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    • 9. 发明申请
    • Positive resist composition and pattern forming method using the same
    • 正型抗蚀剂组合物和使用其的图案形成方法
    • US20050277060A1
    • 2005-12-15
    • US11151549
    • 2005-06-14
    • Koji ShirakawaTomoya Sasaki
    • Koji ShirakawaTomoya Sasaki
    • G03F7/039C08F12/24G03C1/492G03F7/004G03F7/033H01L21/027
    • G03F7/0392
    • A positive resist composition satisfying high sensitivity, high resolution, good pattern profile and good in-vacuum PED property at the same time, and a pattern forming method using the composition, are provided, which is a positive resist composition comprising: (A) a resin which is insoluble or sparingly soluble in an alkali developer and becomes soluble in an alkali developer under the action of an acid; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and (C) an organic basic compound, wherein (A1) a resin containing a repeating unit having a specific structure and (A2) a resin other than the resin (A1) are contained as the resin of the component (A); and a pattern forming method using the composition.
    • 提供了一种能够同时满足高灵敏度,高分辨率,良好的图案形状和良好的真空PED特性的正性抗蚀剂组合物和使用该组合物的图案形成方法,其是正性抗蚀剂组合物,其包含:(A) 树脂,其不溶或微溶于碱显影剂,并在酸的作用下变得可溶于碱显影剂; (B)能够在用光化射线或辐射照射时能产生酸的化合物; 和(C)有机碱性化合物,其中(A1)包含具有特定结构的重复单元的树脂和(A2)除树脂(A1)之外的树脂的树脂包含作为组分(A)的树脂; 以及使用该组合物的图案形成方法。