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1. 发明授权

US4790876A Chemical copper-blating bath 失效
标题翻译：化学镀铜浴
公开(公告)号：US4790876A
公开(公告)日：1988-12-13
申请号：US68366
申请日：1987-07-01
申请人： Koji Kondo , Katuhiko Murakawa , Nobumasa Ishida , Junji Ishikawa , Kaoru Nomoto , Futoshi Ishikawa
发明人： Koji Kondo , Katuhiko Murakawa , Nobumasa Ishida , Junji Ishikawa , Kaoru Nomoto , Futoshi Ishikawa
IPC分类号： C23C18/40 , B22F7/00 , B05D5/12
CPC分类号： C23C18/40
摘要： In a chemical copper-plating bath comprising a copper sulfate, a complexing agent, a reducing agent, and a pH-adjusting agent, borofluoride is added to enhance the deposition speed of Cu, thus eliminating the problems of a complicated control of the bath.
摘要翻译：在包含硫酸铜，络合剂，还原剂和pH调节剂的化学镀铜浴中，加入氟硼酸以提高Cu的沉积速度，从而消除了浴的复杂控制的问题。

2. 发明授权

US4956014A Electroless copper plating solution 失效
标题翻译：化学镀铜溶液
公开(公告)号：US4956014A
公开(公告)日：1990-09-11
申请号：US325536
申请日：1989-03-20
申请人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Ishida , Junji Ishikawa
发明人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Ishida , Junji Ishikawa
IPC分类号： C23C18/40
CPC分类号： C23C18/40
摘要： A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methylpiperidine, and diethylaminoethanol.

3. 发明授权

US4935267A Process for electrolessly plating copper and plating solution therefor 失效
标题翻译：无电镀铜及其电镀液的方法
公开(公告)号：US4935267A
公开(公告)日：1990-06-19
申请号：US190854
申请日：1988-05-06
申请人： Koji Kondo , Katuhiko Murakawa , Nobumasa Ishida , Junji Ishikawa , Kaoru Nomoto , Futoshi Ishikawa
发明人： Koji Kondo , Katuhiko Murakawa , Nobumasa Ishida , Junji Ishikawa , Kaoru Nomoto , Futoshi Ishikawa
IPC分类号： C23C18/40 , H05K3/18
CPC分类号： H05K3/181 , C23C18/40
摘要： By forming a first copper layer on a substrate by using a complexing agent for copper ion, which has a low copper complex stability constant, a uniform second layer can be stably formed by a second complexing agent for a copper ion, which has a high copper complex stability constant, even if the substrate is composed of a material having a low catalytic activity, such as tungsten, or even if the catalytic activity of the substrate is uneven. A similar effect can also be obtained by adding a small amount of a complexing agent for a copper ion, having a low stability constant, to an electroless copper plating bath containing a complexing agent for a copper ion, having a low stability constant. In this case, an effect of preventing stopping of the reaction of the complexing agent of a copper ion, having a high stability constant, is attained. Most preferably, after formation of a uniform first copper layer by an electroless copper plating solution containing a complexing agent for a copper ion, having a low stability constant, a second copper layer is formed by an electroless copper plating solution containing a complexing agent for a copper ion, having a high stability constant and also in this case, a small amount of a complexing agent for a copper ion, having a low stability constant, is added.
摘要翻译：通过使用铜络合物的稳定常数低的铜离子络合剂，在基板上形成第一铜层，可以通过第二铜离子络合剂稳定地形成均匀的第二层，铜离子配位剂复合稳定性常数即使基材由具有低催化活性的材料如钨构成，或即使基材的催化活性不均匀也是如此。通过向具有低稳定性常数的含有铜离子络合剂的化学镀铜浴中加入少量用于具有低稳定性常数的铜离子络合剂也可以获得类似的效果。在这种情况下，可以获得阻止具有高稳定性常数的铜离子络合剂的反应停止的效果。最优选的是，通过含有铜离子络合剂的化学镀铜溶液形成均匀的第一铜层，具有低稳定性常数，第二铜层由含有络合剂的化学镀铜溶液形成，铜离子，具有高稳定性常数，并且在这种情况下，加入少量的具有低稳定常数的铜离子络合剂。

4. 发明授权

US4814009A Electroless copper plating solution 失效
标题翻译：化学镀铜溶液
公开(公告)号：US4814009A
公开(公告)日：1989-03-21
申请号：US119861
申请日：1987-11-13
申请人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Ishida , Junji Ishikawa
发明人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Ishida , Junji Ishikawa
IPC分类号： C23C18/40 , B05D1/18
CPC分类号： C23C18/40
摘要： A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methyl-piperidine, and tris (4-bromophenyl) amine, N-methylmorpholine.
摘要翻译：通过添加特定的单胺作为促进剂提供了实际上快速的化学镀铜溶液。促进剂应为叔胺，不能为二胺，对铜离子不具有络合能力，不含酮或羧基或不饱和基团。这些单胺的具体实例包括三乙胺，三丙胺，三苄基胺，N-甲基 - 哌啶和三（4-溴苯基）胺N-甲基吗啉。

5. 发明授权

US4834796A Electroless copper plating solution and process for electrolessly plating copper 失效
标题翻译：化学镀铜溶液及无电镀铜工艺
公开(公告)号：US4834796A
公开(公告)日：1989-05-30
申请号：US117079
申请日：1987-11-05
申请人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Isida , Junji Isikawa
发明人： Koji Kondo , Katuhiko Murakawa , Kaoru Nomoto , Futoshi Ishikawa , Nobumasa Isida , Junji Isikawa
IPC分类号： C23C18/40 , H05K3/18
CPC分类号： C23C18/40
摘要： A practically fast electroless copper deposition is obtained by using a trialkanolmonoamine as a complexing agent for copper ion and as an accelerator, by adding it in an excess amount of 1.2 to 30 times the mole concentration of the copper ion. An optimum increased deposition rate of 100 .mu.m/hr is obtained even if additives such as potassium ferrocyanide, 2,2'-bipyridyl, polyethylenegrycol and an anionic surfactant are added.
摘要翻译：通过使用三烷醇单胺作为铜离子的络合剂和作为促进剂，通过加入过量的铜离子的摩尔浓度的1.2〜30倍，可以获得实际上快速的无电沉积铜。即使添加如亚铁氰化钾，2,2'-联吡啶，聚乙烯三聚氰胺和阴离子表面活性剂等添加剂，也能获得最佳的100微米/小时的沉积速率。

6. 发明授权

US5248853A Semiconductor element-mounting printed board 失效
标题翻译：半导体元件安装印刷板
公开(公告)号：US5248853A
公开(公告)日：1993-09-28
申请号：US791679
申请日：1991-11-14
申请人： Junji Ishikawa , Nobumasa Ishida , Kaoru Nomoto
发明人： Junji Ishikawa , Nobumasa Ishida , Kaoru Nomoto
IPC分类号： H01L23/14 , H05K1/00 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/46
CPC分类号： H05K1/0271 , H01L23/145 , H05K1/036 , H05K1/056 , H01L2224/16225 , H05K1/0298 , H05K2201/0129 , H05K2201/0133 , H05K2201/0278 , H05K2201/068 , H05K3/4608
摘要： A semiconductor element-mounting printed board, comprising a substrate having a thermal expansion coefficient not higher than 4.5.times.10.sup.-6 /.degree. C., a buffer layer formed on at least one of the surfaces of the substrate and having a Young's modulus not higher than 450 kg/mm.sup.2, a conductor circuit formed on a surface of the buffer layer, the conductor circuit having predetermined patterns, and a semiconductor element bonded to the conductor circuit by soldering.
摘要翻译：一种半导体元件安装印刷电路板，包括热膨胀系数不高于4.5×10 -6 /℃的衬底，形成在所述衬底的至少一个表面上并具有不高于 450kg / mm2，形成在缓冲层的表面上的导体电路，具有预定图案的导体电路，以及通过焊接接合到导体电路的半导体元件。

7. 发明授权

US06228467B1 Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate 有权
标题翻译：耐热绝缘膜，使用其的印刷电路板原料和用于制造基板的方法
公开(公告)号：US06228467B1
公开(公告)日：2001-05-08
申请号：US09381283
申请日：1999-09-21
申请人： Kouichirou Taniguchi , Jun Takagi , Hideo Yamano , Shingetsu Yamada , Kouji Kondo , Kaoru Nomoto
发明人： Kouichirou Taniguchi , Jun Takagi , Hideo Yamano , Shingetsu Yamada , Kouji Kondo , Kaoru Nomoto
IPC分类号： B32B300
CPC分类号： H05K3/4632 , C08L71/00 , C08L79/08 , H05K1/0353 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0129 , H05K2201/10378 , Y10T428/24917 , Y10T428/249994 , Y10T428/31511 , C08L2666/22
摘要： A base plate for a printed circuit board, having a conductive foil heat-bonded to at least one side of a film insulator which comprises from 65 to 35 wt % of a polyarylketone resin and from 35 to 65 wt % of a non-crystalline polyether imide resin and of which the glass transition temperature is from 150 to 230° C. and the peak temperature of crystal fusion is at least 260° C., as measured when the temperature is raised in the differential scanning calorimetry, if necessary after forming a through-hole and filling a conductive paste therein, and of which, after the heat bonding, the heat of crystal fusion &Dgr;Hm and the heat of crystallization &Dgr;Hc generated by crystallization during the temperature rise, as measured when the temperature is raised by the differential scanning calorimetry, satisfy the following relation: [(&Dgr;Hm−&Dgr;Hc)/&Dgr;Hm]≦0.5.
摘要翻译：一种用于印刷电路板的基板，其具有热粘合到膜绝缘体的至少一侧的导电箔，该导电箔包含65至35重量％的聚芳基酮树脂和35至65重量％的非结晶聚醚酰亚胺树脂，玻璃化转变温度为150〜230℃，晶体熔融峰值温度为260℃以上，如果需要，则在差示扫描量热法中测定，如果需要，在形成通孔，并在其中填充导电膏，其中在热粘结之后，通过差示扫描升高温度时测量的结晶熔融DELTAHm的热量和通过结晶在温度升高期间产生的结晶热量DELTAHc 量热法，满足以下关系：

8. 发明授权

US4656195A Ethylene oxide adducts, method of producing same and cosmetics and ointments containing same 失效
标题翻译：环氧乙烷加合物，其生产方法和含有其的化妆品和软膏
公开(公告)号：US4656195A
公开(公告)日：1987-04-07
申请号：US785551
申请日：1985-10-08
申请人： Yoshin Tamai , Fumito Yamamoto , Manzo Shiono , Koichi Kanehira , Hiroshi Ozasa , Kaoru Nomoto
发明人： Yoshin Tamai , Fumito Yamamoto , Manzo Shiono , Koichi Kanehira , Hiroshi Ozasa , Kaoru Nomoto
IPC分类号： A61K8/00 , A61K8/30 , A61K8/39 , A61K8/72 , A61K8/86 , A61K9/06 , A61Q5/00 , A61Q5/02 , A61Q5/12 , A61Q7/00 , A61Q19/00 , C07C43/11 , C08G65/26 , C08G65/28 , A61K7/00
CPC分类号： C08G65/2609 , A61K8/39 , A61K8/86 , A61Q19/00 , C07C43/11 , A61Q5/00 , A61Q5/02
摘要： Novel ethylene oxide adducts are provided. They have properties suited for their use as base components of cosmetics and ointments. Thus, cosmetics and ointments containing those ethylene oxide adducts are also provided. There is further provided a method of producing such ethylene oxide adducts in high yields.
摘要翻译：提供了新的环氧乙烷加成物。它们具有适合用作化妆品和软膏的基础成分的性质。因此，还提供了含有这些环氧乙烷加合物的化妆品和软膏。还提供了以高产率生产这种环氧乙烷加合物的方法。

9. 发明授权

US06499217B1 Method of manufacturing three-dimensional printed wiring board 失效
标题翻译：制造三维印刷电路板的方法
公开(公告)号：US06499217B1
公开(公告)日：2002-12-31
申请号：US09700992
申请日：2001-02-06
申请人： Shingetsu Yamada , Jun Takagi , Koichiro Taniguchi , Kaoru Nomoto , Toshihiro Miyake , Kazuya Sanada , Makoto Totani
发明人： Shingetsu Yamada , Jun Takagi , Koichiro Taniguchi , Kaoru Nomoto , Toshihiro Miyake , Kazuya Sanada , Makoto Totani
IPC分类号： H01K322
CPC分类号： H01K3/22 , H05K1/0313 , H05K1/0353 , H05K3/0014 , H05K2201/0129 , H05K2201/0355 , H05K2201/09036 , H05K2203/0108 , H05K2203/1105 , H05K2203/302 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158
摘要： An efficient method of manufacturing a three-dimensional printed wiring board is provided in which a conductor foil can be reliably heat-fused to the board at a relatively low temperature and the three-dimensional shape such as convex and concave of a mold can be reproduced precisely with no residual stress. The method comprises the steps of providing a filmy insulator comprising a thermoplastic resin composition containing 65-35 wt % of a polyaryl ketone resin having a crystal-melting peak temperature of 260° C. or over, and 35-65 wt % of an amorphous polyetherimide resin, and having a glass transition temperature as measured when the temperature is increased for differential scanning calorie measurement of 150-230° C. superposing a conductor foil on one or both sides of the filmy insulating member, heat-fusing the conductor foil so that the thermoplastic resin composition will satisfy the relation between the crystal-melting calorie &Dgr; Hm and the crystallizing calorie &Dgr; Hc as expressed by the following formula (I), etching the conductor foil to form a conductor circuit, and deforming the printed wiring circuit obtained three-dimensionally. [(&Dgr;Hm−&Dgr;Hc)/&Dgr;Hm]≦0.5 (I): [(&Dgr;Hm−&Dgr;Hc)/&Dgr;Hm]≧0.7 (II):
摘要翻译：提供一种制造三维印刷电路板的有效方法，其中导体箔可以在相对低的温度下可靠地热熔到板上，并且可以再现模具的凸和凹的三维形状精确地没有残余应力。该方法包括提供一种薄膜绝缘体的步骤，该薄膜绝缘体包含含有65-35重量％的结晶熔融峰值温度为260℃或更高的聚芳基酮树脂的热塑性树脂组合物， 65重量％的无定形聚醚酰亚胺树脂，并且当在膜绝缘构件的一面或两面上叠加导体箔的150-230℃的差示扫描热量测量的温度升高时测量的玻璃化转变温度，热量使导体箔使热塑性树脂组合物满足结晶熔融热量DELTA Hm与结晶热量DELTA Hc之间的关系，如由下式（I）表示，蚀刻导体箔以形成导体电路，并且使得三维获得的印刷线路电路变形。

10. 发明授权

US06274821B1 Shock-resistive printed circuit board and electronic device including the same 有权
标题翻译：抗冲击印刷电路板和包括它的电子设备
公开(公告)号：US06274821B1
公开(公告)日：2001-08-14
申请号：US09396426
申请日：1999-09-15
申请人： Masashi Echigo , Kaoru Nomoto , Masayuki Aoyama , Tadao Suzuki
发明人： Masashi Echigo , Kaoru Nomoto , Masayuki Aoyama , Tadao Suzuki
IPC分类号： H05K103
CPC分类号： H05K3/465 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K1/0271 , H05K1/113 , H05K3/28 , H05K3/285 , H05K3/4644 , H05K3/4676 , H05K3/4688 , H05K2201/0133 , Y10S428/901 , H01L2924/00
摘要： A printed circuit board has a layer including a resin material, which has a tensile breaking strain of approximately 1% or more at a tensile strain rate of 40%/sec at 25° C., and an Izod impact strength of approximately 1 kgf·cm/cm or more at 25° C. Otherwise, the resin material has a peak value of dynamic loss tangent of 0.05 or more in a range of −100° C. to −50° C. by &bgr; relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0° C. to 100° C. by &bgr;′ relaxation in a dynamic viscoelasticity spectral measurement. Accordingly, thermal shock resistance and drop shock resistance of the printed circuit board can be improved.
摘要翻译：印刷电路板具有包括树脂材料的层，其在25℃的拉伸应变速率为40％/秒，拉伸断裂应变为约1％以上，艾佐德冲击强度为约1kgf。 cm 2以上，另外，通过β弛豫，树脂材料在-100℃〜-50℃的范围内具有0.05以上的动态损耗角正切峰值，峰值在动态粘弹性光谱测量中通过β'松弛在0℃至100℃的范围内的0.02或更大的动态损耗角正切。因此，可以提高印刷电路板的耐热冲击性和耐跌落冲击性。

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