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    • 7. 发明授权
    • Robotically drivable interface mechanism
    • 机器人驱动的接口机制
    • US06290275B1
    • 2001-09-18
    • US09357154
    • 1999-07-19
    • Bernardus Carolus BraamJan Hopman
    • Bernardus Carolus BraamJan Hopman
    • B25J1504
    • B64G1/641B25J15/0019B64G1/222
    • Robotically drivable interface mechanism for coupling to a device and for coupling to an end effector attachable to the end of a robot arm. The interface mechanism having a first coupler to couple with an associated second coupler on the device and a third coupler to couple with an associate fourth coupler on the end effector. The first coupler is connectable to an actuator included in the end effector, when the interface mechanism is coupled to the end effector. The first coupler has at least one first roller for cooperating with the second coupler formed by at least one slot in the device.
    • 机器人可驱动的接口机构,用于联接到设备并且用于联接到可附接到机器人手臂的端部的末端执行器。 所述接口机构具有第一耦合器以耦合到所述装置上的相关联的第二耦合器,以及第三耦合器以与所述端部执行器上的关联第四耦合器耦合。 当接口机构联接到末端执行器时,第一联接器可连接到包括在端部执行器中的致动器。 第一联接器具有至少一个第一辊,用于与由装置中的至少一个槽形成的第二联接件配合。
    • 8. 发明申请
    • LIGHT SENSOR
    • 光传感器
    • US20100230581A1
    • 2010-09-16
    • US12293700
    • 2007-03-26
    • Johannes Adrianus Petrus LeijtensJan Hopman
    • Johannes Adrianus Petrus LeijtensJan Hopman
    • H01L27/144
    • H01L27/14618B64G1/363H01L27/14623H01L31/02024H01L31/0203H01L31/02164H01L2924/0002H01L2924/00
    • Light sensor, comprising a non-translucent layer (1) having a translucent aperture (2), and a sensor array layer (3), comprising an array of op to-electrical sensor elements (3a-d), as well as a translucent solid first carrier layer (4) to which said non-translucent layer is applied at one side and said sensor array layer at the other side. A multitude of such light sensors can be manufactured by taking a first substrate (4) which is suitable as a translucent solid first carrier layer for said multitude of light sensors, applying the non-translucent layers (1) including an aperture (2) in each of them for said multitude of light sensors at one side of the first substrate and applying the sensor array layers (3) for said multitude of light sensors at the other side of the first substrate and, finally, separating the individual light sensors (7a-b). The light sensor may comprise an integrated opto-electric power supply (8, 9).
    • 光传感器,包括具有半透明孔(2)的非半透明层(1)和传感器阵列层(3),所述传感器阵列层(3)包括一组运算电传感器元件(3a-d),以及半透明 固体第一载体层(4),一侧涂有所述非半透明层,另一侧涂敷所述传感器阵列层。 可以通过采用适合作为所述多个光传感器的半透明固体第一载体层的第一基板(4)来制造多个这样的光传感器,将包括孔(2)的非半透明层(1) 它们中的每一个用于在第一基板的一侧处的所述多个光传感器,并且在第一基板的另一侧上施加用于所述多个光传感器的传感器阵列层(3),并且最后将各个光传感器(7a -b)。 光传感器可以包括集成的光电电源(8,9)。