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    • 2. 发明申请
    • TAPE CARRIER PACKAGE AND DISPLAY DEVICE INCLUDING TAPE CARRIER PACKAGE
    • 胶带包装和显示装置,包括胶带包装
    • US20070126090A1
    • 2007-06-07
    • US11566892
    • 2006-12-05
    • Chihiro SasakiYasuaki Iwata
    • Chihiro SasakiYasuaki Iwata
    • H01L23/495
    • H01L23/4985H01L23/3735H01L2924/0002H05K1/0209H05K1/189H05K2201/09363H05K2201/09781H05K2201/10681H01L2924/00
    • Heat dissipation, is improved, of a semiconductor device on a tape carrier package, in which the number of outputs of the semiconductor device has been increased for implementing a multi-channel configuration and narrower pitches are employed. There are included a tape carrier 20 having lead patterns 21 to 24 formed on a tape base 28 thereof, and a semiconductor device 10 mounted on the tape carrier 20 and having electrode patterns 11 to 14 disposed thereon. The semiconductor device 10 includes heat dissipating electrode patterns 15 to 17 at positions where the heat dissipating electrode patterns 15 to 17 do not interfere with the electrode patterns 11 to 14. The lead patterns 21 to 24 are electrically connected to the corresponding electrode patterns 11 to 14, respectively. On the tape carrier 20, heat dissipation patterns are formed. The heat dissipation patterns are disposed at positions where the heat dissipation patterns do not interfere with the lead patterns 21 to 24 and are also electrically and thermally connected to the corresponding heat dissipating electrode patterns 15 to 17, respectively.
    • 为了实现多通道配置而增加半导体器件的输出数量并且采用更窄的间距,在带载封装上的半导体器件的散热得到改善。 包括形成在其基带28上的引线图案21至24的带状载体20和安装在带载体20上并具有设置在其上的电极图案11至14的半导体器件10。 半导体装置10在散热电极图案15〜17与电极图案11〜14不干涉的位置具有散热电极图案15〜17。 引线图案21至24分别电连接到相应的电极图案11至14。 在带载体20上形成散热图案。 散热图案设置在散热图案不与引线图案21至24干涉的位置处,并且还分别与相应的散热电极图案15至17电连接和热连接。
    • 3. 发明申请
    • COMMUNICATION TERMINAL DEVICE AND CONTENT DATA RECEIVING METHOD
    • 通信终端设备和内容数据接收方法
    • US20120215889A1
    • 2012-08-23
    • US13504059
    • 2010-10-29
    • Yasuaki Iwata
    • Yasuaki Iwata
    • G06F15/16
    • H04N21/4622H04N21/44209H04N21/64761
    • Disclosed is a communication terminal device whereby a user's perception of a wait time can be lessened while missing data portions are downloaded, and whereby the user becomes irritated less. In this device, a broadcast wave receiver (102) receives content data via a broadcast network and an antenna (101). An analysis unit (103) detects the missing portions of the content data and calculates the volume of the missing data portions. On basis of the calculated data volume, a communication unit (108) downloads the missing data portions via an antenna (107) and a communication network other than the broadcast network.
    • 公开了一种通信终端装置,其中可以减少用户对等待时间的感知,同时丢失数据部分被下载,并且由此使得用户变得烦躁不安。 在该装置中,广播波接收器(102)经由广播网络和天线(101)接收内容数据。 分析单元(103)检测内容数据的缺失部分并计算丢失数据部分的音量。 基于所计算的数据量,通信单元(108)经由天线(107)和除广播网络之外的通信网络下载丢失的数据部分。
    • 5. 发明授权
    • Tape carrier package including a heat dissipation element
    • 带载体包括散热元件
    • US07821115B2
    • 2010-10-26
    • US11566892
    • 2006-12-05
    • Chihiro SasakiYasuaki Iwata
    • Chihiro SasakiYasuaki Iwata
    • H01L23/495H01L21/00H01R9/00
    • H01L23/4985H01L23/3735H01L2924/0002H05K1/0209H05K1/189H05K2201/09363H05K2201/09781H05K2201/10681H01L2924/00
    • A semiconductor device on a tape carrier package with improved heat dissipation, as provided. The number of outputs of the semiconductor device has been increased for implementing a multi-channel configuration, and narrower pitches are employed. Included are a tape carrier 20 having lead patterns 21 to 24 formed on a tape base 28 thereof, and a semiconductor device 10 mounted on the tape carrier 20 and having electrode patterns 11 to 14 disposed thereon. The semiconductor device 10 includes heat dissipating electrode patterns 15 to 17 at positions where the heat dissipating electrode patterns 15 to 17 do not interfere with the electrode patterns 11 to 14. The lead patterns 21 to 24 are electrically connected to the corresponding electrode patterns 11 to 14, respectively. On the tape carrier 20, heat dissipation patterns 25 to 27 are formed. The heat dissipation patterns have a surface area broader than that of the lead patterns and have the heat dissipating electrode patterns disposed thereon.
    • 如提供的,具有改善的散热性的带载体封装上的半导体器件。 为了实现多通道配置,已经增加了半导体器件的输出数量,并且采用更窄的间距。 包括形成在其基带28上的引线图案21至24以及安装在带载体20上并具有布置在其上的电极图案11至14的半导体器件10的带状载体20。 半导体装置10在散热电极图案15〜17不与电极图案11〜14不干涉的位置包括散热电极图案15〜17。引线图案21〜24电连接到对应的电极图案11〜 14。 在载带20上形成散热图案25〜27。 散热图案的表面积比引线图案宽,并且散热电极图案设置在其上。