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    • 1. 发明申请
    • Calendar Matching-up Social Network System And Method For Performing The Same
    • 日历配对社交网络系统及其执行方法
    • US20130238701A1
    • 2013-09-12
    • US13460590
    • 2012-04-30
    • Ko-Chung LeePei-Chun ChenHan-Chung Chiang
    • Ko-Chung LeePei-Chun ChenHan-Chung Chiang
    • H04L29/06
    • H04L65/403H04L67/10
    • A calendar matching-up social network system and a method for performing the same are introduced, which do not only periodically gather and join at least one calendared data under various different computerized architectures into a web-based calendar provided from a specified community site for respective member but also actively intermediate and collect registering data of all of the members who have the same or similar specific information as contained in the gathered web-based calendars. Then, the system provides an intermediated message to the web-based calendar of the specified community site with respect to the respective member registering data with the same or similar specific information. This will facilitates establishment of a social relationship among those members having the same or similar specific information to share the specific information via the specified community site.
    • 引入了日历匹配社交网络系统及其执行方法,其不仅周期性地将各种不同的计算机化结构下的至少一个日历数据收集并加入由指定的社区站点提供的基于web的日历中, 成员,但也积极地中介并收集所有与所收集的网络日历中包含的具有相同或相似的具体信息的成员的数据。 然后,该系统相对于具有相同或类似特定信息的相应成员注册数据向指定社区站点的基于web的日历提供中间消息。 这将有助于在具有相同或相似的具体信息的成员之间建立社会关系,以通过指定的社区网站分享具体信息。
    • 4. 发明申请
    • RFID testing system
    • RFID测试系统
    • US20060208079A1
    • 2006-09-21
    • US11132219
    • 2005-05-19
    • Wei ChangChun-Te YuSheng-Pi WangShih-Lin ChenPei-Chun ChenRita Chang
    • Wei ChangChun-Te YuSheng-Pi WangShih-Lin ChenPei-Chun ChenRita Chang
    • G06K7/08
    • G06K7/0008
    • The present invention discloses a RFID testing system, comprising an object-under-test having a RFID tag attached thereto, a RFID reader and a tester. Wherein, the tester further comprises: a base; a bar-shaped first rail, mounted on the base in a stationary manner; a bar-shaped second rail, perpendicularly and slidably mounted on the first rail for enabling the second rail to move linearly along the first rail; a bar-shaped third rail, slidably mounted on the second rail and disposed perpendicular to the first and the second rails for enabling the third rail to move linearly along the second rail; and a clamping device, slidably mounted on the third rail for enabling the clamping device to move linearly along the third rail.
    • 本发明公开了一种RFID测试系统,包括附着有RFID标签的被测对象物,RFID读取器和测试器。 其中,测试器还包括:基座; 一个条形的第一轨道,以固定的方式安装在基座上; 一个条形的第二轨道,其垂直和可滑动地安装在第一轨道上,以使得第二轨道能够沿着第一轨道线性移动; 一个条形的第三轨道,可滑动地安装在第二轨道上并且垂直于第一和第二轨道设置,以使得第三轨道能够沿着第二轨道线性移动; 以及夹紧装置,可滑动地安装在第三导轨上,以使夹紧装置能够沿第三导轨线性移动。
    • 5. 发明授权
    • Silicon chip having through via and method for making the same
    • 具有通孔的硅芯片及其制造方法
    • US08263493B2
    • 2012-09-11
    • US12647856
    • 2009-12-28
    • Hsueh-An YangPei-Chun ChenChien-Hua Chen
    • Hsueh-An YangPei-Chun ChenChien-Hua Chen
    • H01L21/4763H01L21/44
    • H01L21/76898
    • The present invention relates to a silicon chip having a through via and a method for making the same. The silicon chip includes a silicon substrate, a passivation layer, at least one electrical device and at least one through via. The passivation layer is disposed on a first surface of the silicon substrate. The electrical device is disposed in the silicon substrate, and exposed to a second surface of the silicon substrate. The through via includes a barrier layer and a conductor, and penetrates the silicon substrate and the passivation layer. A first end of the through via is exposed to the surface of the passivation layer, and a second end of the through via connects the electrical device. When a redistribution layer is formed on the surface of the passivation layer, the redistribution layer will not contact the silicon substrate, thus avoiding a short circuit. Therefore, a lower resolution process can be used, which results in low manufacturing cost and simple manufacturing process.
    • 本发明涉及具有贯通孔的硅芯片及其制造方法。 硅芯片包括硅衬底,钝化层,至少一个电器件和至少一个通孔。 钝化层设置在硅衬底的第一表面上。 电气设备设置在硅衬底中,并暴露于硅衬底的第二表面。 通孔包括阻挡层和导体,并且穿透硅衬底和钝化层。 通孔的第一端暴露于钝化层的表面,通孔的第二端连接电气装置。 当在钝化层的表面上形成再分布层时,再分布层将不会接触硅衬底,从而避免短路。 因此,可以使用较低分辨率的工艺,这导致制造成本低和制造工艺简单。