 , Y10S430/143 , Y10S430/167 , Y10S430/168
摘要： The present invention is concerned with methods of converting a single resist layer into a multilayered resist.The upper portion of the single resist layer can be converted into a dry-etch resistant form. The conversion can be a blanket conversion of the upper portion of the resist layer or can be a patterned conversion of areas within the upper portion of the layer. A patternwise-converted resist can be oxygen plasma developed.The upper portion of the single resist layer can be patternwise converted into a chemically different composition or structure having altered absorptivity toward radiation. The difference in radiation absorptivity within the patterned upper portion of the resist enables subsequent use of blanket irradiation of the resist surface to create differences in chemical solubility between areas having the altered absorptivity toward radiation and non-altered areas. The difference in chemical solubility enables wet development of the patterned resist.
摘要翻译：本发明涉及将单个抗蚀剂层转化为多层抗蚀剂的方法。单个抗蚀剂层的上部可以转化成耐干蚀刻形式。该转换可以是抗蚀剂层的上部的覆盖转化，或者可以是层的上部内的区域的图案化转换。图案转换的抗蚀剂可以是氧等离子体显影。单个抗蚀剂层的上部可以被图案化地转换成具有改变的对辐射的吸收率的化学上不同的组成或结构。在图案化的抗蚀剂上部中的辐射吸收率的差异使得随后可以使用抗蚀剂表面的毯式照射，从而在对辐射和未改变的区域具有改变的吸收率的区域之间产生化学溶解度的差异。化学溶解度的差异使得图案化抗蚀剂的湿显影。

6. 发明授权

US4980264A Photoresist compositions of controlled dissolution rate in alkaline developers 失效
标题翻译：在碱性显影剂中控制溶解速率的光致抗蚀剂组合物
公开(公告)号：US4980264A
公开(公告)日：1990-12-25
申请号：US809948
申请日：1985-12-17
申请人： Kaolin N. Chiong , Bea-Jane L. Yang , Jer-Ming Yang
发明人： Kaolin N. Chiong , Bea-Jane L. Yang , Jer-Ming Yang
IPC分类号： G03C1/72 , G03F7/008 , G03F7/012 , G03F7/022 , G03F7/023 , G03F7/038 , G03F7/039 , H01L21/027
CPC分类号： G03F7/0233 , G03F7/0125
摘要： A photoresist composition is disclosed which is a mixture of a photoactive compound and an alkali soluble resin binder comprises of an unsaturated dicarboxylic acid esterified polymeric material, such as a phenolic resin containing a plurality of acid esterifiable groups esterified with an unsaturated dicarboxylic acid anhydride having the formula ##STR1## wherein R.sub.1 and R.sub.2 are independently selected from hydrogen and alkyl groups containing 1 to 3 carbon atoms, R.sub.3 and R.sub.4 are alkylene groups containing 1 to 3 carbon atoms and x and y are either 0 or 1.
摘要翻译：公开了一种光致抗蚀剂组合物，其是光活性化合物和碱溶性树脂粘合剂的混合物，其包含不饱和二羧酸酯化聚合物材料，例如含有多个可酸酯化基团的酚醛树脂，所述不饱和二羧酸酐具有式其中R 1和R 2独立地选自氢和含有1至3个碳原子的烷基，R 3和R 4是含有1至3个碳原子的亚烷基，x和y是0或1。

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