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1. 发明授权

US4956014A Electroless copper plating solution 失效
标题翻译：化学镀铜溶液
公开(公告)号：US4956014A
公开(公告)日：1990-09-11
申请号：US325536
申请日：1989-03-20
申请人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Ishida , Junji Ishikawa
发明人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Ishida , Junji Ishikawa
IPC分类号： C23C18/40
CPC分类号： C23C18/40
摘要： A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methylpiperidine, and diethylaminoethanol.

2. 发明授权

US4935267A Process for electrolessly plating copper and plating solution therefor 失效
标题翻译：无电镀铜及其电镀液的方法
公开(公告)号：US4935267A
公开(公告)日：1990-06-19
申请号：US190854
申请日：1988-05-06
申请人： Koji Kondo , Katuhiko Murakawa , Nobumasa Ishida , Junji Ishikawa , Kaoru Nomoto , Futoshi Ishikawa
发明人： Koji Kondo , Katuhiko Murakawa , Nobumasa Ishida , Junji Ishikawa , Kaoru Nomoto , Futoshi Ishikawa
IPC分类号： C23C18/40 , H05K3/18
CPC分类号： H05K3/181 , C23C18/40
摘要： By forming a first copper layer on a substrate by using a complexing agent for copper ion, which has a low copper complex stability constant, a uniform second layer can be stably formed by a second complexing agent for a copper ion, which has a high copper complex stability constant, even if the substrate is composed of a material having a low catalytic activity, such as tungsten, or even if the catalytic activity of the substrate is uneven. A similar effect can also be obtained by adding a small amount of a complexing agent for a copper ion, having a low stability constant, to an electroless copper plating bath containing a complexing agent for a copper ion, having a low stability constant. In this case, an effect of preventing stopping of the reaction of the complexing agent of a copper ion, having a high stability constant, is attained. Most preferably, after formation of a uniform first copper layer by an electroless copper plating solution containing a complexing agent for a copper ion, having a low stability constant, a second copper layer is formed by an electroless copper plating solution containing a complexing agent for a copper ion, having a high stability constant and also in this case, a small amount of a complexing agent for a copper ion, having a low stability constant, is added.
摘要翻译：通过使用铜络合物的稳定常数低的铜离子络合剂，在基板上形成第一铜层，可以通过第二铜离子络合剂稳定地形成均匀的第二层，铜离子配位剂复合稳定性常数即使基材由具有低催化活性的材料如钨构成，或即使基材的催化活性不均匀也是如此。通过向具有低稳定性常数的含有铜离子络合剂的化学镀铜浴中加入少量用于具有低稳定性常数的铜离子络合剂也可以获得类似的效果。在这种情况下，可以获得阻止具有高稳定性常数的铜离子络合剂的反应停止的效果。最优选的是，通过含有铜离子络合剂的化学镀铜溶液形成均匀的第一铜层，具有低稳定性常数，第二铜层由含有络合剂的化学镀铜溶液形成，铜离子，具有高稳定性常数，并且在这种情况下，加入少量的具有低稳定常数的铜离子络合剂。

3. 发明授权

US4814009A Electroless copper plating solution 失效
标题翻译：化学镀铜溶液
公开(公告)号：US4814009A
公开(公告)日：1989-03-21
申请号：US119861
申请日：1987-11-13
申请人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Ishida , Junji Ishikawa
发明人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Ishida , Junji Ishikawa
IPC分类号： C23C18/40 , B05D1/18
CPC分类号： C23C18/40
摘要： A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methyl-piperidine, and tris (4-bromophenyl) amine, N-methylmorpholine.
摘要翻译：通过添加特定的单胺作为促进剂提供了实际上快速的化学镀铜溶液。促进剂应为叔胺，不能为二胺，对铜离子不具有络合能力，不含酮或羧基或不饱和基团。这些单胺的具体实例包括三乙胺，三丙胺，三苄基胺，N-甲基 - 哌啶和三（4-溴苯基）胺N-甲基吗啉。

4. 发明授权

US4790876A Chemical copper-blating bath 失效
标题翻译：化学镀铜浴
公开(公告)号：US4790876A
公开(公告)日：1988-12-13
申请号：US68366
申请日：1987-07-01
申请人： Koji Kondo , Katuhiko Murakawa , Nobumasa Ishida , Junji Ishikawa , Kaoru Nomoto , Futoshi Ishikawa
发明人： Koji Kondo , Katuhiko Murakawa , Nobumasa Ishida , Junji Ishikawa , Kaoru Nomoto , Futoshi Ishikawa
IPC分类号： C23C18/40 , B22F7/00 , B05D5/12
CPC分类号： C23C18/40
摘要： In a chemical copper-plating bath comprising a copper sulfate, a complexing agent, a reducing agent, and a pH-adjusting agent, borofluoride is added to enhance the deposition speed of Cu, thus eliminating the problems of a complicated control of the bath.
摘要翻译：在包含硫酸铜，络合剂，还原剂和pH调节剂的化学镀铜浴中，加入氟硼酸以提高Cu的沉积速度，从而消除了浴的复杂控制的问题。

5. 发明授权

US5039338A Electroless copper plating solution and process for formation of copper film 失效
标题翻译：化学镀铜溶液及铜膜形成工艺
公开(公告)号：US5039338A
公开(公告)日：1991-08-13
申请号：US456659
申请日：1989-12-29
申请人： Koji Kondo , Seiji Amakusa , Katuhiko Murakawa , Katsuaki Kojima , Nobumasa Ishida , Junji Ishikawa , Futoshi Ishikawa
发明人： Koji Kondo , Seiji Amakusa , Katuhiko Murakawa , Katsuaki Kojima , Nobumasa Ishida , Junji Ishikawa , Futoshi Ishikawa
IPC分类号： C23C18/40
CPC分类号： C23C18/405
摘要： Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.-3 mole/l of at least one compound selected from the group consisting of pyridazine, methylpiperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, naphthalene, 1,8-naphthyidine, 1,6-naphthyridine, tetrathiafurvalene, .alpha.,.alpha.,.alpha.-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzoic acid as an agent for improving the physical properties of a plating film, and a process for forming an electroless copper deposition film by using this electroless copper plating solution.
摘要翻译：公开了包含铜离子，铜离子络合剂，还原剂和pH调节剂的无电镀铜溶液，所述镀溶液包含三烷醇单胺或其盐作为络合剂和促进剂，其量为当三烷醇单胺或其盐以足以使铜离子复合但不足以起促进剂的量存在时获得的铜沉积速度高的铜沉积速度，以及1.2×10 -4至1.2×10 -3摩尔/升的作为反应引发剂的铁离子化合物和/或1.92×10 -4至1.92×10 -3摩尔/升的选自哒嗪，甲基哌啶，1,2-二（2-吡啶基）乙烯的至少一种化合物，1,2-二（吡啶基）乙烯，2,2'-二吡啶基胺，2,2'-联吡啶基，2,2'-联嘧啶，6,6'-二甲基-2,2'-联吡啶，二-2 吡啶基酮，N，N，N'，N'-四乙基乙二胺，萘，1,8-萘啶，1,6-萘啶，四糠醛，α，α ，α-三联吡啶，邻苯二甲酸，间苯二甲酸和2,2'-二苯甲酸作为改善电镀膜的物理性能的试剂，以及使用该化学镀铜溶液形成无电解铜沉积膜的方法。

6. 发明授权

US5965211A Electroless copper plating solution and process for formation of copper film 失效
标题翻译：化学镀铜溶液及铜膜形成工艺
公开(公告)号：US5965211A
公开(公告)日：1999-10-12
申请号：US725767
申请日：1991-07-02
申请人： Koji Kondo , Seiji Amakusa , Katuhiko Murakawa , Katsuaki Kojima , Nobumasa Ishida , Junji Ishikawa , Futoshi Ishikawa
发明人： Koji Kondo , Seiji Amakusa , Katuhiko Murakawa , Katsuaki Kojima , Nobumasa Ishida , Junji Ishikawa , Futoshi Ishikawa
IPC分类号： C23C18/40 , B05D3/04 , B05D1/18 , B05D3/10
CPC分类号： C23C18/405
摘要： Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.-3 mole/l of at least one compound selected from the group consisting of pyridazine, methylpiperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, napththalene, 1,8-naphthyridine, 1,6-naphthyridine, tetrathiafurvalene, .alpha.,.alpha.,.alpha.-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzoic acid as an agent for improving the physical properties of a plating film, and a process for forming an electroless copper deposition film by using this electroless copper plating solution.
摘要翻译：公开了包含铜离子，铜离子络合剂，还原剂和pH调节剂的无电镀铜溶液，所述镀溶液包含三烷醇单胺或其盐作为络合剂和促进剂，其量为当三烷醇单胺或其盐以足以使铜离子复合但不足以起促进剂的量存在时获得的铜沉积速度高的铜沉积速度，以及1.2×10 -4至1.2×10 -3摩尔/升的作为反应引发剂的铁离子化合物和/或1.92×10 -4至1.92×10 -3摩尔/升的选自哒嗪，甲基哌啶，1,2-二（2-吡啶基）乙烯的至少一种化合物，1,2-二（吡啶基）乙烯，2,2'-二吡啶基胺，2,2'-联吡啶基，2,2'-联嘧啶，6,6'-二甲基-2,2'-联吡啶，二-2 - 吡啶酮，N，N，N'，N'-四乙基乙二胺，萘，1,8-萘啶，1,6-萘啶，四硫糠醛，α， ha，α-三联吡啶，邻苯二甲酸，间苯二甲酸和2,2'-二苯甲酸作为改善电镀膜的物理性能的试剂，以及使用该化学镀铜溶液形成无电解铜沉积膜的方法。

7. 发明授权

US4834796A Electroless copper plating solution and process for electrolessly plating copper 失效
标题翻译：化学镀铜溶液及无电镀铜工艺
公开(公告)号：US4834796A
公开(公告)日：1989-05-30
申请号：US117079
申请日：1987-11-05
申请人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Isida , Junji Isikawa
发明人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Isida , Junji Isikawa
IPC分类号： C23C18/40 , H05K3/18
CPC分类号： C23C18/40
摘要： A practically fast electroless copper deposition is obtained by using a trialkanolmonoamine as a complexing agent for copper ion and as an accelerator, by adding it in an excess amount of 1.2 to 30 times the mole concentration of the copper ion. An optimum increased deposition rate of 100 .mu.m/hr is obtained even if additives such as potassium ferrocyanide, 2,2'-bipyridyl, polyethylenegrycol and an anionic surfactant are added.
摘要翻译：通过使用三烷醇单胺作为铜离子的络合剂和作为促进剂，通过加入过量的铜离子的摩尔浓度的1.2〜30倍，可以获得实际上快速的无电沉积铜。即使添加如亚铁氰化钾，2,2'-联吡啶，聚乙烯三聚氰胺和阴离子表面活性剂等添加剂，也能获得最佳的100微米/小时的沉积速率。

8. 发明授权

US5450870A Method and an apparatus for detecting concentration of a chemical treating solution and an automatic control apparatus thereof 失效
标题翻译：用于检测化学处理溶液浓度的方法和装置及其自动控制装置
公开(公告)号：US5450870A
公开(公告)日：1995-09-19
申请号：US162187
申请日：1993-12-16
申请人： Makoto Suga , Masashi Niwa , Fumio Kojima , Nobumasa Ishida , Koji Kondo
发明人： Makoto Suga , Masashi Niwa , Fumio Kojima , Nobumasa Ishida , Koji Kondo
IPC分类号： C23C18/16 , G05D21/02 , G05D11/08
CPC分类号： C23C18/1683 , C23C18/1628 , G05D21/02 , Y10T137/0329 , Y10T137/2509
摘要： According to the present invention, the changing rate of the predetermined component concentration is determined, based on the difference between the predetermined component concentration in a chemical treating solution (a plating solution) which is analyzed this time and the predetermined component concentration analyzed last time, both measured by an analytical means, and the difference of each sampling time for analysis of each component concentration by the analytical means (140). Subsequently, the correction amount for the analyzed result of this time based on the changing rate obtained above and the elapsed time from the sampling point of time of the plating solution of this time for analysis of the plating solution by the analytical means to the current point of time (150), and then the analyzed result is corrected based on the resulting correction amount to compute or calculate the current concentration (160). As the result, the current concentration can be detected accurately regardless of the analyzing time of the plating solution by the analytical means.
摘要翻译： PCT No.PCT / JP93 / 00486 Sec。 371日期：1993年12月16日 102（e）日期1993年12月16日PCT提交1993年4月16日PCT公布。公开号WO93 / 21359 日期为1993年10月28日。根据本发明，基于本次分析的化学处理溶液（电镀液）中的规定成分浓度与本发明的分析浓度之间的差异，确定预定成分浓度的变化率通过分析手段测量的上次分析的预定组分浓度和通过分析装置（140）分析每种组分浓度的每个采样时间的差异。随后，根据上述获得的变化率，将该时刻的分析结果的校正量和从该分析手段分析电镀液的时刻的电镀溶液的取样点到当前点的经过时间的时间（150），然后基于所得到的校正量来校正分析结果，以计算或计算当前浓度（160）。结果，可以准确地检测电流浓度，而不管分析装置的电镀溶液的分析时间如何。

9. 发明授权

US5405656A Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor 失效
标题翻译：用于催化处理的溶液，将催化剂施加到基材的方法和形成电导体的方法
公开(公告)号：US5405656A
公开(公告)日：1995-04-11
申请号：US161063
申请日：1993-12-03
申请人： Futoshi Ishikawa , Koji Kondo , Masahiro Irie
发明人： Futoshi Ishikawa , Koji Kondo , Masahiro Irie
IPC分类号： B01J23/44 , B01J37/02 , B01J37/08 , B01J37/34 , B05D1/20 , C23C18/16 , C23C18/30 , H05K3/18 , B05D1/18 , B05D3/06
CPC分类号： B82Y30/00 , B01J23/44 , B01J37/0203 , B01J37/086 , B01J37/344 , B01J37/348 , B01J37/349 , B05D1/202 , B05D1/208 , B82Y40/00 , C23C18/1608 , C23C18/1612 , C23C18/182 , C23C18/1831 , C23C18/1868 , C23C18/1879 , C23C18/204 , C23C18/30 , H05K3/185
摘要： The present invention relates to a solution for catalytic treatment, which is effective for applying a catalyst-metal onto the surface of a substrate, which can provide a film having excellent properties such as adhesion, precision and selectivity through electroless plating or the like, and which does not cause a premature and undesirable decomposition in a bath. The solution for catalytic treatment comprises a catalyst-metal in the form of ions, which permits the deposition of the metal serving as a catalyst on a substrate by applying the solution onto the surface of the substrate and then irradiating the substrate with light rays. The present invention also relates to a method of applying a catalyst onto a substrate and a method of forming an electrical conductor in which such a solution for catalytic treatment is employed.
摘要翻译：本发明涉及一种用于催化处理的溶液，其有效地将催化剂金属施加到基材表面上，其可以通过无电镀等提供具有优异性能如粘合性，精度和选择性的膜，以及这不会在浴中引起过早和不期望的分解。用于催化处理的溶液包括离子形式的催化剂金属，其允许通过将溶液施加到基材的表面上然后用光线照射基板，将用作催化剂的金属沉积在基材上。本发明还涉及将催化剂施加到基材上的方法以及形成其中使用这种催化处理溶液的电导体的方法。

10. 发明申请

US20090233565A1 Receiving decive 有权
标题翻译：接收决定
公开(公告)号：US20090233565A1
公开(公告)日：2009-09-17
申请号：US12382139
申请日：2009-03-10
申请人： Youichirou Suzki , Noboru Maeda , Takahisa Koyasu , Koji Kondo , Shigeki Takahashi
发明人： Youichirou Suzki , Noboru Maeda , Takahisa Koyasu , Koji Kondo , Shigeki Takahashi
IPC分类号： H04B7/00
CPC分类号： H04L25/12 , H04L25/0272 , H04L25/0278 , H04L25/0294
摘要： A receiving device is provided capable of avoiding reception of unnecessary energy when a signal waveform actually changes on a receiving side. An impedance control circuit includes a sensing unit to sense one or more of a voltage, current, or power of a signal to be received by a receiving circuit. The impedance control unit varies an input impedance according to the change in the sensed one or more quantities so that the received signal will be reflected. Thus the excess energy of the signal is reflected and fed to any other receiving circuit achieving stable communications.
摘要翻译：提供一种接收装置，其能够在信号波形在接收侧实际改变时避免接收不必要的能量。阻抗控制电路包括感测单元，用于感测由接收电路接收的信号的电压，电流或功率中的一个或多个。阻抗控制单元根据感测的一个或多个量的变化来改变输入阻抗，使得接收到的信号将被反射。因此，信号的过剩能量被反射并馈送到实现稳定通信的任何其它接收电路。

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