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    • 8. 发明申请
    • WAFER PROBER AND FAILURE ANALYSIS METHOD USING THE SAME
    • 使用该方法的波形探测器和故障分析方法
    • US20110115513A1
    • 2011-05-19
    • US12796177
    • 2010-06-08
    • Tamotsu Harada
    • Tamotsu Harada
    • G01R31/02G01R31/20G01R1/067
    • G01R31/2891G01R31/311
    • According to one embodiment, a wafer prober for conducting a backside analysis on a wafer is provided. The wafer prober includes a wafer stage and a movable plate. The wafer stage includes surface and back opposed in a thickness direction, a concave portion provided at the surface which supports the wafer, and a first through hole which passes through a bottom face of the concave portion in the thickness direction in the concave portion. The movable plate is accommodated in the concave portion of the wafer stage. The movable plate is movable in a direction parallel to a top face of the wafer stage. The movable plate has a thickness equivalent to a depth of the concave portion of the wafer stage. The movable plate has a second through hole. The second through hole passes through the movable plate in a thickness direction. The second through hole is smaller than the first through hole. The second through hole communicates with the first through hole.
    • 根据一个实施例,提供了用于在晶片上进行背面分析的晶片探测器。 晶片探测器包括晶片台和可动板。 晶片载台包括在厚度方向上的表面和背面相对,设置在支撑晶片的表面处的凹部,以及在凹部中穿过凹部的厚度方向的底面的第一通孔。 可移动板容纳在晶片台的凹部中。 可移动板可以在平行于晶片台的顶面的方向上移动。 可移动板的厚度等于晶片台的凹部的深度。 可移动板具有第二通孔。 第二通孔在厚度方向上穿过可动板。 第二通孔比第一通孔小。 第二通孔与第一通孔连通。