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    • 10. 发明授权
    • Semiconductor supporting device
    • 半导体支持装置
    • US6051303A
    • 2000-04-18
    • US122894
    • 1998-07-28
    • Yuji KatsudaKiyoshi ArakiTsuneaki Ohashi
    • Yuji KatsudaKiyoshi ArakiTsuneaki Ohashi
    • B23Q3/15C04B35/581G03F7/20H01L21/683H02N13/00B32B3/24B32B9/00
    • G03F7/70691H01L21/6831Y10T279/23Y10T428/24322Y10T428/24331Y10T428/24339Y10T428/24347
    • A semiconductor-supporting device comprising a substrate made of an aluminum nitride-based ceramic material and having a semiconductor-placing surface, wherein an orientation degree of the aluminum nitride-based ceramic material specified by the following formula is not less than 1.1 and not more than 2.0.Orientation degree=[I'(002)/I'(100)]/[I(002)/I(100)]in which in an X-ray diffraction measurement, I'(002) is a diffraction intensity of a (002) face of the aluminum nitride-based ceramic material when X-rays are irradiated from the semiconductor-placing surface, I'(100) is a diffraction intensity of a (100) face of the aluminum nitride-based ceramic material when X-rays are irradiated from the semiconductor-placing surface, I(002) is a diffraction intensity of the (002) face of the aluminum nitride ceramic according to a JCPDS Card No. 25-1133, and I(100) is a diffraction intensity of the (100) face of the aluminum nitride ceramic according to a JCPDS Card No. 25-1133.
    • 一种半导体支撑装置,包括由氮化铝基陶瓷材料制成并具有半导体放置表面的衬底,其中由下式确定的氮化铝基陶瓷材料的取向度不小于1.1,而不是更大 在其中在X射线衍射测量中,I'(002)是衍射强度(I)(002)/ I'(100)] / [I(002)/ I(100) 当从半导体放置表面照射X射线时,氮化铝基陶瓷材料的(002)面的I'(100)是氮化铝基陶瓷材料的(100)面的衍射强度 当从半导体放置面照射X射线时,I(002)是根据JCPDS卡号25-1133的氮化铝陶瓷的(002)面的衍射强度,I(100)是 根据JCPDS卡号25-1133的氮化铝陶瓷的(100)面的衍射强度。