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1. 发明申请

US20120212637A1 SOLID-STATE IMAGING APPARATUS, METHOD OF MANUFACTURING SAME, AND CAMERA 有权
标题翻译：固态成像装置，制造方法和相机
公开(公告)号：US20120212637A1
公开(公告)日：2012-08-23
申请号：US13360166
申请日：2012-01-27
申请人： Koji Tsuduki , Takanori Suzuki , Hisatane Komori , Satoru Hamasaki
发明人： Koji Tsuduki , Takanori Suzuki , Hisatane Komori , Satoru Hamasaki
IPC分类号： H04N5/228 , H01L31/18 , H01L31/02
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/94
摘要： A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.
摘要翻译：一种固态成像装置，包括：具有包括像素区域的主面的半导体芯片; 设置在所述主面上以围绕所述像素区域的突出部分; 设置在所述像素区域上的盖构件; 并且设置围绕像素区域并且接合盖构件和突出部分的粘合材料。突出部分具有面向空间的顶部和第一侧面，由该两个面形成的第一边缘线。粘合剂材料将突出部分的顶面和盖部件结合。粘合剂材料具有面向内部空间的第一面，第一面从第一边缘线朝向盖构件延伸。在与主体面平行的平面内的内部空间的周长在从突出部的顶面向盖部的顶面的方向变短。

2. 发明授权

US08698938B2 Solid-state imaging apparatus, method of manufacturing same, and camera 有权
标题翻译：固体摄像装置及其制造方法及相机
公开(公告)号：US08698938B2
公开(公告)日：2014-04-15
申请号：US13360166
申请日：2012-01-27
申请人： Koji Tsuduki , Takanori Suzuki , Hisatane Komori , Satoru Hamasaki
发明人： Koji Tsuduki , Takanori Suzuki , Hisatane Komori , Satoru Hamasaki
IPC分类号： H04N5/225 , H04N5/335 , H01L27/146
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/94
摘要： A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.
摘要翻译：一种固态成像装置，包括：具有包括像素区域的主面的半导体芯片; 设置在所述主面上以围绕所述像素区域的突出部分; 设置在所述像素区域上的盖构件; 并且设置围绕像素区域并且接合盖构件和突出部分的粘合材料。突出部分具有面向空间的顶部和第一侧面，由该两个面形成的第一边缘线。粘合剂材料将突出部分的顶面和盖部件结合。粘合剂材料具有面向内部空间的第一面，第一面从第一边缘线朝向盖构件延伸。在与主体面平行的平面内的内部空间的周长在从突出部的顶面向盖部的顶面的方向变短。

3. 发明授权

US08241951B2 Method of manufacturing solid-state image pickup device and solid-state image pickup device 有权
标题翻译：制造固态摄像装置和固体摄像装置的方法
公开(公告)号：US08241951B2
公开(公告)日：2012-08-14
申请号：US12640156
申请日：2009-12-17
申请人： Hisatane Komori , Koji Tsuduki , Yasuhiro Matsuki , Satoru Hamasaki
发明人： Hisatane Komori , Koji Tsuduki , Yasuhiro Matsuki , Satoru Hamasaki
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L27/14685 , H01L2224/48091 , H01L2224/73265 , H01L2924/16235 , H01L2924/00014
摘要： A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.
摘要翻译：一种方法包括制备盖构件; 准备包括基板的图像拾取元件，所述基板包括在主表面上包括多个光电检测器的像素区域，所述第一凹凸部分包括被配置为将光聚集在所述多个光电检测器上的多个第一凸起部分，所述第一凸部分别具有透镜形状的部分和围绕第一凹凸部的第二凹凸部，第二凹凸部包括多个第二凸部; 并且使用固定构件将盖构件固定到图像拾取元件的区域，该区域在第一凹凸部和第二凹凸部之间。

4. 发明授权

US08279336B2 Solid-state image pickup device 有权
标题翻译：固态图像拾取装置
公开(公告)号：US08279336B2
公开(公告)日：2012-10-02
申请号：US12795458
申请日：2010-06-07
申请人： Koji Tsuduki , Hisatane Komori , Yasuhiro Matsuki , Satoru Hamasaki
发明人： Koji Tsuduki , Hisatane Komori , Yasuhiro Matsuki , Satoru Hamasaki
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L2224/48091 , H01L2224/73265 , H01L2924/16235 , H01L2924/00014
摘要： A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H2 tan(θA−2θC)≦L1+L1′ at any point on the upright surface, and H tan(θA−2θB)+(H1)tan θB≦L1 and θB>θC at any point on the non-vertical surface, where θA is the inclination of incident light, θB is the inclination at a point on the non-vertical surface, θC is the inclination at a point on the upright surface, H1 is the height of the non-vertical surface, H2 is the height of the upright surface, H is the height of the frame portion, L1 is the distance from the edge of a pixel region to the upper edge of the upright surface, and L1′ is the distance from the upper edge to the lower edge of the upright surface in the planar direction.
摘要翻译：固定到拾取元件的盖构件具有非垂直表面和直立表面，并且在直立表面上的任何点处满足H2 tan（＆amp; A-2＆amp; C;＆lt; L1 + L1'）和H tan（＆ ; A-2＆thetas; B）+（H1）tan＆thetas; B＆nlE; L1和＆thetas; B>＆thetas; C在非垂直表面上的任何点，其中＆amp; A; A是入射光的倾角，在非垂直表面上的点处的倾斜角度; C是直立表面上的点处的倾角，H1是非垂直表面的高度，H2是直立表面的高度，H是高度框架部分的距离L1是从像素区域的边缘到直立表面的上边缘的距离，L1'是在平面方向上从直立表面的上边缘到下边缘的距离。

5. 发明申请

US20100309354A1 SOLID-STATE IMAGE PICKUP DEVICE 有权
标题翻译：固态图像拾取器件
公开(公告)号：US20100309354A1
公开(公告)日：2010-12-09
申请号：US12795458
申请日：2010-06-07
申请人： Koji Tsuduki , Hisatane Komori , Yasuhiro Matsuki , Satoru Hamasaki
发明人： Koji Tsuduki , Hisatane Komori , Yasuhiro Matsuki , Satoru Hamasaki
IPC分类号： H04N5/335
CPC分类号： H04N5/2253 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L2224/48091 , H01L2224/73265 , H01L2924/16235 , H01L2924/00014
摘要： A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H2 tan(θA−2θC)≦L1+L1′ at any point on the upright surface, and H tan(θA−2θB)+(H1)tan θB≦L1 and θB>θC at any point on the non-vertical surface, where θA is the inclination of incident light, θB is the inclination at a point on the non-vertical surface, θC is the inclination at a point on the upright surface, H1 is the height of the non-vertical surface, H2 is the height of the upright surface, H is the height of the frame portion, L1 is the distance from the edge of a pixel region to the upper edge of the upright surface, and L1′ is the distance from the upper edge to the lower edge of the upright surface in the planar direction.
摘要翻译：固定到拾取元件的盖构件具有非垂直表面和直立表面，并且在直立表面上的任何点处满足H2 tan（＆amp; A-2＆amp; C;＆lt; L1 + L1'）和H tan（＆ ; A-2＆thetas; B）+（H1）tan＆thetas; B＆nlE; L1和＆thetas; B>＆thetas; C在非垂直表面上的任何点，其中＆amp; A; A是入射光的倾角，在非垂直表面上的点处的倾斜角度; C是直立表面上的点处的倾角，H1是非垂直表面的高度，H2是直立表面的高度，H是高度框架部分的距离L1是从像素区域的边缘到直立表面的上边缘的距离，L1'是在平面方向上从直立表面的上边缘到下边缘的距离。

6. 发明申请

US20100155869A1 METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE AND SOLID-STATE IMAGE PICKUP DEVICE 有权
标题翻译：制造固态图像拾取器件和固态图像拾取器件的方法
公开(公告)号：US20100155869A1
公开(公告)日：2010-06-24
申请号：US12640156
申请日：2009-12-17
申请人： Hisatane Komori , Koji Tsuduki , Yasuhiro Matsuki , Satoru Hamasaki
发明人： Hisatane Komori , Koji Tsuduki , Yasuhiro Matsuki , Satoru Hamasaki
IPC分类号： H01L31/0216 , H01L31/18
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L27/14685 , H01L2224/48091 , H01L2224/73265 , H01L2924/16235 , H01L2924/00014
摘要： A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.
摘要翻译：一种方法包括制备盖构件; 准备包括基板的图像拾取元件，所述基板包括在主表面上包括多个光电检测器的像素区域，所述第一凹凸部分包括被配置为将光聚集在所述多个光电检测器上的多个第一凸起部分，所述第一凸部分别具有透镜形状的部分和围绕第一凹凸部的第二凹凸部，第二凹凸部包括多个第二凸部; 并且使用固定构件将盖构件固定到图像拾取元件的区域，该区域在第一凹凸部和第二凹凸部之间。

7. 发明授权

US06383835B1 IC package having a conductive material at least partially filling a recess 失效
标题翻译： IC封装，其具有至少部分填充凹部的导电材料
公开(公告)号：US06383835B1
公开(公告)日：2002-05-07
申请号：US08707046
申请日：1996-08-30
申请人： Fumio Hata , Tadashi Kosaka , Hisatane Komori
发明人： Fumio Hata , Tadashi Kosaka , Hisatane Komori
IPC分类号： H01L2144
CPC分类号： H01L25/167 , H01L24/97 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15313 , H01L2924/15787 , H01L2924/181 , H01L2224/85 , H01L2924/00014 , H01L2924/00
摘要： An IC package has a substrate having recesses formed on the side wall thereof, an insulating film for covering an opening of each recess on the side of a principal surface of the substrate, and an IC chip mounted on a mount surface side of the film on the substrate, wherein a conductive portion formed on each recess is used as an external connection terminal for the IC chip. A method of assembling an IC package has the steps of forming a substrate having a plurality of through holes each having an insulating film covering one of the openings of each through hole, mounting one or more IC chips on a principal surface of the substrate on the insulating film side, and electrically connecting the IC chip and the through holes, sealing the substrate with the IC chip mounted thereon with insulating resin, and cut the substrate with the IC chip mounted thereon to expose the side wall of each through hole.
摘要翻译： IC封装具有形成在其侧壁上的凹部的基板，用于覆盖基板的主表面侧的每个凹部的开口的绝缘膜和安装在膜的安装表面侧上的IC芯片基板，其中形成在每个凹部上的导电部分用作IC芯片的外部连接端子。一种组装IC封装的方法，具有以下步骤：形成具有多个通孔的基板，每个通孔具有覆盖每个通孔中的一个开口的绝缘膜，将一个或多个IC芯片安装在基板的主表面上绝缘膜侧，并且将IC芯片和通孔电连接，用安装有绝缘树脂的IC芯片密封基板，并且用安装在其上的IC芯片切割基板以暴露每个通孔的侧壁。

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