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1. 发明授权

US06953384B2 Electronic component chip feeder and manufacturing method of electronic devices using electronic component chips 失效
标题翻译：电子元件芯片馈线和使用电子元件芯片的电子器件的制造方法
公开(公告)号：US06953384B2
公开(公告)日：2005-10-11
申请号：US09988675
申请日：2001-11-20
申请人： Kiyoyuki Nakagawa , Kenichi Fukuda
发明人： Kiyoyuki Nakagawa , Kenichi Fukuda
IPC分类号： B08B3/04 , B24B21/04 , B65G47/14 , H05K13/02 , B24B1/00
CPC分类号： H05K13/028 , B24B21/04
摘要： An electronic component chip feeder enabling to feed electronic component chips in which electrodes on the outer surfaces thereof can be cleanly maintained and the reliability of electrical connections is excellent even when miniaturizing thereof is promoted, and a method for manufacturing electronic devices by using electronic component chips being excellent in the reliability of electrical connections are provided. The electronic component chip feeder for feeding electronic component chips includes a cleaning device disposed in an intermediate portion of a supplying system for supplying plural electronic component chips in an aligned relationship for cleaning outer surfaces of the electronic component chips.
摘要翻译：一种电子元件芯片馈电器，其能够馈送其外表面上的电极可以被清洁地保持的电子元件芯片，并且即使促进其小型化，电连接的可靠性也是优异的，以及通过使用电子元件芯片来制造电子器件的方法提供了电连接的可靠性优异。用于馈送电子元件芯片的电子元件芯片馈送器包括设置在用于以清洁电子元件芯片的外表面的排列关系提供多个电子元件芯片的供电系统的中间部分中的清洁装置。

2. 发明授权

US06234298B1 Feeder for electronic chip components 有权
标题翻译：馈线用于电子芯片组件
公开(公告)号：US06234298B1
公开(公告)日：2001-05-22
申请号：US09271320
申请日：1999-03-18
申请人： Kiyoyuki Nakagawa , Kenichi Fukuda , Isamu Utsunomiya
发明人： Kiyoyuki Nakagawa , Kenichi Fukuda , Isamu Utsunomiya
IPC分类号： B65G4744
CPC分类号： H05K13/028 , B65G47/145 , B65G47/1457
摘要： A feeder for electronic chip components is provided having an aligning path forming member agitating electronic chip components which are to be discharged from a discharge opening of a hopper for accommodating a plurality of electronic chip components. The agitation is achieved by reciprocating the aligning path forming member in the axis direction of the discharge opening and forming a tubular aligning path which receives only the electronic chip components aligned in a predetermined direction therein. When the aligning path forming member reciprocates it also rotates around its axis. This results in an increased agitating effect on electronic chip components for guiding them into the aligning path.
摘要翻译：提供了一种用于电子芯片部件的馈线，具有对准路径形成部件，搅动将从用于容纳多个电子芯片部件的料斗的排出口排出的电子芯片部件。搅拌是通过使排出路径形成构件在排出口的轴线方向上往复运动而形成一个管状排列路径来实现的，所述管状排列路径只接收沿预定方向排列的电子芯片部件。当对准路径形成构件往复运动时，其也绕其轴线旋转。这导致对电子芯片部件的搅拌效果增加，以将它们引导到对准路径中。

3. 发明授权

US06267223B1 Feeder for electronic chip components 失效
标题翻译：馈线用于电子芯片组件
公开(公告)号：US06267223B1
公开(公告)日：2001-07-31
申请号：US09271321
申请日：1999-03-18
申请人： Kiyoyuki Nakagawa , Kenichi Fukuda , Isamu Utsunomiya
发明人： Kiyoyuki Nakagawa , Kenichi Fukuda , Isamu Utsunomiya
IPC分类号： B65G4714
CPC分类号： B65G47/1407
摘要： At least one partition wall is disposed in a hopper of a feeder for feeding electronic chip components. The at least one partition wall reduces the potential for damage to the components due to the reciprocating movement of a movable pipe disposed on the bottom of the hopper for agitating the electronic chip components. The reduced potential of degradation allows more electronic chip components to be accommodated in the hopper.
摘要翻译：至少一个分隔壁设置在用于馈送电子芯片部件的馈线的漏斗中。至少一个分隔壁由于设置在料斗的底部的可动管的往复运动而减小了对部件的损坏的可能性，用于搅动电子部件。降低的降解电位允许更多的电子芯片部件容纳在料斗中。

4. 发明授权

US06619467B1 Component feeder apparatus and method 有权
标题翻译：组件供料装置及方法
公开(公告)号：US06619467B1
公开(公告)日：2003-09-16
申请号：US09287135
申请日：1999-04-07
申请人： Kiyoyuki Nakagawa , Kenichi Fukuda , Isamu Utsunomiya
发明人： Kiyoyuki Nakagawa , Kenichi Fukuda , Isamu Utsunomiya
IPC分类号： H05K1302
CPC分类号： H05K13/028
摘要： A feeder for feeding electronic chip components includes a hopper having a discharge opening at its bottom and having and an aligning path forming member for agitating electronic chip components. The aligning path forming member agitates the electronic chip components by its reciprocating movement within the discharge opening of the hopper. The reciprocating stroke of the aligning path forming member can be varied, and the stroke is controlled to be shorter when the number of electronic chip components remaining in the hopper is reduced. This allows the electronic chip components to be guided more reliably into an aligning path formed by the aligning path forming member, regardless of the number of electronic chip components remaining in the hopper.
摘要翻译：用于馈送电子芯片部件的馈线包括在其底部具有排放开口的料斗，并具有用于搅拌电子芯片部件的对准通路形成部件。对准路径形成构件通过在料斗的排出口内的往复运动来搅动电子芯片部件。可以改变对准路径形成构件的往复行程，并且当剩余在料斗中的电子芯片部件的数量减少时，行程被控制得更短。这允许将电子芯片部件更可靠地引导到由对准路径形成部件形成的对准路径中，而与料斗中剩余的电子芯片部件的数量无关。

5. 发明授权

US06336843B2 Electronic component chip feeder and manufacturing method of electronic devices using electronic component chips 有权
标题翻译：电子元件芯片馈线和使用电子元件芯片的电子器件的制造方法
公开(公告)号：US06336843B2
公开(公告)日：2002-01-08
申请号：US09401526
申请日：1999-09-22
申请人： Kiyoyuki Nakagawa , Kenichi Fukuda
发明人： Kiyoyuki Nakagawa , Kenichi Fukuda
IPC分类号： B24B706
CPC分类号： H05K13/028 , B24B21/04
摘要： An electronic component chip feeder enabling to feed electronic component chips in which electrodes on the outer surfaces thereof can be cleanly maintained and the reliability of electrical connections is excellent even when miniaturizing thereof is promoted, and a method for manufacturing electronic devices by using electronic component chips being excellent in the reliability of electrical connections are provided. The electronic component chip feeder for feeding electronic component chips includes a cleaning device disposed in an intermediate portion of a supplying system for supplying plural electronic component chips in an aligned relationship for cleaning outer surfaces of the electronic component chips.
摘要翻译：一种电子元件芯片馈电器，其能够馈送其外表面上的电极可以被清洁地保持的电子元件芯片，并且即使促进其小型化，电连接的可靠性也是优异的，以及通过使用电子元件芯片来制造电子器件的方法提供了电连接的可靠性优异。用于馈送电子元件芯片的电子元件芯片馈送器包括设置在用于以清洁电子元件芯片的外表面的排列关系提供多个电子元件芯片的供电系统的中间部分中的清洁装置。

6. 发明授权

US06340088B1 Storage container for electronic components 有权
标题翻译：电子元件储存容器
公开(公告)号：US06340088B1
公开(公告)日：2002-01-22
申请号：US09345730
申请日：1999-07-01
申请人： Akira Mouri , Kiyoyuki Nakagawa , Kenichi Fukuda
发明人： Akira Mouri , Kiyoyuki Nakagawa , Kenichi Fukuda
IPC分类号： B65D8500
CPC分类号： B65D75/566 , B65D75/5805 , B65D75/5816 , B65D75/5822 , B65D2575/565 , H05K13/0084
摘要： Electronic components can be reliably supplied from a storage container for electronic components, which is easy to manufacture and highly economical, to a mounting device. The storage container for electronic components includes a storage region, in which electronic components are stored, a discharge hole, a lead portion for leading the electronic components to the discharge hole, the end of the lead portion becoming the discharge hole, a discharge hole side lead portion, provided with a taper (guide angle) so that its width becomes narrower toward the discharge hole, and a storage region side lead portion, positioned between the storage region and the discharge hole side lead portion, and provided with a taper (guide angle) so that its width becomes narrower toward the discharge hole side lead portion. In addition, the taper (guide angle) of the storage region side lead portion may be larger than the taper (guide angle) of the discharge hole side lead portion.
摘要翻译：电子部件能够从容易制造且高度经济的用于电子部件的存储容器可靠地供给到安装装置。电子部件用存储容器包括存储有电子部件的存储区域，排出孔，将电子部件引导到排出孔的引导部，引导部的端部成为排出孔，排出孔侧引导部分，其具有锥形（引导角），使得其宽度朝向排出孔变窄;以及存储区域侧引线部分，位于存储区域和排出孔侧引线部分之间，并且设置有锥形（引导件）角度）使得其宽度朝向排出孔侧引线部分变窄。此外，存储区域侧引线部分的锥度（引导角）可以大于排出孔侧引线部分的锥度（引导角）。

7. 发明授权

US08164269B2 Discharge lamp lighting device and lighting fixture 有权
标题翻译：放电灯照明装置和照明灯具
公开(公告)号：US08164269B2
公开(公告)日：2012-04-24
申请号：US12438582
申请日：2007-07-23
申请人： Kenichi Fukuda , Nobutoshi Matsuzaki
发明人： Kenichi Fukuda , Nobutoshi Matsuzaki
IPC分类号： H05B41/16
CPC分类号： H05B41/386 , H05B41/2928 , H05B41/388 , Y02B20/204
摘要： One output power characteristic curve for supplying constant power is provided with respect to a raging voltage range of a discharge lamp, and in addition, a plurality of output power characteristic curves W1, W2 and W3 are provided with respect to a lamp voltage before the rating voltage range. There is provided minimum lamp voltage detecting means for detecting a minimum lamp voltage after a high intensity discharge lamp shifts to an arc discharge in an event where lamp power is supplied to a high intensity discharge lamp based on any initially set output power characteristic curve after the high intensity discharge lamp is started. As the minimum lamp voltage detected by the minimum lamp voltage detecting means is larger in a predetermined minimum lamp voltage range, any larger output power characteristic curve is reset from the plurality of output power characteristic curves W1, W2 and W3, and subsequent power control is performed.
摘要翻译：针对放电灯的炽热电压范围提供一个用于提供恒定功率的输出功率特性曲线，此外，相对于额定值之前的灯电压设置多个输出功率特性曲线W1，W2和W3 电压范围提供了最低灯电压检测装置，用于在高强度放电灯转换到电弧放电之后检测灯电压的最小值，在灯功率被提供给高强度放电灯的情况下，基于任何初始设定的输出功率特性曲线高亮度放电灯启动。由于最小灯电压检测装置检测出的最小灯电压在预定的最小灯电压范围内较大，因此，从多个输出功率特性曲线W1，W2和W3中复位更大的输出功率特性曲线，随后的功率控制为执行。

8. 发明申请

US20120081635A1 Light diffusing film, polarizing plate, liquid crystal display device and production method of light diffusing film 有权
标题翻译：光漫射膜，偏光板，液晶显示装置及光漫射膜的制造方法
公开(公告)号：US20120081635A1
公开(公告)日：2012-04-05
申请号：US13200707
申请日：2011-09-29
申请人： Kenichi Fukuda , Jun Watanabe , Yusuke Ohashi
发明人： Kenichi Fukuda , Jun Watanabe , Yusuke Ohashi
IPC分类号： G02F1/13357 , B29D11/00 , G02B5/02
CPC分类号： B29D11/00798 , G02B1/105 , G02B1/14 , G02B5/0242 , G02B5/3025 , G02F2001/133607
摘要： A light diffusing film contains a thermoplastic resin as the main component and contains, in the thermoplastic resin, at least one kind of a light-transmitting particle having an average primary particle diameter of 3 to 10 μm, wherein the absolute value of the refractive index difference between the thermoplastic resin and the light-transmitting particle is from 0.01 to 0.06, wherein one surface has concavoconvex shape, the total haze value is from 15 to 30%, the internal haze value is from 5 to 25%, the surface haze value is from 5 to 20%, and the average film thickness is from 20 to 200 μm.
摘要翻译：光漫射膜含有热塑性树脂作为主要成分，在热塑性树脂中含有平均一次粒径为3〜10μm的透光性粒子的至少一种，折射率的绝对值热塑性树脂和透光性颗粒之间的差为0.01〜0.06，其中一个表面具有凹凸形状，总雾度值为15〜30％，内部雾度值为5〜25％，表面雾度值为5〜20％，平均膜厚为20〜200μm。

9. 发明申请

US20100027116A1 ANTIGLARE FILM, POLARIZING PLATE, AND IMAGE DISPLAY DEVICE 有权
标题翻译：防透膜，极化板和图像显示装置
公开(公告)号：US20100027116A1
公开(公告)日：2010-02-04
申请号：US12512608
申请日：2009-07-30
申请人： Shuntaro IBUKI , Kenichi Fukuda , Hiroyuki Yoneyama , Tokuju Oikawa
发明人： Shuntaro IBUKI , Kenichi Fukuda , Hiroyuki Yoneyama , Tokuju Oikawa
IPC分类号： G02B27/28 , G02B27/00
CPC分类号： G02B5/0294 , G02B1/105 , G02B1/14 , G02B5/0226 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/26
摘要： An antiglare film is provided, the antiglare film including a transparent plastic film substrate; an antiglare layer having fine recesses and projections on the surface thereof; and an abrasion resistant layer provided at an uppermost surface of the antiglare film, the abrasion resistant layer having an average film thickness of from 0.03 to 0.4 μm, wherein the abrasion resistant layer is formed from a curable composition containing at least following components (A), (B), and (C): (A) an inorganic fine particle containing silicon oxide as a main component and having an average particle size of from 1 to 300 nm; (B) an ionizing radiation-curable resin; and (C) a polymer thickener.
摘要翻译：提供防眩膜，防眩膜包括透明塑料膜基材; 防眩层，其表面上具有细小的凹凸; 以及设置在所述防眩膜的最上表面的耐磨层，所述耐磨层的平均膜厚度为0.03〜0.4μm，其中，所述耐磨层由至少含有以下成分（A）的固化性组合物形成，，（B）和（C）：（A）以氧化硅为主要成分，平均粒径为1〜300nm的无机细粒; （B）电离辐射固化树脂; 和（C）聚合物增稠剂。

10. 发明申请

US20090130318A1 METHOD FOR BONDING POLYAMIDE RESIN AND FLUOROELASTOMER 审中-公开
标题翻译：用于粘结聚酰胺树脂和氟橡胶的方法
公开(公告)号：US20090130318A1
公开(公告)日：2009-05-21
申请号：US12265328
申请日：2008-11-05
申请人： Mikio Shiono , Kenichi Fukuda , Shinichi Sato
发明人： Mikio Shiono , Kenichi Fukuda , Shinichi Sato
IPC分类号： B05D3/02
CPC分类号： C09J5/02 , C08J5/122 , C08J2327/12 , C08J2377/00 , C09J2421/008 , C09J2427/008 , C09J2477/008
摘要： A bond between fluoroelastomer and polyamide resin is established by applying a silane-based primer composition to a surface of polyamide resin, heat treating at 100-200° C., applying a liquid fluoroelastomer composition to the primer coat at room temperature to 100° C., and heat curing at 100-200° C. for bonding the fluoroelastomer to the polyamide resin. The bond between fluoroelastomer and polyamide resin is maintained over a long period of time even in transmission oils.
摘要翻译：通过将硅烷类底漆组合物涂布在聚酰胺树脂的表面上，在100〜200℃下进行热处理，将液态含氟弹性体组合物在室温〜100℃下涂布在底涂层上，建立了含氟弹性体和聚酰胺树脂之间的键并在100-200℃下热固化，以将含氟弹性体粘合到聚酰胺树脂上。含氟弹性体和聚酰胺树脂之间的粘合剂即使在变速箱油中也能长期保持。

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