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    • 1. 发明申请
    • Insulated gate bipolar transistor
    • 绝缘栅双极晶体管
    • US20050045945A1
    • 2005-03-03
    • US10839791
    • 2004-05-05
    • Koh YoshikawaKatsunori UenoHiroshi Kanemaru
    • Koh YoshikawaKatsunori UenoHiroshi Kanemaru
    • H01L29/78H01L21/76H01L27/04H01L29/417H01L29/739H01L29/76
    • H01L29/41741H01L29/7397
    • An IGBT having a trench gate structure is disclosed which generates decreased noise at switching and displays superiority in saturation voltage to turn-off loss characteristics (trade-off characteristics). In a part of a region on an emitter side surface interposed between trench gates, a sub well region is provided, which is connected to an emitter electrode through diodes. When the IGBT is in a turned-on state, the diodes are brought into a non-conduction state to isolate the sub well region from the emitter electrode, by which carriers are accumulated. When the IGBT is in a turned-off state, the diodes are brought into a conduction state to electrically connect the sub well region to the emitter electrode, by which carriers are discharged at a high speed. In an early stage of turning-on of the IGBT, capacitance of a portion of the gate facing the sub well region is converted to gate-emitter capacitance to thereby reduce gate-collector capacitance, by which electromagnetic noise at switching is reduced.
    • 公开了具有沟槽栅极结构的IGBT,其在开关时产生降低的噪声,并且将饱和电压的优越性显示为关断损耗特性(权衡特性)。 在介于沟槽栅极之间的发射极侧表面的区域的一部分中,设置有通过二极管连接到发射极的子阱区域。 当IGBT处于导通状态时,二极管进入非导通状态,以将子阱区域与发射极隔离,由此累积载流子。 当IGBT处于关断状态时,二极管进入导通状态,以将子阱区域电连接到发射极电极,载流子以高速放电。 在IGBT的导通的早期阶段,面向子阱区域的栅极的一部分的电容被转换为栅极 - 发射极电容,从而减小栅极 - 集电极电容,由此降低开关中的电磁噪声。
    • 2. 发明授权
    • Insulated gate bipolar transistor
    • 绝缘栅双极晶体管
    • US07098488B2
    • 2006-08-29
    • US10839791
    • 2004-05-05
    • Koh YoshikawaKatsunori UenoHiroshi Kanemaru
    • Koh YoshikawaKatsunori UenoHiroshi Kanemaru
    • H01L29/73
    • H01L29/41741H01L29/7397
    • An IGBT having a trench gate structure is disclosed which generates decreased noise at switching and displays superiority in saturation voltage to turn-off loss characteristics (trade-off characteristics). In a part of a region on an emitter side surface interposed between trench gates, a sub well region is provided, which is connected to an emitter electrode through diodes. When the IGBT is in a turned-on state, the diodes are brought into a non-conduction state to isolate the sub well region from the emitter electrode, by which carriers are accumulated. When the IGBT is in a turned-off state, the diodes are brought into a conduction state to electrically connect the sub well region to the emitter electrode, by which carriers are discharged at a high speed. In an early stage of turning-on of the IGBT, capacitance of a portion of the gate facing the sub well region is converted to gate-emitter capacitance to thereby reduce gate-collector capacitance, by which electromagnetic noise at switching is reduced.
    • 公开了具有沟槽栅极结构的IGBT,其在开关时产生降低的噪声,并且将饱和电压的优越性显示为关断损耗特性(权衡特性)。 在介于沟槽栅极之间的发射极侧表面的区域的一部分中,设置有通过二极管连接到发射极的子阱区域。 当IGBT处于导通状态时,二极管进入非导通状态,以将子阱区域与发射极隔离,由此累积载流子。 当IGBT处于关断状态时,二极管进入导通状态,以将子阱区域电连接到发射极电极,载流子以高速放电。 在IGBT的导通的早期阶段,面向子阱区域的栅极的一部分的电容被转换为栅极 - 发射极电容,从而减小栅极 - 集电极电容,由此降低开关中的电磁噪声。
    • 4. 发明授权
    • Semiconductor device exhibiting withstand voltages in the forward and reverse directions
    • 在正向和反向方向表现出耐受电压的半导体器件
    • US08334581B2
    • 2012-12-18
    • US12975650
    • 2010-12-22
    • Koh Yoshikawa
    • Koh Yoshikawa
    • H01L27/082H01L27/102
    • H01L29/7395H01L29/0619H01L29/404
    • A semiconductor device according to embodiments of the invention includes an n−-type drift region; a p-type base region formed selectively in the surface portion of the drift region; an n+-type emitter region and a p+-type body region, both formed selectively in the surface portion of base region; and an n-type shell region between the drift region and the base region, a shell region surrounding the entire region below base region. The shell region is doped more heavily than the drift region. The shell region contains an n-type impurity at an effective impurity amount of 8.0×1011 cm −2 or smaller. A drift region exhibits a resistivity low enough to prevent the depletion layer expanding from collector region, formed on the back surface of the drift region, toward a shell region from reaching the shell region.
    • 根据本发明的实施例的半导体器件包括n型漂移区; 选择性地形成在漂移区域的表面部分中的p型基极区域; n +型发射极区域和p +型体区域,均选择性地形成在基极区域的表面部分中; 以及漂移区域和基极区域之间的n型壳体区域,围绕在基底区域下方的整个区域的壳体区域。 壳体区域比漂移区域更重掺杂。 外壳区域包含有效杂质量为8.0×10 11 cm -2以下的n型杂质。 漂移区域具有足够低的电阻率,以防止耗尽层从形成在漂移区域的背面上的集电极区域朝向壳体区域到达壳体区域扩展。
    • 6. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07943991B2
    • 2011-05-17
    • US11614515
    • 2006-12-21
    • Koh Yoshikawa
    • Koh Yoshikawa
    • H01L29/94
    • H01L29/7813H01L29/0634H01L29/0865H01L29/1095H01L29/4236H01L29/66734
    • A semiconductor device is discloses that includes an n-type semiconductor substrate; an alternating conductivity type layer on semiconductor substrate, the alternating conductivity type layer including n-type drift regions and p-type partition regions arranged alternately; p-type channel regions on the alternating conductivity type layer; and trenches formed from the surfaces of the p-type channel regions down to respective n-type drift regions. The bottom of each trench is over the pn-junction between the p-type partition region and the n-type drift region. The semiconductor device facilitates preventing the on-resistance from increasing, obtaining a higher breakdown voltage, and reducing the variations caused in the characteristics thereof.
    • 公开了一种半导体器件,其包括n型半导体衬底; 在半导体衬底上的交替导电型层,交替导电型层包括交替布置的n型漂移区和p型隔离区; 交替导电型层上的p型沟道区; 以及从p型沟道区的表面形成到各个n型漂移区的沟槽。 每个沟槽的底部在p型分隔区域和n型漂移区域之间的pn结上方。 半导体器件有助于防止导通电阻增加,获得更高的击穿电压,并减少其特性引起的变化。
    • 10. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08809911B2
    • 2014-08-19
    • US13583666
    • 2011-10-19
    • Koh Yoshikawa
    • Koh Yoshikawa
    • H01L29/66
    • H01L29/7813H01L29/0696H01L29/0865H01L29/0869H01L29/1095H01L29/66734H01L29/7397
    • Plural gate trenches are formed in the surface of an n-type drift region. A gate electrode is formed across a gate oxide film on the inner walls of the gate trenches. P-type base regions are selectively formed so as to neighbor each other in the gate trench longitudinal direction between neighboring gate trenches. An n-type emitter region is formed in contact with the gate trench in a surface layer of the p-type base regions. Also, a p-type contact region with a concentration higher than that of the p-type base region is formed in the surface layer of the p-type base region so as to be in contact with the gate trench side of the n-type emitter region. An edge portion on the gate trench side of the n-type emitter region terminates inside the p-type contact region.
    • 多个栅极沟槽形成在n型漂移区域的表面。 在栅极沟槽的内壁上的栅氧化膜上形成栅电极。 选择性地形成P型基区,以便在相邻栅极沟槽之间的栅极沟槽纵向方向上彼此相邻。 n型发射极区域形成为与p型基极区域的表面层中的栅极沟槽接触。 此外,在p型基极区域的表面层中形成浓度高于p型基极区域的p型接触区域,以与n型基极区域的栅极沟道侧接触 发射区。 n型发射极区域的栅极沟槽侧的边缘部分终止在p型接触区域的内部。