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1. 发明授权

US09123869B2 Semiconductor device with a light emitting semiconductor die 有权
标题翻译：具有发光半导体管芯的半导体器件
公开(公告)号：US09123869B2
公开(公告)日：2015-09-01
申请号：US13036829
申请日：2011-02-28
申请人： Kong Weng Lee , Kee Yean Ng , Yew Cheong Kuan , Cheng Why Tan , Gin Ghee Tan
发明人： Kong Weng Lee , Kee Yean Ng , Yew Cheong Kuan , Cheng Why Tan , Gin Ghee Tan
IPC分类号： H01L33/00 , H01L23/48 , H01L33/48 , H01L33/62 , H01L23/498
CPC分类号： H01L33/486 , H01L23/49844 , H01L33/62 , H01L2224/48227 , H01L2924/01322
摘要： A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.
摘要翻译：半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。第一和第二导电接合焊盘通过第一和第二导电边缘互连元件电连接到第一和第二导电连接焊盘。

2. 发明申请

US20110147788A1 SEMICONDUCTOR DEVICE WITH A LIGHT EMITTING SEMICONDUCTOR DIE 有权
标题翻译：具有发光半导体芯片的半导体器件
公开(公告)号：US20110147788A1
公开(公告)日：2011-06-23
申请号：US13036829
申请日：2011-02-28
申请人： Kong Weng Lee , Kee Yean Ng , Yew Cheong Kuan , Cheng Why Tan , Gin Ghee Tan
发明人： Kong Weng Lee , Kee Yean Ng , Yew Cheong Kuan , Cheng Why Tan , Gin Ghee Tan
IPC分类号： H01L33/62
CPC分类号： H01L33/486 , H01L23/49844 , H01L33/62 , H01L2224/48227 , H01L2924/01322
摘要： A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.
摘要翻译：半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。第一和第二导电接合焊盘通过第一和第二导电边缘互连元件电连接到第一和第二导电连接焊盘。

3. 发明授权

US07919787B2 Semiconductor device with a light emitting semiconductor die 有权
标题翻译：具有发光半导体管芯的半导体器件
公开(公告)号：US07919787B2
公开(公告)日：2011-04-05
申请号：US11838301
申请日：2007-08-14
申请人： Kong Weng Lee , Kee Yean Ng , Yew Cheong Kuan , Cheng Why Tan , Gin Ghee Tan
发明人： Kong Weng Lee , Kee Yean Ng , Yew Cheong Kuan , Cheng Why Tan , Gin Ghee Tan
IPC分类号： H01L33/00 , H01L23/48
CPC分类号： H01L33/486 , H01L23/49844 , H01L33/62 , H01L2224/48227 , H01L2924/01322
摘要： A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.
摘要翻译：半导体器件包括安装在位于器件的衬底的第一主表面上的第一和第二导电焊盘中的至少一个的发光半导体管芯。发光半导体管芯具有与第一和第二导电接合焊盘电连接的阳极和阴极。半导体器件还包括位于衬底的第二主表面上的第一和第二导电连接焊盘。第一和第二导电接合焊盘经由第一和第二导电互连元件电连接到第一和第二导电连接焊盘。

4. 发明授权

US07279355B2 Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same 有权
标题翻译：用于制造半导体管芯的封装装置的方法及其结合的半导体器件
公开(公告)号：US07279355B2
公开(公告)日：2007-10-09
申请号：US10608606
申请日：2003-06-27
申请人： Kong Weng Lee , Kee Yean Ng , Yew Cheong Kuan , Gin Ghee Tan , Cheng Why Tan
发明人： Kong Weng Lee , Kee Yean Ng , Yew Cheong Kuan , Gin Ghee Tan , Cheng Why Tan
IPC分类号： H01I21/00
CPC分类号： H01L24/97 , H01L23/3121 , H01L23/49827 , H01L23/49838 , H01L33/62 , H01L2224/48227 , H01L2224/48472 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.
摘要翻译：提供具有相对的主表面的基本平坦的基板。基板包括在主表面之间延伸的通孔。通孔填充有导电互连元件。导电安装焊盘和导电连接焊盘形成在与导电互连元件电接触的不同主表面上。通过该方法形成的包装装置的体积仅为半导体管芯的体积的几倍，并且可以由能够承受高温管芯附接工艺的材料制成。包装装置可以被配置为在半导体器件中使用的唯一的包装装置或者需要高温管芯附接工艺的半导体管芯的基座。

5. 发明授权

US07256486B2 Packaging device for semiconductor die, semiconductor device incorporating same and method of making same 有权
标题翻译：用于半导体管芯的封装装置，并入其的半导体器件及其制造方法
公开(公告)号：US07256486B2
公开(公告)日：2007-08-14
申请号：US10608605
申请日：2003-06-27
申请人： Kong Weng Lee , Kee Yean Ng , Yew Cheong Kuan , Gin Ghee Tan , Cheng Why Tan
发明人： Kong Weng Lee , Kee Yean Ng , Yew Cheong Kuan , Gin Ghee Tan , Cheng Why Tan
IPC分类号： H01L29/22
CPC分类号： H01L24/97 , H01L23/49844 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/85399 , H01L2224/85444 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/04953 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.
摘要翻译：包装装置包括基板，安装垫，连接垫和互连元件。基板基本上是平面的并且具有相对的主表面。安装垫是导电的并且位于主要表面中的一个上。连接垫是导电的并且位于另一个主表面上。导电互连元件延伸穿过基板并将安装焊盘和连接焊盘电互连。包装装置的体积仅为半导体管芯的体积的几倍，并且可以由能够承受高温管芯附着工艺的材料制成。包装装置可以被配置为在半导体器件中使用的唯一的包装装置或者需要高温管芯附接工艺的半导体管芯的基座。

6. 发明授权

US07612386B2 High power light emitting diode device 有权
标题翻译：大功率发光二极管器件
公开(公告)号：US07612386B2
公开(公告)日：2009-11-03
申请号：US11358477
申请日：2006-02-20
申请人： Kee Yean Ng , Cheng Why Tan , Ji Kin Tham
发明人： Kee Yean Ng , Cheng Why Tan , Ji Kin Tham
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L23/36 , H01L24/48 , H01L24/49 , H01L33/64 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01068 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon is disclosed. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace bonded to the top surface of the heat-conducting body. An encapsulating cap covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device.
摘要翻译：公开了一种具有顶表面和底表面的导热体的电路元件和其上具有电子电路的管芯。模具包括用于为电子电路供电的第一和第二接触点。模具与导热体热接触，模头的底表面小于导热体的顶表面。模具上的第一接触点连接到结合到导热体的顶表面的第一迹线。封装盖覆盖模具。第一迹线具有延伸到封装帽外部的第一部分和被封装盖覆盖的第二部分。导热体优选由铜或铝构成，并且包括在安装模具的第一表面上具有开口的空腔。模具优选地包括发光装置。

7. 发明授权

US07745897B2 Methods for packaging an image sensor and a packaged image sensor 有权
标题翻译：包装图像传感器和封装图像传感器的方法
公开(公告)号：US07745897B2
公开(公告)日：2010-06-29
申请号：US11140157
申请日：2005-05-27
申请人： Cheng Why Tan , Piang Joon Seow
发明人： Cheng Why Tan , Piang Joon Seow
IPC分类号： H01L31/0203
CPC分类号： H04N5/2253 , H01L24/48 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/8592 , H01L2224/85951 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/4554
摘要： An image sensor is packaged by attaching the image sensor to a substrate, forming metallic bumps on either the image sensor or a transparent cover, where the metallic bumps are formed in a pattern around the perimeter of the active area of the image sensor. The transparent cover is then glued to the image sensor at the metallic bumps. Electrical connections are formed between the image sensor and the substrate using, for example, conventional wire bonding techniques. The electrical connections are encapsulated within an epoxy for protection. In an embodiment, multiple image sensors are packaged together on the same substrate and separated into individually packaged image sensors by, for example, sawing.
摘要翻译：图像传感器通过将图像传感器附接到基板来封装，在图像传感器或透明盖上形成金属凸块，其中金属凸块以图像传感器的有效区域的周边周围的图案形成。然后透明盖子在金属凸块处胶合到图像传感器。使用例如常规的引线接合技术在图像传感器和基板之间形成电连接。电气连接被封装在环氧树脂中以进行保护。在一个实施例中，多个图像传感器被封装在同一基板上并通过例如锯切被分离成单独封装的图像传感器。

8. 发明授权

US07495583B2 Flat-top reflection-based optical encoders 有权
标题翻译：平顶反射式光学编码器
公开(公告)号：US07495583B2
公开(公告)日：2009-02-24
申请号：US11404110
申请日：2006-04-14
申请人： Teong Swee Tan , Premkumar S. Ramachandr , Yee Loong Chin , Cheng Why Tan , Weng Fei Wong
发明人： Teong Swee Tan , Premkumar S. Ramachandr , Yee Loong Chin , Cheng Why Tan , Weng Fei Wong
IPC分类号： H03M1/22
CPC分类号： G01D5/34715
摘要： A reflection-based optical encoding apparatus for the detection of position and/or motion of a mechanical device includes an encoding medium having at least a first reflective portion, and an encoder housing having a light-emitting source and a light-detecting sensor embedded within, the encoder housing being placed in proximity to the encoding medium such that a functional light path can be established from the light-emitting source to the light-detecting sensor via the first reflective portion of the encoding medium. The encoder housing includes a first flat facet positioned between the light-emitting source and the encoding medium, the first flat facet having a first angle relative to a common geometric plane such that light passing from the light-emitting source to the encoding medium is refracted along a first angled path in a manner that the refracted light strikes a desired location of the encoding medium.
摘要翻译：用于检测机械装置的位置和/或运动的基于反射的光编码装置包括具有至少第一反射部分的编码介质和具有嵌入在其内的发光源和光检测传感器的编码器壳体编码器壳体被放置在编码介质附近，使得可以通过编码介质的第一反射部分从发光源到光检测传感器建立功能光路。编码器壳体包括位于发光源和编码介质之间的第一平面，第一平面相对于共同的几何平面具有第一角度，使得从发光源通向编码介质的光被折射沿着第一有角度的路径以折射光照射到编码介质的期望位置的方式。

9. 发明授权

US07102177B2 Light-emitting diode incorporating gradient index element 有权
公开(公告)号：US07102177B2
公开(公告)日：2006-09-05
申请号：US10649094
申请日：2003-08-26
申请人： Kee Siang Goh , Yee Loong Chin , Boon Kheng Lee , Cheng Why Tan
发明人： Kee Siang Goh , Yee Loong Chin , Boon Kheng Lee , Cheng Why Tan
IPC分类号： H01L33/00
CPC分类号： H01L33/58
摘要： The light-emitting device includes a light source and a gradient index (GRIN) element. The GRIN element has a cylindrical refractive index profile in which the refractive index varies radially and is substantially constant axially. The GRIN element includes a first end surface opposite a second end surface and is characterized by a length-to-pitch ratio. The GRIN element is arranged with the first end surface adjacent the light source to receive light from the light source, and emits the light from the second end surface in a radiation pattern dependent on the length-to-pitch ratio. Since the radiation pattern depends on the length-to-pitch ratio of the GRIN element, LEDs with different radiation patterns can be made simply by using GRIN elements of appropriate lengths.

10. 发明授权

US06806583B2 Light source 有权
标题翻译：光源
公开(公告)号：US06806583B2
公开(公告)日：2004-10-19
申请号：US09888857
申请日：2001-06-25
申请人： Huck Khim Koay , Seong Choon Lim , Cheng Why Tan , Gurbir Singh A/L Balwant Singh , Chee Keong Chong , Sundar a/l Natarajan Yoganandan
发明人： Huck Khim Koay , Seong Choon Lim , Cheng Why Tan , Gurbir Singh A/L Balwant Singh , Chee Keong Chong , Sundar a/l Natarajan Yoganandan
IPC分类号： H01L2328
CPC分类号： H01L33/486 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned recess. A light emitting diode is mounted in the recess and the substrate is encapsulated by a transparent encapsulant material forming an ellipsoidal dome over the light emitting diode.
摘要翻译：适用于表面安装到印刷电路板上的光源。光源包括具有中心定位的凹部的平面基板。发光二极管安装在凹槽中，并且衬底被透明的密封剂材料封装，该透明密封材料在发光二极管上形成椭圆形的圆顶。

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