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    • 2. 发明授权
    • Method of fabricating non-volatile memory structure
    • 制造非易失性存储器结构的方法
    • US07235444B1
    • 2007-06-26
    • US11620724
    • 2007-01-07
    • Liang-Chuan LaiPin-Yao Wang
    • Liang-Chuan LaiPin-Yao Wang
    • H01L21/8247
    • H01L27/115H01L27/11526H01L27/11529
    • A substrate having a first dielectric layer, a first conductive layer and a second dielectric layer thereon is provided. A part of the second dielectric layer is removed to form a first opening having both ends with a select gate region respectively. The select gate region is constituted by a region with the second dielectric layer and a region without the second dielectric layer. A second conductive layer is formed to cover the second dielectric layer. A cap layer is formed on the second conductive layer. The cap layer, the second conductive layer, the second dielectric layer and the first conductive layer are patterned to form gate structures. The cap layer, the second conductive layer, the second dielectric layer and the first conductive layer between two adjacent select gate regions are removed to form a select gate structure. A doped region is formed in the substrate.
    • 提供了具有第一介电层,第一导电层和第二介电层的基板。 去除第二电介质层的一部分以形成分别具有选择栅极区域的两端的第一开口。 选择栅极区域由具有第二电介质层的区域和没有第二电介质层的区域构成。 形成第二导电层以覆盖第二介电层。 在第二导电层上形成盖层。 将盖层,第二导电层,第二介电层和第一导电层图案化以形成栅极结构。 除去两个相邻的选择栅区之间的覆盖层,第二导电层,第二介电层和第一导电层,以形成选择栅结构。 在衬底中形成掺杂区域。
    • 4. 发明申请
    • NON-VOLATILE MEMORY AND METHOD OF FABRICATING THE SAME
    • 非易失性存储器及其制造方法
    • US20060211204A1
    • 2006-09-21
    • US11163858
    • 2005-11-01
    • Min-San HuangDah-Chuan ChenLiang-Chuan Lai
    • Min-San HuangDah-Chuan ChenLiang-Chuan Lai
    • H01L21/336
    • H01L29/7881H01L29/40114H01L29/66825
    • A method for fabricating a non-volatile memory is disclosed. First, a semiconductor device is formed in a substrate, and the top of the semiconductor device is higher than the surface of the substrate. Then, a first dielectric layer is formed on the substrate, and the first dielectric layer covers the semiconductor device and the substrate. A portion of the first dielectric layer is removed so as to retain a portion of the first dielectric layer on the sidewall of the semiconductor device and the substrate. Afterwards, a second dielectric layer and a conductive layer are sequentially formed on the substrate, and a corresponding pair of mask spacers is formed on the conductive layer disposed on the sidewall of the semiconductor device. Finally, the mask spacers are used as an etching mask to continuously etch a portion of the conductive layer until the surface of the second dielectric layer is exposed.
    • 公开了一种用于制造非易失性存储器的方法。 首先,在衬底中形成半导体器件,并且半导体器件的顶部高于衬底的表面。 然后,在基板上形成第一电介质层,第一电介质层覆盖半导体器件和基板。 去除第一电介质层的一部分,以便将第一电介质层的一部分保持在半导体器件和衬底的侧壁上。 之后,在衬底上依次形成第二电介质层和导电层,并且在设置在半导体器件的侧壁上的导电层上形成相应的一对掩模间隔物。 最后,将掩模间隔物用作蚀刻掩模,以连续蚀刻导电层的一部分,直到第二介电层的表面露出。
    • 7. 发明申请
    • MEMORY AND METHOD FOR FABRICATING THE SAME
    • 用于制造它的记忆和方法
    • US20090026525A1
    • 2009-01-29
    • US11872723
    • 2007-10-16
    • Pin-Yao WangLiang-Chuan LaiMichael Ying-li Liu
    • Pin-Yao WangLiang-Chuan LaiMichael Ying-li Liu
    • H01L29/788H01L21/44
    • H01L29/42324H01L27/115H01L27/11521
    • A method for fabricating a memory is provided. A tunneling dielectric layer, a first conductive layer, and a mask layer are formed on a substrate. The mask layer, the first conductive layer, the tunneling dielectric layer, and the substrate are patterned to form trenches in the substrate. A passivation layer and isolation structures are formed in sequence to fill the trenches, and the etching rate of the isolation structures is greater than that of the passivation layer. After the mask layer is removed, a second conductive layer is formed on the first conductive layer. Portions of the isolation structures are removed to expose the sidewalls of the first and the second conductive layers. Further, a third conductive layer is formed on the exposed sidewalls of the first and the second conductive layers. An inter-gate dielectric layer and a control gate are formed on the substrate.
    • 提供了一种用于制造存储器的方法。 在衬底上形成隧道电介质层,第一导电层和掩模层。 图案化掩模层,第一导电层,隧道电介质层和衬底,以在衬底中形成沟槽。 顺序地形成钝化层和隔离结构以填充沟槽,并且隔离结构的蚀刻速率大于钝化层的蚀刻速率。 在去除掩模层之后,在第一导电层上形成第二导电层。 去除部分隔离结构以露出​​第一和第二导电层的侧壁。 此外,第三导电层形成在第一和第二导电层的暴露的侧壁上。 栅极间介质层和控制栅极形成在衬底上。
    • 8. 发明授权
    • Non-volatile memory structure
    • 非易失性存储器结构
    • US07183607B1
    • 2007-02-27
    • US11308621
    • 2006-04-13
    • Liang-Chuan LaiPin-Yao Wang
    • Liang-Chuan LaiPin-Yao Wang
    • H01L29/788
    • H01L27/115H01L27/11526H01L27/11529
    • A non-volatile memory structure including a substrate, a first memory cell row, a first source/drain region, and a second source/drain region is described. The first memory cell row is disposed on the substrate and includes a plurality of memory cells, two select gate structures, and a plurality of doped regions. The select gate structures are respectively disposed on the substrate at one side of the outmost memory cell among the memory cells, and the select gates have a tapered corner at one side far from the memory cells. The doped regions are respectively disposed in the substrate between two memory cells as well as in the substrate between the memory cells and the select gate structures. The first and the second source/drain regions are respectively disposed in the substrate at both sides of the first memory cell row.
    • 描述了包括衬底,第一存储单元行,第一源极/漏极区域和第二源极/漏极区域的非易失性存储器结构。 第一存储单元行设置在基板上,并且包括多个存储单元,两个选择栅极结构和多个掺杂区域。 选择栅极结构分别设置在存储单元中最外层存储单元的一侧的衬底上,并且选择栅极在远离存储单元的一侧具有锥形角。 掺杂区域分别设置在两个存储单元之间的衬底中以及存储单元和选择栅极结构之间的衬底中。 第一和第二源极/漏极区域分别设置在第一存储单元行的两侧的衬底中。